Inventor · disambiguated record
Jenq-Gong Duh
Also filed as: DUH JENQ-GONG
1 granted patent·12 pending applications·6 citations·filing 2004–2014
28Inventor score
Top patents by PatentIndex Score
13 records- 0144US7169627B2Method for inspecting a connecting surface of a flip chipUNIV TSINGHUA·Filed 2004·Granted Jan 30, 2007·6 cites·5 claims
- 0242US2008179193A1Manufacturing method of coating targetUNIV TSINGHUA·Filed 2007·Application pending·0 cites
- 0339US2015099641A1Method for manufacturing electrode of lithium batteryLEE CHRISTINE JILL·Filed 2014·Application pending·0 cites
- 0439US2006179887A1Mold for press-molding glass elementsNAT TSING HUA UNIVERISTY·Filed 2005·Application pending·0 cites
- 0539US2008296148A1Method for fabricating concentration-gradient high-frequency ferromagnetic filmsUNIV TSINGHUA·Filed 2007·Application pending·0 cites
- 0638US2012308880A1Porous li4ti5o12 anode material, method of manufacturing the same and battery comprising the sameDUH JENQ GONG·Filed 2011·Application pending·0 cites
- 0737US2010244266A1Metallic bonding structure for copper and solderDUH JENQ-GONG·Filed 2009·Application pending·0 cites
- 0831US2007148547A1Modification of an anode material and a preperation method thereofUNIV TSINGHUA·Filed 2005·Application pending·0 cites
- 0931US2011109415A1Inductor structureDUH JENQ-GONG·Filed 2009·Application pending·0 cites
- 1031US2010277880A1Electronic package structureDUH JENQ-GONG·Filed 2009·Application pending·0 cites
- 1127US2011281136A1Copper-manganese bonding structure for electronic packagesDUH JENQ-GONG·Filed 2010·Application pending·0 cites
- 1224US2011175698A1Inductor with ferromagnetic metal filmDUH JENQ-GONG·Filed 2010·Application pending·0 cites
- 1317US2012181691A1Package structure, packaging substrate and chipDUH JENQ-GONG·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →