Inventor · disambiguated record
James Zaccardi
Also filed as: ZACCARDI JAMES · ZACCARDI JAMES B
9 granted patents·2 pending applications·974 citations·filing 1994–2022
92Inventor score
Top patents by PatentIndex Score
11 records- 0198US6202297B1Socket for engaging bump leads on a microelectronic device and methods thereforTESSERA INC·Filed 1998·Granted Mar 20, 2001·208 cites·8 claims
- 0298US5810609ASocket for engaging bump leads on a microelectronic device and methods thereforTESSERA INC·Filed 1995·Granted Sep 22, 1998·167 cites·26 claims
- 0398US5632631AMicroelectronic contacts with asperities and methods of making sameTESSERA INC·Filed 1994·Granted May 27, 1997·280 cites·13 claims
- 0496US6205660B1Method of making an electronic contactTESSERA INC·Filed 1997·Granted Mar 27, 2001·152 cites·15 claims
- 0593US5934914AMicroelectronic contacts with asperities and methods of making sameTESSERA INC·Filed 1997·Granted Aug 10, 1999·117 cites·14 claims
- 0686US6286205B1Method for making connections to a microelectronic device having bump leadsTESSERA INC·Filed 1998·Granted Sep 11, 2001·41 cites·30 claims
- 0766US7718471B1Method and apparatus for stacked die package with insulated wire bondsWHITE ELECTRONIC DESIGNS CORP·Filed 2008·Granted May 18, 2010·3 cites·19 claims
- 0861US6938338B2Method of making an electronic contactTESSERA INC·Filed 2003·Granted Sep 6, 2005·6 cites·8 claims
- 0951US2025253542A1Method of forming antenna with underfillVIASAT INC·Filed 2022·Application pending·0 cites
- 1046US7939928B2Method and apparatus for stacked die package with insulated wire bondsMICROSEMI CORP·Filed 2010·Granted May 10, 2011·0 cites·25 claims
- 1139US2002008966A1Microelectronic contacts with asperities and methods of making sameFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →