US2008179193A1PendingUtilityA1

Manufacturing method of coating target

Assignee: UNIV TSINGHUAPriority: Jan 31, 2007Filed: Jan 31, 2007Published: Jul 31, 2008
Est. expiryJan 31, 2027(~0.5 yrs left)· nominal 20-yr term from priority
C23C 18/31C23C 18/36C23C 18/1806C25D 3/12C25D 21/12C23C 18/1601
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Claims

Abstract

This invention relates to a composite target material which is prepared a thin film on the substrates via electroplating or electroless plating method. The thin film contains phosphorus or boron atoms. The ratio of phosphorus or boron atoms of the thin film is controlled by the solution or process parameters of electroplating or electroless plating process. The multi-elements functional thin film, which possesses optimum contents of phosphorus or boron atoms by coating process, can be used for high-temperature applications because of its better thermal cyclic properties and mechanical properties.

Claims

exact text as granted — not AI-modified
1 . A manufacturing method of coating target by coating a thin film on a substrates, comprising:
 coating a thin film on a substrate via electroplating method;   the substrate being electroplated in a plating solution;   a coated specimen being rinsed and cleaned in water for 2 minutes to form a composite target; and   wherein the temperature of solution is in the range of 40 to 75° C., pH value is in the range of 1.3 to 4.0, and the coating time is 1 to 5 hours at the current density is in the range of 50 to 200 mA/cm 2 .   
     
     
         2 . The manufacturing method of  claim 1 , wherein the metallic ion is selected from elemental Ni, Al, W, and Cr and the combination of them. 
     
     
         3 . The manufacturing method of  claim 1 , wherein the content of Phosphate/Boron of the film is controlled by the solution and the solution parameters of electroplating process. 
     
     
         4 . A manufacturing method of coating target by coating a thin film on a substrates, comprising:
 coating a thin film on a substrate via electroplating method;   the substrate being electroplated in a plating solution;   a coated specimen being rinsed and cleaned in water for 2 minutes to form a composite target; and   wherein the ratio of volume and surface area electroless plating is in the range of 15 to 30 cm 3 /cm 2 , the temperature of the solution is in the range of 70 to 90° C., pH value is in the range of 4.0 to 5.8, the coating time is 1 to 2 hours, and the frequency of the solution is 1˜20 per batch   
     
     
         5 . The manufacturing method of  claim 4 , wherein the metallic ion is selected from elemental Ni, Al, W, and Cr and the combination of them. 
     
     
         6 . The manufacturing method of  claim 4 , wherein the content of Phosphate/Boron of the film is controlled by the solution and the solution parameters of electroless plating process.

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