Inventor · disambiguated record
Jesse Jones
Also filed as: JONES JESSE · JONES JESSE C · JONES JESSE COLE
10 granted patents·10 pending applications·4 citations·filing 2017–2025
81Inventor score
Top patents by PatentIndex Score
20 records- 0186US2025323166A1Lithographic cavity formation to enable emib bump pitch scalingINTEL CORP·Filed 2025·Application pending·0 cites
- 0283US12354963B2Lithographic cavity formation to enable EMIB bump pitch scalingINTEL CORP·Filed 2024·Granted Jul 8, 2025·0 cites·19 claims
- 0383US12334443B2Lithographic cavity formation to enable EMIB bump pitch scalingINTEL CORP·Filed 2024·Granted Jun 17, 2025·0 cites·18 claims
- 0475US11929330B2Lithographic cavity formation to enable EMIB bump pitch scalingINTEL CORP·Filed 2022·Granted Mar 12, 2024·0 cites·20 claims
- 0575US10847471B2Dielectric filler material in conductive material that functions as fiducial for an electronic deviceINTEL CORP·Filed 2018·Granted Nov 24, 2020·2 cites·7 claims
- 0672US11322444B2Lithographic cavity formation to enable EMIB bump pitch scalingINTEL CORP·Filed 2018·Granted May 3, 2022·1 cites·16 claims
- 0768US11081448B2Embedded die microelectronic device with molded componentINTEL CORP·Filed 2017·Granted Aug 3, 2021·1 cites·15 claims
- 0866US12087700B2Embedded die microelectronic device with molded componentINTEL CORP·Filed 2021·Granted Sep 10, 2024·0 cites·20 claims
- 0963US11527484B2Dielectric filler material in conductive material that functions as fiducial for an electronic deviceINTEL CORP·Filed 2020·Granted Dec 13, 2022·0 cites·17 claims
- 1057US2025006609A1Methods and apparatus for package substrates with stacks of glass layers having different coefficients of thermal expansionINTEL CORP·Filed 2024·Application pending·0 cites
- 1156US11923312B2Patternable die attach materials and processes for patterningINTEL CORP·Filed 2019·Granted Mar 5, 2024·0 cites·12 claims
- 1255US2025105119A1Self-healing liner for through glass via reliabilityINTEL CORP·Filed 2023·Application pending·0 cites
- 1355US2025192069A1Microelectronic assemblies with pre-singulation edge features in glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 1455US2025192070A1Microelectronic assemblies with post-singulation edge features in glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 1553US2025210586A1Semiconductor package substrate dicing and edge passivationINTEL CORP·Filed 2023·Application pending·0 cites
- 1653US2025112136A1Glass core protection using peripheral buffer layersINTEL CORP·Filed 2023·Application pending·0 cites
- 1753US2025014954A1Hybrid cores including adhesive promotion layers and related methodsAGARWAL SOHAM·Filed 2024·Application pending·0 cites
- 1851US2025112175A1Microelectronic assemblies with edge stress reduction in glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 1950US2025112140A1Stress mitigation architectures for glass core substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 2046US11062933B2Die placement and coupling apparatusINTEL CORP·Filed 2018·Granted Jul 13, 2021·0 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →