Inventor · disambiguated record
Jeff Hudgens
Also filed as: HUDGENS JEFF
13 granted patents·139 citations·filing 2002–2023
90Inventor score
Technology areasH10P
Top patents by PatentIndex Score
13 records- 0198US11355367B2Robot for simultaneous substrate transferAPPLIED MATERIALS INC·Filed 2020·Granted Jun 7, 2022·9 cites·20 claims
- 0294US11850745B2Multi-turn drive assembly and systems and methods of use thereofAPPLIED MATERIALS INC·Filed 2022·Granted Dec 26, 2023·2 cites·20 claims
- 0394US11443973B2Robot for simultaneous substrate transferAPPLIED MATERIALS INC·Filed 2020·Granted Sep 13, 2022·3 cites·20 claims
- 0492US7627395B2Vision systemAPPLIED MATERIALS INC·Filed 2006·Granted Dec 1, 2009·24 cites·17 claims
- 0589US11749540B2Dual actuating tilting slit valveAPPLIED MATERIALS INC·Filed 2020·Granted Sep 5, 2023·2 cites·12 claims
- 0689US7233841B2Vision systemAPPLIED MATERIALS INC·Filed 2003·Granted Jun 19, 2007·47 cites·15 claims
- 0788US11413744B2Multi-turn drive assembly and systems and methods of use thereofAPPLIED MATERIALS INC·Filed 2020·Granted Aug 16, 2022·2 cites·27 claims
- 0887US7085622B2Vision systemAPPLIED MATERIAL INC·Filed 2002·Granted Aug 1, 2006·49 cites·21 claims
- 0980US11540432B2Ultrathin conformal coatings for electrostatic dissipation in semiconductor process toolsAPPLIED MATERIALS INC·Filed 2020·Granted Dec 27, 2022·1 cites·20 claims
- 1079US12370672B2Multi-turn drive assembly and systems and methods of use thereofAPPLIED MATERIALS INC·Filed 2023·Granted Jul 29, 2025·0 cites·15 claims
- 1178US12004337B2Ultrathin conformal coatings for electrostatic dissipation in semiconductor process toolsAPPLIED MATERIALS INC·Filed 2022·Granted Jun 4, 2024·0 cites·19 claims
- 1270US12170220B2Robot for simultaneous substrate transferAPPLIED MATERIALS INC·Filed 2022·Granted Dec 17, 2024·0 cites·20 claims
- 1368US11547030B2Ultrathin conformal coatings for electrostatic dissipation in semiconductor process toolsAPPLIED MATERIALS INC·Filed 2020·Granted Jan 3, 2023·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →