Inventor · disambiguated record
Jean-Michel Riviere
Also filed as: RIVIERE JEAN-MICHEL
35 granted patents·12 pending applications·61 citations·filing 1999–2024
95Inventor score
Files withST MICROELECTRONICS GRENOBLE 235STMICROELECTRONICS (GRENOBLE 2) SAS4CALHENE2ST MICROELECTRONICS INT NV2PRUVOST JULIEN1
Top patents by PatentIndex Score
47 records- 0189US11322666B2Optoelectronic deviceST MICROELECTRONICS GRENOBLE 2·Filed 2020·Granted May 3, 2022·2 cites·27 claims
- 0289US10996412B2Electronic device comprising an electronic chip provided with an optical cableST MICROELECTRONICS GRENOBLE 2·Filed 2019·Granted May 4, 2021·10 cites·26 claims
- 0388US10777710B2Protection mechanism for light sourceST MICROELECTRONICS GRENOBLE 2·Filed 2019·Granted Sep 15, 2020·2 cites·20 claims
- 0486US10738985B2Housing for light sourceSTMICROELECTRONICS (RESEARCH & DEVELOPMENT) LTD·Filed 2019·Granted Aug 11, 2020·5 cites·20 claims
- 0576US12272922B2Electronic chip support device and corresponding manufacturing methodST MICROELECTRONICS GRENOBLE 2·Filed 2024·Granted Apr 8, 2025·0 cites·20 claims
- 0676US10865962B2Protection mechanism for light sourceST MICROELECTRONICS GRENOBLE 2·Filed 2019·Granted Dec 15, 2020·1 cites·19 claims
- 0775US11437527B2Encapsulation cover for an electronic package and fabrication processST MICROELECTRONICS GRENOBLE 2·Filed 2020·Granted Sep 6, 2022·1 cites·17 claims
- 0874US11211772B2Protection mechanism for light sourceST MICROELECTRONICS GRENOBLE 2·Filed 2019·Granted Dec 28, 2021·1 cites·17 claims
- 0973US11908968B2Optoelectronic deviceST MICROELECTRONICS GRENOBLE 2·Filed 2022·Granted Feb 20, 2024·0 cites·15 claims
- 1071US10941921B2Protection mechanism for light sourceST MICROELECTRONICS GRENOBLE 2·Filed 2019·Granted Mar 9, 2021·1 cites·19 claims
- 1171US2023245984A1Protection of integrated circuitsST MICROELECTRONICS GRENOBLE 2·Filed 2023·Application pending·0 cites
- 1270US11640946B2Protection of integrated circuitsST MICROELECTRONICS GRENOBLE 2·Filed 2021·Granted May 2, 2023·0 cites·8 claims
- 1370US11546059B2Cover for an electronic circuit packageST MICROELECTRONICS GRENOBLE 2·Filed 2021·Granted Jan 3, 2023·0 cites·20 claims
- 1469US11935992B2Electronic device comprising optical electronic components and fabricating processST MICROELECTRONICS GRENOBLE 2·Filed 2022·Granted Mar 19, 2024·0 cites·16 claims
- 1566US10965376B2Cover for an electronic circuit packageST MICROELECTRONICS GRENOBLE 2·Filed 2018·Granted Mar 30, 2021·0 cites·16 claims
- 1665US11641002B2Optical transmission/reception circuitST MICROELECTRONICS GRENOBLE 2·Filed 2021·Granted May 2, 2023·0 cites·19 claims
- 1765US10480994B2Electronic housing including a grooved coverST MICROELECTRONICS GRENOBLE 2·Filed 2017·Granted Nov 19, 2019·1 cites·21 claims
- 1864US11387381B2Optoelectronic deviceST MICROELECTRONICS GRENOBLE 2·Filed 2020·Granted Jul 12, 2022·0 cites·28 claims
- 1963US11916353B2Electronic chip support device and corresponding manufacturing methodST MICROELECTRONICS GRENOBLE 2·Filed 2021·Granted Feb 27, 2024·0 cites·20 claims
- 2061US11740416B2Optoelectronic deviceST MICROELECTRONICS GRENOBLE 2·Filed 2021·Granted Aug 29, 2023·0 cites·22 claims
- 2160US11502227B2Electronic device comprising optical electronic components and fabricating processST MICROELECTRONICS GRENOBLE 2·Filed 2020·Granted Nov 15, 2022·0 cites·18 claims
- 2260US6308749B1Process and device for transfer of sterile products between a container and an isolatorCALHENE·Filed 1999·Granted Oct 30, 2001·28 cites·16 claims
- 2360US2022029034A1Encapsulation cover for an electronic package and fabrication processST MICROELECTRONICS GRENOBLE 2·Filed 2021·Application pending·0 cites
- 2459US11139255B2Protection of integrated circuitsST MICROELECTRONICS ROUSSET·Filed 2019·Granted Oct 5, 2021·0 cites·10 claims
- 2559US2024332210A1Optical package with electromagnetic shieldingST MICROELECTRONICS INT NV·Filed 2024·Application pending·0 cites
- 2658US12274003B2Electronic deviceST MICROELECTRONICS GRENOBLE 2·Filed 2022·Granted Apr 8, 2025·0 cites·21 claims
- 2757US2024404963A1Systems, apparatuses, and methods for back-to-back die for semiconductor packagesST MICROELECTRONICS INT NV·Filed 2023·Application pending·0 cites
- 2855US12288961B2Electronic device comprising a transparent encapsulation structure housing an electronic chip and corresponding production methodST MICROELECTRONICS GRENOBLE 2·Filed 2021·Granted Apr 29, 2025·0 cites·26 claims
- 2955US10978607B2Optical transmission/reception circuitST MICROELECTRONICS GRENOBLE 2·Filed 2019·Granted Apr 13, 2021·0 cites·20 claims
- 3051US11380663B2Electronic device comprising optical electronic components and manufacturing methodST MICROELECTRONICS GRENOBLE 2·Filed 2020·Granted Jul 5, 2022·0 cites·39 claims
- 3149US11038595B2Optical transmission/reception circuitST MICROELECTRONICS GRENOBLE 2·Filed 2019·Granted Jun 15, 2021·0 cites·20 claims
- 3248US2019157469A1Encapsulation cover for an electronic package and fabrication processST MICROELECTRONICS GRENOBLE 2·Filed 2018·Application pending·0 cites
- 3347US10748883B2Encapsulation cover for an electronic package and method of fabricationSTMICROELECTRONICS (GRENOBLE 2) SAS·Filed 2018·Granted Aug 18, 2020·0 cites·5 claims
- 3447US9420685B2Electronic device comprising a substrate board equipped with a local reinforcing or balancing layerSTMICROELECTRONICS (GRENOBLE 2) SAS·Filed 2014·Granted Aug 16, 2016·0 cites·21 claims
- 3546US11527511B2Electronic device comprising a support substrate and stacked electronic chipsST MICROELECTRONICS PTE LTD·Filed 2019·Granted Dec 13, 2022·0 cites·6 claims
- 3645US10998470B2Cover for an electronic circuit packageST MICROELECTRONICS GRENOBLE 2·Filed 2018·Granted May 4, 2021·0 cites·17 claims
- 3745US10903388B2Electronic device comprising electronic chipsST MICROELECTRONICS GRENOBLE 2·Filed 2019·Granted Jan 26, 2021·0 cites·22 claims
- 3845US9101077B2Electronic component package with a heat conductorST MICROELECTRONICS GRENOBLE 2·Filed 2012·Granted Aug 4, 2015·0 cites·20 claims
- 3943US2019189860A1Electronic circuit package coverST MICROELECTRONICS GRENOBLE 2·Filed 2018·Application pending·0 cites
- 4042US2020033537A1Electronic device and assembly which includes optical-wave guidesST MICROELECTRONICS GRENOBLE 2·Filed 2019·Application pending·0 cites
- 4142US2019131481A1Encapsulation cover for an electronic packageST MICROELECTRONICS GRENOBLE 2·Filed 2018·Application pending·0 cites
- 4241US2019267349A1Method for manufacturing a plurality of electronic unitsST MICROELECTRONICS GRENOBLE 2·Filed 2019·Application pending·0 cites
- 4338US9275977B2Electronic system comprising stacked electronic devices provided with integrated-circuit chipsST MICROELECTRONICS GRENOBLE 2·Filed 2014·Granted Mar 1, 2016·0 cites·21 claims
- 4435US6307206B1Integrated, decontamination, tight transfer device using ultraviolet radiationCALHENE·Filed 1999·Granted Oct 23, 2001·9 cites·8 claims
- 4531US2017345805A1Package including stacked die and passive componentSTMICROELECTRONICS (GRENOBLE 2) SAS·Filed 2016·Application pending·0 cites
- 4631US2017317059A1Electronic device with electronic chips and heat sinkSTMICROELECTRONICS (GRENOBLE 2) SAS·Filed 2016·Application pending·0 cites
- 4729US2012133039A1Semiconductor package with thermal via and method of fabricationPRUVOST JULIEN·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →