Inventor · disambiguated record

Jen-Yuan Chang

Also filed as: CHANG JEN-YUAN

107 granted patents·97 pending applications·169 citations·filing 2003–2025

99Inventor score

Technology areasH10W H10P G11B G01D B25J

Files withTAIWAN SEMICONDUCTOR MFG CO LTD172 UNIV NAT TSING HUA12 CHANG JEN-YUAN5 HITACHI GLOBAL STORAGE TECH4 INVENTEC PUDONG TECH CORP4

Top patents by PatentIndex Score

204 records

0198US11862610B2Fan-out packages providing enhanced mechanical strength and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 2, 2024·5 cites·20 claims
0298US11855130B2Three-dimensional device structure including substrate-embedded integrated passive device and methods for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·9 cites·17 claims
0398US11728288B2Semiconductor die including guard ring structure and three-dimensional device structure including the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 15, 2023·5 cites·20 claims
0498US11728301B2Semiconductor package including test pad and bonding pad structure for die connection and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 15, 2023·4 cites·20 claims
0597US12230613B2Vertical semiconductor package including horizontally stacked dies and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 18, 2025·3 cites·11 claims
0697US12033959B2Dummy pattern structure for reducing dishingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 9, 2024·3 cites·20 claims
0797US12027475B2Semiconductor die including guard ring structure and three-dimensional device structure including the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 2, 2024·3 cites·20 claims
0897US11869859B2Die stack and integrated device structure including improved bonding structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 9, 2024·4 cites·20 claims
0997US11437332B2Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 6, 2022·4 cites·20 claims
1096US12027403B2Pick-and-place system with a stabilizerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 2, 2024·2 cites·20 claims
1195US12154869B2Semiconductor package with high density of through-silicon vias (TSV)TAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 26, 2024·2 cites·20 claims
1295US12087729B2Multi-chip package having stress relief structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 10, 2024·2 cites·20 claims
1395US11923355B2Deep trench capacitor fuse structure for high voltage breakdown defense and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 5, 2024·2 cites·20 claims
1494US12347792B2Dummy pattern structure for reducing dishingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 1, 2025·1 cites·20 claims
1594US12327825B2Package structure and method of forming thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 10, 2025·2 cites·20 claims
1694US12237303B2Vertically mounted die groupsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Feb 25, 2025·1 cites·20 claims
1794US12125761B2Semiconductor package including package seal ring and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 22, 2024·2 cites·20 claims
1894US12087709B2Guard ring and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 10, 2024·2 cites·20 claims
1994US11862609B2Semiconductor die including fuse structure and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 2, 2024·2 cites·17 claims
2093US12266634B2Vertically mounted die groupsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 1, 2025·1 cites·20 claims
2192US11837586B2Package structure and method of forming thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 5, 2023·2 cites·20 claims
2292US11410927B2Semiconductor structure and method for forming thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 9, 2022·2 cites·20 claims
2391US11940662B2Semiconductor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 26, 2024·2 cites·20 claims
2491US2025349800A1Fan-out packages providing enhanced mechanical strength and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
2590US12154808B2System and method for wafer manufacturing process managementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 26, 2024·1 cites·20 claims
2690US6937424B2Repeatable runout (RRO) compensation methods and apparatus for data storage devicesHITACHI GLOBAL STORAGE TECH·Filed 2003·Granted Aug 30, 2005·48 cites·30 claims
2790US2025349757A1Semiconductor Die Including Guard Ring Structure and Three Dimensional Device Structure Including the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
2888US12237244B2High density through silicon conductive structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 25, 2025·1 cites·20 claims
2988US12009349B2Vertical semiconductor package including horizontally stacked dies and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 11, 2024·1 cites·20 claims
3088US2025140754A1Fan-out packages providing enhanced mechanical strength and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
3188US2025364297A1Pick-and-place system with a stabilizerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
3287US12469732B2Pick-and-place system with a stabilizerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Nov 11, 2025·0 cites·20 claims
3387US12417987B2Semiconductor die including guard ring structure and three-dimensional device structure including the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Sep 16, 2025·0 cites·20 claims
3487US12068262B2Semiconductor package including neighboring die contact and seal ring structures, and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 20, 2024·1 cites·20 claims
3587US12015010B2Vertically stacked semiconductor device including a hybrid bond contact junction circuit and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 18, 2024·1 cites·20 claims
3687US11929348B2Vertically mounted die groupsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 12, 2024·1 cites·20 claims
3786US2025316646A1Semiconductor device including a plurality of dielectric materials between semiconductor dies and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
3885US11817373B2Semiconductor arrangement and method of makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 14, 2023·1 cites·20 claims
3985US11594497B2Electromagnetic shielding structure for a semiconductor device and a method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 28, 2023·1 cites·18 claims
4085US7903376B2Integrated lead suspension for vibration damping in magnetic storage deviceHITACHI GLOBAL STORAGE TECH NL·Filed 2007·Granted Mar 8, 2011·6 cites·2 claims
4185US7345842B2Method and system for optimized servo track writing motor current profile to reduce written-in high-frequency repeatable runout track mis-registrationHITACHI GLOBAL STORAGE TECH·Filed 2005·Granted Mar 18, 2008·8 cites·13 claims
4285US2025140686A1Semiconductor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
4384US12431467B2Fan-out packages providing enhanced mechanical strength and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 30, 2025·0 cites·20 claims
4484US2025329595A1Semiconductor device and method of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
4584US2025314843A1Semiconductor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
4683US12412798B2Semiconductor device and method of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Sep 9, 2025·0 cites·19 claims
4783US12379557B2Semiconductor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Aug 5, 2025·0 cites·20 claims
4883US12364019B2Deep trench capacitor fuse structure for high voltage breakdown defense and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 15, 2025·0 cites·20 claims
4983US12272724B2Three-dimensional device structure including substrate-embedded integrated passive device and methods for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 8, 2025·0 cites·20 claims
5083US12224268B2Fan-out packages providing enhanced mechanical strength and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 11, 2025·0 cites·20 claims

Showing the top 50 of 204 patent records by PatentIndex Score.

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →