Inventor · disambiguated record
Jen-Chieh Lin
Also filed as: HE MINGQIAN · LIN JEN CHIEH ROY · LIN JEN-CHIEH
32 granted patents·24 pending applications·70 citations·filing 2004–2022
95Inventor score
Files withCORNING INC19UNITED MICROELECTRONICS CORP11BAYER MATERIALSCIENCE AG2CHUNGHWA PICTURE TUBES LTD2COVESTRO INTELLECTUAL PROPERTY GMBH & CO KG2
Top patents by PatentIndex Score
56 records- 0197US11777067B2Bezel-free display tile with edge-wrapped conductors and methods of manufactureCORNING INC·Filed 2022·Granted Oct 3, 2023·3 cites·22 claims
- 0295US11282994B2Bezel-free display tile with edge-wrapped conductors and methods of manufactureCORNING INC·Filed 2018·Granted Mar 22, 2022·7 cites·29 claims
- 0392US10809766B2Bendable glass stack assemblies, articles and methods of making the sameCORNING INC·Filed 2017·Granted Oct 20, 2020·8 cites·29 claims
- 0488US8916066B2Polymeric fused thiophene semiconductor formulationGLASGOW LOUIS CHARLES·Filed 2011·Granted Dec 23, 2014·8 cites·13 claims
- 0579US9384996B2Method for manufacturing semiconductor device and device manufactured by the sameUNITED MICROELECTRONICS CORP·Filed 2014·Granted Jul 5, 2016·4 cites·21 claims
- 0674US10015879B2Silica content substrate such as for use harsh environment circuits and high frequency antennasCORNING INC·Filed 2017·Granted Jul 3, 2018·2 cites·19 claims
- 0774US7675088B2Manufacturing method of thin film transistor array substrateCHUNGHWA PICTURE TUBES LTD·Filed 2008·Granted Mar 9, 2010·6 cites·6 claims
- 0874US2022173296A1Bezel-free display tile with edge-wrapped conductors and methods of manufactureCORNING INC·Filed 2022·Application pending·0 cites
- 0971US8017229B2Polyurethane composite, its preparation and useBAYER MATERIALSCIENCE AG·Filed 2005·Granted Sep 13, 2011·2 cites·19 claims
- 1070US10367169B2Processes for making light extraction substrates for an organic light emitting diode using photo-thermal treatmentCORNING INC·Filed 2017·Granted Jul 30, 2019·0 cites·35 claims
- 1169US12420376B2Polishing head assembly having recess and capGLOBALWAFERS CO LTD·Filed 2022·Granted Sep 23, 2025·0 cites·19 claims
- 1267US8828745B2Method for manufacturing through-silicon viaTSAO WEI-CHE·Filed 2011·Granted Sep 9, 2014·3 cites·8 claims
- 1366US10622589B2Article for improved light extractionCORNING INC·Filed 2019·Granted Apr 14, 2020·0 cites·8 claims
- 1466US9443726B1Semiconductor processUNITED MICROELECTRONICS CORP·Filed 2015·Granted Sep 13, 2016·1 cites·20 claims
- 1566US8872286B2Metal gate structure and fabrication method thereofCHENG TSUN-MIN·Filed 2011·Granted Oct 28, 2014·3 cites·8 claims
- 1666US7381374B2Immunoassay devices and methods of using sameTSAI HSIAO-CHUNG·Filed 2004·Granted Jun 3, 2008·20 cites·7 claims
- 1761US12188054B2Modified monooxygenases for the manufacture of hydroxylated hydrocarbons based on substitution of amino acids by alanineCOVESTRO INTELLECTUAL PROPERTY GMBH & CO KG·Filed 2020·Granted Jan 7, 2025·0 cites·22 claims
- 1861US11674161B2Modified monooxygenases for the manufacture of hydroxylated hydrocarbonsCOVESTRO INTELLECTUAL PROPERTY GMBH & CO KG·Filed 2020·Granted Jun 13, 2023·0 cites·11 claims
- 1961US9281374B2Metal gate structure and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2014·Granted Mar 8, 2016·1 cites·15 claims
- 2061US2023294382A1Functional laminated glass articles and methods of making the sameCORNING INC·Filed 2021·Application pending·0 cites
- 2160US10923481B2Semiconductor integrated circuit structureUNITED MICROELECTRONICS CORP·Filed 2018·Granted Feb 16, 2021·0 cites·7 claims
- 2259US10943910B2Method for forming semiconductor integrated circuit structureUNITED MICROELECTRONICS CORP·Filed 2018·Granted Mar 9, 2021·0 cites·10 claims
- 2358US2024239275A1Vehicle interior component having high surface energy bonding interface and methods of forming sameCORNING INC·Filed 2022·Application pending·0 cites
- 2456US11328950B2Thin glass or ceramic substrate for silicon-on-insulator technologyCORNING INC·Filed 2021·Granted May 10, 2022·0 cites·20 claims
- 2554US10128251B2Semiconductor integrated circuit structure and method for forming the sameUNITED MICROELECTRONICS CORP·Filed 2016·Granted Nov 13, 2018·0 cites·6 claims
- 2654US2021261836A1Temporary bonding of substrates with large roughness using multilayers of polyelectrolytesCORNING INC·Filed 2021·Application pending·0 cites
- 2753US11999135B2Temporary bonding using polycationic polymersCORNING INC·Filed 2018·Granted Jun 4, 2024·0 cites·20 claims
- 2853US11948792B2Glass wafers for semiconductor device fabricationCORNING INC·Filed 2020·Granted Apr 2, 2024·0 cites·15 claims
- 2951US2022348652A1Recombinant antibodies, pharmaceutical compositions comprising the same, and uses thereofANTAIMMU BIOMED CO LTD·Filed 2022·Application pending·0 cites
- 3048US10276367B1Method for improving wafer surface uniformityUNITED MICROELECTRONICS CORP·Filed 2018·Granted Apr 30, 2019·0 cites·8 claims
- 3147US7606443B2Interpolation method for enlarging an imageTATUNG CO·Filed 2006·Granted Oct 20, 2009·2 cites·4 claims
- 3247US2018166353A1Glass substrate assemblies having low dielectric propertiesCORNING INC·Filed 2016·Application pending·0 cites
- 3347US2016351674A1Semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2016·Application pending·0 cites
- 3446US10649601B1Method for improving touch performance of capacitive touch screen with non-rectangular shapeHIMAX TECH LTD·Filed 2018·Granted May 12, 2020·0 cites·9 claims
- 3546US2018258943A1Temperature Sensor and a Fan with a Temperature Detecting FunctionSUNONWEALTH ELECTRIC MACHINE IND CO LTD·Filed 2018·Application pending·0 cites
- 3645US12200875B2Copper metallization for through-glass vias on thin glassIND TECH RES INST·Filed 2019·Granted Jan 14, 2025·0 cites·15 claims
- 3745US12124767B2Audio player device, and method for automatically adjusting an output volume of the audio player deviceHEALTH & LIFE CO LTD·Filed 2022·Granted Oct 22, 2024·0 cites·10 claims
- 3845US2017254930A1Structured light-transmitting articles and methods for making the sameCORNING INC·Filed 2017·Application pending·0 cites
- 3945US2023341986A1Systems and methods for forming wrap around electrodesCORNING INC·Filed 2020·Application pending·0 cites
- 4044US2016013100A1Via structure and method of forming the sameUNITED MICROELECTRONICS CORP·Filed 2014·Application pending·0 cites
- 4143US9434809B2Isocyanate-terminated prepolymer, the method for preparing the same and the use thereofBAYER MATERIALSCIENCE AG·Filed 2013·Granted Sep 6, 2016·0 cites·6 claims
- 4243US2021257597A1Internal light extraction layers cured by near infrared radiationCORNING INC·Filed 2019·Application pending·0 cites
- 4342US2008054264A1Thin film transistor array substrate and manufacturing method thereofCHUNGHWA PICTURE TUBES LTD·Filed 2007·Application pending·0 cites
- 4442US2016324016A1Glass articles having films with moderate adhesion, retained strength and optical transmittanceCORNING INC·Filed 2016·Application pending·0 cites
- 4542US2004244673A1Microporous crystals and methods of making thereofFiled 2004·Application pending·0 cites
- 4641US2021175219A1Display area having tiles with improved edge strength and methods of making the sameCORNING INC·Filed 2018·Application pending·0 cites
- 4740US10262869B2Planarization methodUNITED MICROELECTRONICS CORP·Filed 2018·Granted Apr 16, 2019·0 cites·12 claims
- 4837US2017228050A1Stylus, touch-control system, and method for manipulating touch-control systemLIN JEN-CHIEH·Filed 2016·Application pending·0 cites
- 4936US2013062423A1Polyurethane elastomer ballast mat and preparation thereofZHANG CHENXI·Filed 2011·Application pending·0 cites
- 5035US2011189855A1METHOD FOR CLEANING SURFACE CONTAINING CuLIN JEN-CHIEH·Filed 2010·Application pending·0 cites
Showing the top 50 of 56 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Jen-Chieh Lin files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →