Inventor · disambiguated record
Jens Pohl
Also filed as: POHL JENS · POHL JENS G
97 granted patents·14 pending applications·1,192 citations·filing 1976–2024
99Inventor score
Top patents by PatentIndex Score
111 records- 0198US7834464B2Semiconductor chip package, semiconductor chip assembly, and method for fabricating a deviceINFINEON TECHNOLOGIES AG·Filed 2007·Granted Nov 16, 2010·87 cites·10 claims
- 0296US8952489B2Semiconductor package and method for fabricating the sameINFINEON TECHNOLOGIES AG·Filed 2012·Granted Feb 10, 2015·51 cites·20 claims
- 0396US8202763B2Semiconductor chip package, semiconductor chip assembly, and method for fabricating a deviceMEYER THORSTEN·Filed 2010·Granted Jun 19, 2012·26 cites·16 claims
- 0496US7786584B2Through substrate via semiconductor componentsINFINEON TECHNOLOGIES AG·Filed 2007·Granted Aug 31, 2010·45 cites·25 claims
- 0595US8330273B2Semiconductor device including molding compound layer forms a common plane with the surface of the semiconductor chipBRUNNBAUER MARKUS·Filed 2010·Granted Dec 11, 2012·25 cites·23 claims
- 0695US8169059B2On-chip RF shields with through substrate conductorsBARTH HANS-JOACHIM·Filed 2008·Granted May 1, 2012·38 cites·42 claims
- 0794US12158448B2Radiation source deviceINFINEON TECHNOLOGIES AG·Filed 2022·Granted Dec 3, 2024·2 cites·20 claims
- 0894US8829663B2Stackable semiconductor package with encapsulant and electrically conductive feed-throughPOHL JENS·Filed 2007·Granted Sep 9, 2014·36 cites·21 claims
- 0994US8148257B1Semiconductor structure and method for making sameBARTH HANS-JOACHIM·Filed 2010·Granted Apr 3, 2012·24 cites·6 claims
- 1094US7943423B2Reconfigured wafer alignmentINFINEON TECHNOLOGIES AG·Filed 2009·Granted May 17, 2011·28 cites·24 claims
- 1193US9293423B2Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chipsINTEL MOBILE COMM GMBH·Filed 2014·Granted Mar 22, 2016·11 cites·15 claims
- 1293US7687895B2Workpiece with semiconductor chips and molding, semiconductor device and method for producing a workpiece with semiconductors chipsINFINEON TECHNOLOGIES AG·Filed 2007·Granted Mar 30, 2010·30 cites·41 claims
- 1391US7863088B2Semiconductor device including covering a semiconductor with a molding compound and forming a through hole in the molding compoundINFINEON TECHNOLOGIES AG·Filed 2007·Granted Jan 4, 2011·18 cites·18 claims
- 1491US4051834APortable, linear-focused solar thermal energy collecting systemNASA·Filed 1976·Granted Oct 4, 1977·60 cites·12 claims
- 1590US7936052B2On-chip RF shields with backside redistribution linesINFINEON TECHNOLOGIES AG·Filed 2008·Granted May 3, 2011·19 cites·19 claims
- 1690US6897568B2Electronic component with flexible contacting pads and method for producing the electronic componentINFINEON TECHNOLOGIES AG·Filed 2002·Granted May 24, 2005·52 cites·19 claims
- 1789US8659154B2Semiconductor device including adhesive covered elementMEYER THORSTEN·Filed 2008·Granted Feb 25, 2014·10 cites·25 claims
- 1889US7575173B2Smart card, smart card module, and a method for production of a smart card moduleINFINEON TECHNOLOGIES AG·Filed 2006·Granted Aug 18, 2009·22 cites·6 claims
- 1989US7456495B2Semiconductor module with a semiconductor stack, and methods for its productionINFINEON TECHNOLOGIES AG·Filed 2004·Granted Nov 25, 2008·79 cites·19 claims
- 2087US6434035B2Memory systemINFINEON TECHNOLOGIES AG·Filed 2001·Granted Aug 13, 2002·47 cites·13 claims
- 2187US4046462AThree-dimensional tracking solar energy concentrator and method for making sameNASA·Filed 1976·Granted Sep 6, 1977·55 cites·9 claims
- 2286US7948071B2Integrated circuit with re-route layer and stacked die assemblyQIMONDA AG·Filed 2008·Granted May 24, 2011·13 cites·44 claims
- 2385US8779563B2Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chipsINTEL MOBILE COMM GMBH·Filed 2012·Granted Jul 15, 2014·6 cites·11 claims
- 2485US8309454B2Structure for electrostatic discharge in embedded wafer level packagesBRUNNBAUER MARKUS·Filed 2007·Granted Nov 13, 2012·10 cites·14 claims
- 2584US11986021B2Electronic inhalation apparatus with a chip module fixed with a folding structureINFINEON TECHNOLOGIES AG·Filed 2021·Granted May 21, 2024·1 cites·19 claims
- 2682US10380477B2Chip card and method of forming a chip cardINFINEON TECHNOLOGIES AG·Filed 2017·Granted Aug 13, 2019·4 cites·9 claims
- 2781US8889548B2On-chip RF shields with backside redistribution linesBARTH HANS-JOACHIM·Filed 2011·Granted Nov 18, 2014·4 cites·29 claims
- 2881US7656018B2Package for an electronic component and method for its productionINFINEON TECHNOLOGIES AG·Filed 2006·Granted Feb 2, 2010·10 cites·8 claims
- 2981US6377460B1Electronic circuit having a flexible intermediate layer between electronic components and a heat sinkINFINEON TECHNOLOGIES AG·Filed 2000·Granted Apr 23, 2002·52 cites·13 claims
- 3081US2025060338A1Radiation source deviceINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 3180US7521809B2Semiconductor device having a chip stack on a rewiring plateINFINEON TECHNOLOGIES AG·Filed 2005·Granted Apr 21, 2009·10 cites·24 claims
- 3279US8080880B2Semiconductor device with arrangement of parallel conductor lines being insulated, between and orthogonal to external contact padsBRUNNBAUER MARKUS·Filed 2009·Granted Dec 20, 2011·8 cites·13 claims
- 3379US7422930B2Integrated circuit with re-route layer and stacked die assemblyINFINEON TECHNOLOGIES AG·Filed 2004·Granted Sep 9, 2008·25 cites·60 claims
- 3478US10585034B2Smart card module, method for producing a smart card module, smart card and method for testing a smart card moduleINFINEON TECHNOLOGIES AG·Filed 2018·Granted Mar 10, 2020·1 cites·21 claims
- 3576US10440825B2Chip card module and method for producing a chip card moduleINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2017·Granted Oct 8, 2019·2 cites·13 claims
- 3676US7666777B2Electronic structure with components connected by way of solderable connecting elements and methodINFINEON TECHNOLOGIES AG·Filed 2006·Granted Feb 23, 2010·7 cites·9 claims
- 3776US7312533B2Electronic component with flexible contacting pads and method for producing the electronic componentINFINEON TECHNOLOGIES AG·Filed 2004·Granted Dec 25, 2007·19 cites·38 claims
- 3875US7755178B2Base semiconductor component for a semiconductor component stack and method for the production thereofINFINEON TECHNOLOGIES AG·Filed 2005·Granted Jul 13, 2010·6 cites·15 claims
- 3974US8071428B2Semiconductor devicePOHL JENS·Filed 2009·Granted Dec 6, 2011·5 cites·18 claims
- 4074US2024298714A1Electronic inhalation apparatus with a chip module fixed with a folding structureINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 4173US7397111B2Semiconductor wafer, an electronic component, and a component carrier for producing the electronic componentINFINEON TECHNOLOGIES AG·Filed 2005·Granted Jul 8, 2008·5 cites·17 claims
- 4273US6521988B2Device for packaging electronic componentsINFINEON TECHNOLOGIES AG·Filed 2001·Granted Feb 18, 2003·21 cites·10 claims
- 4372US12405202B2Semiconductor device for particle measurement and method for operating the semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2023·Granted Sep 2, 2025·0 cites·18 claims
- 4472US10157848B2Chip card module arrangement, chip card arrangement and method for producing a chip card arrangementINFINEON TECHNOLOGIES AG·Filed 2015·Granted Dec 18, 2018·2 cites·18 claims
- 4571US7993969B2Method for producing a module with components stacked one above anotherINFINEON TECHNOLOGIES AG·Filed 2006·Granted Aug 9, 2011·4 cites·14 claims
- 4671US6757171B2Device for fixing a heat distribution covering on a printed circuit board with heat distribution coveringINFINEON TECHNOLOGIES AG·Filed 2002·Granted Jun 29, 2004·15 cites·46 claims
- 4770US8330274B2Semiconductor structure and method for making sameBARTH HANS-JOACHIM·Filed 2010·Granted Dec 11, 2012·2 cites·17 claims
- 4870US7514273B2Method for applying rewiring to a panel while compensating for position errors of semiconductor chips in component positions of the panelQIMONDA AG·Filed 2004·Granted Apr 7, 2009·12 cites·23 claims
- 4969US8659135B2Semiconductor device stack and method for its productionBAUER MICHAEL·Filed 2005·Granted Feb 25, 2014·5 cites·8 claims
- 5069US6979591B2Connection of integrated circuitsINFINEON TECHNOLOGIES AG·Filed 2003·Granted Dec 27, 2005·16 cites·9 claims
Showing the top 50 of 111 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →