Inventor · disambiguated record
Jefferson Talledo
Also filed as: TALLEDO JEFFERSON · TALLEDO JEFFERSON SISMUNDO
54 granted patents·8 pending applications·86 citations·filing 2014–2025
97Inventor score
Top patents by PatentIndex Score
62 records- 0196US9972558B1Leadframe package with side solder ball contact and method of manufacturingST MICROELECTRONICS INC·Filed 2017·Granted May 15, 2018·23 cites·20 claims
- 0295US11948868B2Compact leadframe packageST MICROELECTRONICS INC·Filed 2021·Granted Apr 2, 2024·2 cites·18 claims
- 0395US11848256B2Semiconductor package having die pad with cooling finsST MICROELECTRONICS INC·Filed 2021·Granted Dec 19, 2023·2 cites·20 claims
- 0493US11715677B2Semiconductor device with frame having armsST MICROELECTRONICS INC·Filed 2021·Granted Aug 1, 2023·2 cites·20 claims
- 0593US11610851B2Die embedded in substrate with stress bufferST MICROELECTRONICS INC·Filed 2021·Granted Mar 21, 2023·2 cites·20 claims
- 0692US10388594B2Protection from ESD during the manufacturing process of semiconductor chipsST MICROELECTRONICS INC·Filed 2017·Granted Aug 20, 2019·10 cites·21 claims
- 0789US10109563B2Modified leadframe design with adhesive overflow recessesST MICROELECTRONICS INC·Filed 2017·Granted Oct 23, 2018·6 cites·25 claims
- 0889US9947612B2Semiconductor device with frame having arms and related methodsST MICROELECTRONICS INC·Filed 2015·Granted Apr 17, 2018·6 cites·20 claims
- 0985US9165867B1Semiconductor device with lead frame contact solder balls and related methodsST MICROELECTRONICS INC·Filed 2014·Granted Oct 20, 2015·7 cites·18 claims
- 1083US12421108B2Capless semiconductor package with a micro-electromechanical system (mems)ST MICROELECTRONICS INC·Filed 2023·Granted Sep 23, 2025·0 cites·20 claims
- 1181US11031350B2Leadframe with pad anchoring members and method of forming the sameST MICROELECTRONICS INC·Filed 2018·Granted Jun 8, 2021·2 cites·18 claims
- 1280US10615104B2Modified leadframe design with adhesive overflow recessesST MICROELECTRONICS INC·Filed 2018·Granted Apr 7, 2020·2 cites·17 claims
- 1380US10535588B2Die with metallized sidewall and method of manufacturingST MICROELECTRONICS INC·Filed 2017·Granted Jan 14, 2020·3 cites·19 claims
- 1479US11398417B2Semiconductor package having die pad with cooling finsST MICROELECTRONICS INC·Filed 2019·Granted Jul 26, 2022·2 cites·19 claims
- 1579US10957634B2Modified leadframe design with adhesive overflow recessesST MICROELECTRONICS INC·Filed 2020·Granted Mar 23, 2021·1 cites·19 claims
- 1679US9841341B2Package for semiconductor devices sensitive to mechanical and thermo-mechanical stresses, such as MEMS pressure sensorsST MICROELECTRONICS SRL·Filed 2015·Granted Dec 12, 2017·3 cites·23 claims
- 1777US9947636B2Method for making semiconductor device with lead frame made from top and bottom components and related devicesST MICROELECTRONICS INC·Filed 2014·Granted Apr 17, 2018·4 cites·37 claims
- 1876US12170240B2Lead frame for improving adhesive fillets on semiconductor die cornersST MICROELECTRONICS INC·Filed 2023·Granted Dec 17, 2024·0 cites·20 claims
- 1974US2023420390A1Leadframe with pad anchoring members and method of forming the sameST MICROELECTRONICS INC·Filed 2023·Application pending·0 cites
- 2073US11699667B2Leadframe with pad anchoring members and method of forming the sameST MICROELECTRONICS INC·Filed 2021·Granted Jul 11, 2023·0 cites·20 claims
- 2172US9842794B2Semiconductor package with integrated heatsinkST MICROELECTRONICS INC·Filed 2015·Granted Dec 12, 2017·2 cites·24 claims
- 2271US11658098B2Leadframe package with side solder ball contact and method of manufacturingST MICROELECTRONICS INC·Filed 2020·Granted May 23, 2023·0 cites·20 claims
- 2371US11552007B2Modified leadframe design with adhesive overflow recessesST MICROELECTRONICS INC·Filed 2021·Granted Jan 10, 2023·0 cites·20 claims
- 2471US10672689B2Protection from ESD during the manufacturing process of semiconductor chipsST MICROELECTRONICS INC·Filed 2019·Granted Jun 2, 2020·1 cites·20 claims
- 2570US12094725B2Leadframe package with pre-applied filler materialST MICROELECTRONICS INC·Filed 2021·Granted Sep 17, 2024·0 cites·20 claims
- 2669US12494442B2Leadframe with varying thicknesses and method of manufacturing semiconductor packagesST MICROELECTRONICS INC·Filed 2022·Granted Dec 9, 2025·0 cites·20 claims
- 2769US11664239B2Lead frame for improving adhesive fillets on semiconductor die cornersST MICROELECTRONICS INC·Filed 2021·Granted May 30, 2023·0 cites·12 claims
- 2868US10147673B2Tapeless leadframe package with underside resin and solder contactST MICROELECTRONICS INC·Filed 2016·Granted Dec 4, 2018·1 cites·19 claims
- 2966US11897763B2Capless semiconductor package with a micro-electromechanical system (MEMS)ST MICROELECTRONICS INC·Filed 2020·Granted Feb 13, 2024·0 cites·21 claims
- 3065US10008472B2Method for making semiconductor device with sidewall recess and related devicesST MICROELECTRONICS INC·Filed 2015·Granted Jun 26, 2018·1 cites·23 claims
- 3165US9847281B2Leadframe package with stable extended leadsST MICROELECTRONICS INC·Filed 2015·Granted Dec 19, 2017·1 cites·14 claims
- 3264US9578744B2Leadframe package with pre-applied filler materialST MICROELECTRONICS INC·Filed 2014·Granted Feb 21, 2017·1 cites·20 claims
- 3364US2025167067A1Multidie flip chip package with heat sinkST MICROELECTRONICS INT NV·Filed 2024·Application pending·0 cites
- 3463US9490146B2Semiconductor device with encapsulated lead frame contact area and related methodsST MICROELECTRONICS INC·Filed 2014·Granted Nov 8, 2016·1 cites·23 claims
- 3561US10840168B2Leadframe package with side solder ball contact and method of manufacturingST MICROELECTRONICS INC·Filed 2018·Granted Nov 17, 2020·0 cites·20 claims
- 3661US2024274572A1Power leadframe package with lead sidewall surface that is fully solder wettableST MICROELECTRONICS INT NV·Filed 2024·Application pending·0 cites
- 3760US12080657B2Die embedded in substrate with stress bufferST MICROELECTRONICS INC·Filed 2023·Granted Sep 3, 2024·0 cites·20 claims
- 3860US10141246B2Leadframe package with side solder ball contact and method of manufacturingST MICROELECTRONICS INC·Filed 2018·Granted Nov 27, 2018·0 cites·13 claims
- 3959US11037864B2Lead frame for improving adhesive fillets on semiconductor die cornersST MICROELECTRONICS INC·Filed 2019·Granted Jun 15, 2021·0 cites·18 claims
- 4059US2024113064A1Power leadframe package with reduced solder voidsST MICROELECTRONICS INC·Filed 2023·Application pending·0 cites
- 4158US12211772B2Method of manufacturing semiconductor devices and corresponding semiconductor deviceST MICROELECTRONICS SRL·Filed 2022·Granted Jan 28, 2025·0 cites·28 claims
- 4258US11227817B2Compact leadframe packageST MICROELECTRONICS INC·Filed 2019·Granted Jan 18, 2022·0 cites·16 claims
- 4358US10872849B2Tapeless leadframe package with underside resin and solder contactST MICROELECTRONICS INC·Filed 2018·Granted Dec 22, 2020·0 cites·20 claims
- 4458US2023411251A1Thin substrate package and lead frameST MICROELECTRONICS INC·Filed 2023·Application pending·0 cites
- 4558US2025391748A1Lead-frame package with improved lead structureST MICROELECTRONICS INT NV·Filed 2025·Application pending·0 cites
- 4657US2023275008A1Semiconductor package with overlapping leads and die padST MICROELECTRONICS INC·Filed 2023·Application pending·0 cites
- 4756US11133241B2Semiconductor package with a cavity in a die pad for reducing voids in the solderST MICROELECTRONICS INC·Filed 2020·Granted Sep 28, 2021·0 cites·20 claims
- 4856US11004776B2Semiconductor device with frame having arms and related methodsST MICROELECTRONICS INC·Filed 2018·Granted May 11, 2021·0 cites·19 claims
- 4955US11542152B2Semiconductor package with flexible interconnectST MICROELECTRONICS INC·Filed 2020·Granted Jan 3, 2023·0 cites·20 claims
- 5055US2025349680A1Lead-frame package with improved heat dissipationST MICROELECTRONICS INT NV·Filed 2025·Application pending·0 cites
Showing the top 50 of 62 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →