Inventor · disambiguated record
Jenny Shio Yin Ong
Also filed as: ONG JENNY SHIO YIN
44 granted patents·25 pending applications·23 citations·filing 2013–2025
95Inventor score
Files withINTEL CORP69
Top patents by PatentIndex Score
69 records- 0196US11282780B2Integrated bridge for die-to-die interconnectsINTEL CORP·Filed 2020·Granted Mar 22, 2022·3 cites·12 claims
- 0290US11367673B2Semiconductor package with hybrid through-silicon-viasINTEL CORP·Filed 2020·Granted Jun 21, 2022·2 cites·20 claims
- 0389US11527463B2Hybrid ball grid array package for high speed interconnectsINTEL CORP·Filed 2020·Granted Dec 13, 2022·2 cites·18 claims
- 0485US10964677B2Electronic packages with stacked sitffeners and methods of assembling sameINTEL CORP·Filed 2017·Granted Mar 30, 2021·4 cites·16 claims
- 0583US11521932B2Composite bridge die-to-die interconnects for integrated-circuit packagesINTEL CORP·Filed 2020·Granted Dec 6, 2022·1 cites·21 claims
- 0683US10910325B2Integrated circuit packages with conductive element having cavities housing electrically connected embedded componentsINTEL CORP·Filed 2018·Granted Feb 2, 2021·3 cites·24 claims
- 0782US11574877B2Semiconductor miniaturization through component placement on stepped stiffenerINTEL CORP·Filed 2020·Granted Feb 7, 2023·1 cites·14 claims
- 0879US2024395722A1Composite bridge die-to-die interconnects for integrated-circuit packagesINTEL CORP·Filed 2024·Application pending·0 cites
- 0978US12142570B2Composite bridge die-to-die interconnects for integrated-circuit packagesINTEL CORP·Filed 2022·Granted Nov 12, 2024·0 cites·20 claims
- 1077US10978407B2Stiffener-integrated interconnect bypasses for chip-package apparatus and methods of assembling sameINTEL CORP·Filed 2019·Granted Apr 13, 2021·2 cites·22 claims
- 1176US10396047B2Semiconductor package with package components disposed on a package substrate within a footprint of a dieINTEL CORP·Filed 2018·Granted Aug 27, 2019·2 cites·22 claims
- 1274US11158568B2Package with wall-side capacitorsINTEL CORP·Filed 2016·Granted Oct 26, 2021·2 cites·16 claims
- 1373US11195801B2Embedded reference layers for semiconductor package substratesINTEL CORP·Filed 2019·Granted Dec 7, 2021·1 cites·19 claims
- 1471US12002747B2Integrated bridge for die-to-die interconnectsINTEL CORP·Filed 2022·Granted Jun 4, 2024·0 cites·20 claims
- 1570US11676910B2Embedded reference layers for semiconductor package substratesINTEL CORP·Filed 2021·Granted Jun 13, 2023·0 cites·16 claims
- 1670US2023411385A1Package with embedded capacitorsINTEL CORP·Filed 2023·Application pending·0 cites
- 1766US11887940B2Integrated circuit packages with conductive element having cavities housing electrically connected embedded componentsINTEL CORP·Filed 2020·Granted Jan 30, 2024·0 cites·14 claims
- 1862US12328816B2Asymmetrical laminated circuit boards for improved electrical performanceINTEL CORP·Filed 2021·Granted Jun 10, 2025·0 cites·16 claims
- 1961US11521943B2Method of forming a capacitive loop substrate assemblyINTEL CORP·Filed 2021·Granted Dec 6, 2022·0 cites·6 claims
- 2061US2025300079A1Stiffener between two substratesINTEL CORP·Filed 2024·Application pending·0 cites
- 2160US12256487B2Hybrid boards with embedded planesINTEL CORP·Filed 2021·Granted Mar 18, 2025·0 cites·20 claims
- 2259US11955431B2Interposer structures and methods for 2.5D and 3D packagingINTEL CORP·Filed 2020·Granted Apr 9, 2024·0 cites·18 claims
- 2357US12191281B2Multi-chip package with recessed memoryINTEL CORP·Filed 2021·Granted Jan 7, 2025·0 cites·20 claims
- 2457US11430764B2Overhang bridge interconnectINTEL CORP·Filed 2020·Granted Aug 30, 2022·0 cites·17 claims
- 2557US11342289B2Vertical power plane module for semiconductor packagesINTEL CORP·Filed 2020·Granted May 24, 2022·0 cites·20 claims
- 2657US11284518B1Semiconductor package with co-axial ball-grid-arrayINTEL CORP·Filed 2020·Granted Mar 22, 2022·0 cites·20 claims
- 2756US11562954B2Frame-array interconnects for integrated-circuit packagesINTEL CORP·Filed 2020·Granted Jan 24, 2023·0 cites·17 claims
- 2856US11462488B2Substrate cores for warpage controlINTEL CORP·Filed 2020·Granted Oct 4, 2022·0 cites·16 claims
- 2956US2024222346A1Architectures for memory on integrated circuit device packagesINTEL CORP·Filed 2022·Application pending·0 cites
- 3055US11289427B2Multi-faceted integrated-circuit dice and packagesINTEL CORP·Filed 2020·Granted Mar 29, 2022·0 cites·7 claims
- 3155US2024071856A1Electronic assembly having a cooling feature and methods of forming thereofINTEL CORP·Filed 2022·Application pending·0 cites
- 3255US2024145420A1Liquid metal shield for fine pitch interconnectsINTEL CORP·Filed 2022·Application pending·0 cites
- 3355US2024234283A9Electronic package with integrated interconnect structureINTEL CORP·Filed 2022·Application pending·0 cites
- 3455US2024145365A1Electronic interconnect and method of forming the sameINTEL CORP·Filed 2022·Application pending·0 cites
- 3554US11508650B2Interposer for hybrid interconnect geometryINTEL CORP·Filed 2020·Granted Nov 22, 2022·0 cites·12 claims
- 3654US2024006786A1Composite printed circuit boards and devicesINTEL CORP·Filed 2022·Application pending·0 cites
- 3754US2024071934A1Composite bridges for 3d stacked integrated circuit power deliveryINTEL CORP·Filed 2022·Application pending·0 cites
- 3854US2023120513A1Foldable compression attached memory module (fcamm)INTEL CORP·Filed 2022·Application pending·0 cites
- 3954US2024006341A1Semiconductor package with extended stiffenerINTEL CORP·Filed 2022·Application pending·0 cites
- 4054US2024145368A1Electronic assembly with power module interposer and methods of forming thereofINTEL CORP·Filed 2022·Application pending·0 cites
- 4154US2024006376A1Semiconductor packages for alternate stacked memory and methods of manufacturing the sameINTEL CORP·Filed 2022·Application pending·0 cites
- 4253US12500175B2Integrated bridge frame for package substrateINTEL CORP·Filed 2021·Granted Dec 16, 2025·0 cites·19 claims
- 4353US12218064B2Molded silicon interconnects in bridges for integrated-circuit packagesINTEL CORP·Filed 2020·Granted Feb 4, 2025·0 cites·17 claims
- 4453US11527467B2Multi-chip package with extended frameINTEL CORP·Filed 2020·Granted Dec 13, 2022·0 cites·13 claims
- 4553US11527485B2Electrical shield for stacked heterogeneous device integrationINTEL CORP·Filed 2020·Granted Dec 13, 2022·0 cites·16 claims
- 4652US11227841B2Stiffener build-up layer packageINTEL CORP·Filed 2019·Granted Jan 18, 2022·0 cites·20 claims
- 4752US2025210429A1Integrated circuit packages with stiffeners containing semiconductor dies and associated methodsINTEL CORP·Filed 2025·Application pending·0 cites
- 4852US2023187368A1Hybrid semiconductor package for improved power integrityINTEL CORP·Filed 2021·Application pending·0 cites
- 4952US2024006399A1Die-stacked and molded architecture for memory on package (mop)INTEL CORP·Filed 2022·Application pending·0 cites
- 5051US12183722B2Molded interconnects in bridges for integrated-circuit packagesINTEL CORP·Filed 2020·Granted Dec 31, 2024·0 cites·23 claims
Showing the top 50 of 69 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →