Inventor · disambiguated record
Jeong Hoon Ahn
Also filed as: AHN JEONG HOON
40 granted patents·19 pending applications·89 citations·filing 2003–2025
96Inventor score
Top patents by PatentIndex Score
59 records- 0196US11538747B2Interposer structure, semiconductor package comprising the same, and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Dec 27, 2022·6 cites·19 claims
- 0293US11133266B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Sep 28, 2021·3 cites·20 claims
- 0391US11043456B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jun 22, 2021·8 cites·20 claims
- 0485US12279408B2Semiconductor device and stack of semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Apr 15, 2025·0 cites·20 claims
- 0584US12328882B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Jun 10, 2025·0 cites·5 claims
- 0684US10229876B2Wiring structures and semiconductor devicesKIM JUN JUNG·Filed 2016·Granted Mar 12, 2019·9 cites·20 claims
- 0783US12199016B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jan 14, 2025·0 cites·20 claims
- 0883US11114524B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Sep 7, 2021·3 cites·20 claims
- 0983US2025006594A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1083US2025275159A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1183US2025014968A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1283US2025267882A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1382US11728311B2Semiconductor devices including interposer substrates further including capacitorsSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 15, 2023·1 cites·20 claims
- 1481US10867908B2Semiconductor device having buffer structure surrounding through viaSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Dec 15, 2020·3 cites·20 claims
- 1581US2025220874A1Semiconductor device and stack of semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1681US2025220873A1Semiconductor device and stack of semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1776US10892318B2Semiconductor device and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jan 12, 2021·2 cites·19 claims
- 1875US11871553B2Semiconductor device and stack of semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 9, 2024·0 cites·20 claims
- 1975US9831139B2Test structure and method of manufacturing structure including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Nov 28, 2017·2 cites·20 claims
- 2074US11961882B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 16, 2024·0 cites·10 claims
- 2173US11876038B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 16, 2024·0 cites·11 claims
- 2273US10396030B2Semiconductor device, layout design method for the same and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Aug 27, 2019·2 cites·20 claims
- 2371US7560332B2Integrated circuit capacitor structureSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jul 14, 2009·4 cites·14 claims
- 2470US6953745B2Void-free metal interconnection structure and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Oct 11, 2005·17 cites·20 claims
- 2569US12142587B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Nov 12, 2024·0 cites·12 claims
- 2668US8013455B2Semiconductor device having padsSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Sep 6, 2011·4 cites·18 claims
- 2768US7154162B2Integrated circuit capacitor structureSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Dec 26, 2006·16 cites·22 claims
- 2868US2025239552A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 2966US12300649B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 13, 2025·0 cites·20 claims
- 3064US7358155B2Scribe-line structures and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Apr 15, 2008·1 cites·18 claims
- 3161US7351653B2Method for damascene processSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Apr 1, 2008·2 cites·16 claims
- 3260US11791267B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 17, 2023·0 cites·8 claims
- 3359US11469174B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 11, 2022·0 cites·9 claims
- 3458US7417302B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Aug 26, 2008·1 cites·20 claims
- 3557US12354980B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 8, 2025·0 cites·20 claims
- 3657US11804459B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 31, 2023·0 cites·15 claims
- 3756US2008142927A1Scribe-line structures and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 3855US11798883B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 24, 2023·0 cites·11 claims
- 3953US2023099844A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 4052US11257754B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 22, 2022·0 cites·18 claims
- 4151US2022310506A1Semiconductor device and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 4249US2023131382A1Three-dimensional integrated circuit structure and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 4349US2023260893A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 4448US11437374B2Semiconductor device and stacked semiconductor chips including through contactsSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Sep 6, 2022·0 cites·19 claims
- 4548US2023170289A1Interposer structure and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 4647US12014935B2Interposer and method of manufacturing the interposerSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 18, 2024·0 cites·20 claims
- 4745US7229875B2Integrated circuit capacitor structureSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Jun 12, 2007·1 cites·21 claims
- 4844US2008048339A1Metal line structures and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 4943US2007072319A1Integrated circuit capacitor structureSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 5042US2006289999A1Selective copper alloy interconnections in semiconductor devices and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
Showing the top 50 of 59 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →