Inventor · disambiguated record
Jack Yao
Also filed as: YAO JACK · YAO JACK M · YAO JACK MONJAY
2 granted patents·4 pending applications·2 citations·filing 1999–2009
38Inventor score
Top patents by PatentIndex Score
6 records- 0152US8225258B2Statistical integrated circuit package modeling for analysis at the early design ageCHEN XIAOMING·Filed 2009·Granted Jul 17, 2012·1 cites·18 claims
- 0238US2010270061A1Floating Metal Elements in a Package SubstrateQUALCOMM INC·Filed 2009·Application pending·0 cites
- 0338US2010263914A1Floating Metal Elements in a Package SubstrateQUALCOMM INC·Filed 2009·Application pending·0 cites
- 0433US2002098600A1System and method for status settings of semiconductor equipment with multi chambersUNITED MICROELECTRONICS CORP·Filed 2001·Application pending·0 cites
- 0532US2002095754A1System and method for status settings of semiconductor equipment with multi chambersUNITED MICROELECTRONICS CORP·Filed 2001·Application pending·0 cites
- 0624US6315834B1Method for removing extraneous matter by using fluorine-containing solutionUTEK SEMICONDUCTOR CORP·Filed 1999·Granted Nov 13, 2001·1 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →