Inventor · disambiguated record
Jens Frey
Also filed as: FREY JENS
30 granted patents·10 pending applications·115 citations·filing 2002–2024
94Inventor score
Top patents by PatentIndex Score
40 records- 0190US9919919B2Laser reseal including an additional layer and alloy formationBOSCH GMBH ROBERT·Filed 2016·Granted Mar 20, 2018·5 cites·7 claims
- 0289US9926188B2Sensor unit including a decoupling structure and manufacturing method thereforBOSCH GMBH ROBERT·Filed 2015·Granted Mar 27, 2018·7 cites·29 claims
- 0388US8490483B2Micromechanical yaw-rate sensorWREDE MARTIN·Filed 2010·Granted Jul 23, 2013·26 cites·9 claims
- 0478US8748998B2Sensor moduleFREY JENS·Filed 2011·Granted Jun 10, 2014·4 cites·8 claims
- 0574US7313958B2Rotational rate sensorBOSCH GMBH ROBERT·Filed 2002·Granted Jan 1, 2008·30 cites·13 claims
- 0673US9567212B2Micromechanical componentBOSCH GMBH ROBERT·Filed 2013·Granted Feb 14, 2017·2 cites·12 claims
- 0772US7316161B2Rotation rate sensorBOSCH GMBH ROBERT·Filed 2002·Granted Jan 8, 2008·27 cites·8 claims
- 0870US7919346B2Micromechanical component and manufacturing methodBOSCH GMBH ROBERT·Filed 2006·Granted Apr 5, 2011·5 cites·6 claims
- 0967US9365417B2Method for manufacturing a micromechanical componentBOSCH GMBH ROBERT·Filed 2014·Granted Jun 14, 2016·1 cites·9 claims
- 1065US9688527B2Micromechanical component and method for producing a micromechanical componentBOSCH GMBH ROBERT·Filed 2014·Granted Jun 27, 2017·1 cites·12 claims
- 1163US2025353115A1Laser sealing and surface asperity controlling method with controlled solidification cooling rateBOSCH GMBH ROBERT·Filed 2024·Application pending·0 cites
- 1261US9123716B2Method for bonding two silicon substrates, and a correspondeing system of two silicon substratesGONSKA JULIAN·Filed 2012·Granted Sep 1, 2015·1 cites·14 claims
- 1360US9034757B2Method for manufacturing a component having an electrical through-connectionREINMUTH JOCHEN·Filed 2013·Granted May 19, 2015·1 cites·14 claims
- 1460US2024017353A1Laser sealing and surface asperity controlling method with discontinuous laser pulsesBOSCH GMBH ROBERT·Filed 2022·Application pending·0 cites
- 1560US2024017349A1Laser sealing and surface asperity controlling method with continuous laser pulsesBOSCH GMBH ROBERT·Filed 2022·Application pending·0 cites
- 1657US12509346B2Laser sealing methods for closing ventholes of micromecahnical devicesBOSCH GMBH ROBERT·Filed 2022·Granted Dec 30, 2025·0 cites·11 claims
- 1754US7270868B2Micromechanical componentBOSCH GMBH ROBERT·Filed 2003·Granted Sep 18, 2007·5 cites·10 claims
- 1852US2025135583A1Laser sealing methods with varying laser profiles for closing ventholes of micromechanical devicesBOSCH GMBH ROBERT·Filed 2023·Application pending·0 cites
- 1951US11261082B2Micromechanical device and method for manufacturing a micromechanical deviceBOSCH GMBH ROBERT·Filed 2019·Granted Mar 1, 2022·0 cites·11 claims
- 2050US9606141B2Micromechanical sensor deviceBOSCH GMBH ROBERT·Filed 2014·Granted Mar 28, 2017·0 cites·11 claims
- 2150US2024019457A1Inertial measurement device with vent hole structureBOSCH GMBH ROBERT·Filed 2022·Application pending·0 cites
- 2248US9153523B2ASIC element including a viaWEBER HERIBERT·Filed 2014·Granted Oct 6, 2015·0 cites·7 claims
- 2345US9416000B2Component including two semiconductor elements, between which at least two hermetically sealed cavities are formed and method for establishing a corresponding bonding connection between two semiconductor elementsBOSCH GMBH ROBERT·Filed 2015·Granted Aug 16, 2016·0 cites·4 claims
- 2445US9406747B2Component in the form of a wafer level package and method for manufacturing sameBOSCH GMBH ROBERT·Filed 2014·Granted Aug 2, 2016·0 cites·3 claims
- 2545US8759927B2Hybrid intergrated componentCLASSEN JOHANNES·Filed 2013·Granted Jun 24, 2014·0 cites·7 claims
- 2644US9266720B2Hybrid integrated componentCLASSEN JOHANNES·Filed 2013·Granted Feb 23, 2016·0 cites·13 claims
- 2744US9114978B2Method for manufacturing a component having an electrical through-connectionREINMUTH JOCHEN·Filed 2013·Granted Aug 25, 2015·0 cites·15 claims
- 2844US9040336B2Method for manufacturing a cap for a MEMS component, and hybrid integrated component having such a capCLASSEN JOHANNES·Filed 2013·Granted May 26, 2015·0 cites·6 claims
- 2944US8975118B2Component having a via and method for manufacturing itGONSKA JULIAN·Filed 2011·Granted Mar 10, 2015·0 cites·5 claims
- 3043US10752498B2MEMS component having two different internal pressuresBOSCH GMBH ROBERT·Filed 2016·Granted Aug 25, 2020·0 cites·12 claims
- 3143US10000375B2Structures and process for preventing a projection of the laser resealing structure beyond the wafer surfaceBOSCH GMBH ROBERT·Filed 2016·Granted Jun 19, 2018·0 cites·6 claims
- 3243US2015137329A1Component having a via and method for manufacturing itBOSCH GMBH ROBERT·Filed 2015·Application pending·0 cites
- 3342US8941193B2Method for manufacturing a hybrid integrated componentFREY JENS·Filed 2013·Granted Jan 27, 2015·0 cites·7 claims
- 3442US2014374853A1Component including means for reducing assembly-related mechanical stresses and methods for manufacturing sameWEBER HERIBERT·Filed 2014·Application pending·0 cites
- 3540US9475693B2ASIC element, in particular as a component of a vertically integrated hybrid componentBOSCH GMBH ROBERT·Filed 2015·Granted Oct 25, 2016·0 cites·9 claims
- 3640US8647961B2Method for filling cavities in wafers, correspondingly filled blind hole and wafer having correspondingly filled insulation trenchesFREY JENS·Filed 2011·Granted Feb 11, 2014·0 cites·10 claims
- 3738US2013285175A1Micromechanical component and method for manufacturing a micromechanical componentGONSKA JULIAN·Filed 2013·Application pending·0 cites
- 3838US2017158495A1Laser reseal including different cap materialsBOSCH GMBH ROBERT·Filed 2016·Application pending·0 cites
- 3935US8835222B2Method for producing a two-chip assembly and corresponding two-chip assemblyBRUENDEL MATHIAS·Filed 2012·Granted Sep 16, 2014·0 cites·10 claims
- 4033US2011068419A1Micromechanical systemREINMUTH JOCHEN·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →