Inventor · disambiguated record
Jen-Yu Wang
Also filed as: WANG JEN YU
31 granted patents·10 pending applications·153 citations·filing 2005–2024
95Inventor score
Files withUNITED MICROELECTRONICS CORP21TAIWAN SEMICONDUCTOR MFG CO LTD12WANG JEN-YU5COOLER MASTER CO LTD3
Top patents by PatentIndex Score
41 records- 0198US11996351B2Packaged semiconductor device including liquid-cooled lid and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 28, 2024·20 cites·20 claims
- 0298US11387164B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 12, 2022·19 cites·20 claims
- 0397US9722093B1Oxide semiconductor transistor and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2016·Granted Aug 1, 2017·47 cites·13 claims
- 0496US11410910B2Packaged semiconductor device including liquid-cooled lid and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 9, 2022·3 cites·20 claims
- 0593US10056463B2Transistor and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2017·Granted Aug 21, 2018·13 cites·18 claims
- 0691US12340830B2Spin-orbit torque magnetic random access memory circuit and layout thereofUNITED MICROELECTRONICS CORP·Filed 2022·Granted Jun 24, 2025·1 cites·6 claims
- 0791US11238912B1Magnetoresistive random-access memoryUNITED MICROELECTRONICS CORP·Filed 2021·Granted Feb 1, 2022·3 cites·11 claims
- 0891US7800903B2Heat-dissipating structure applied to at least one portable electronic deviceCOOLER MASTER CO LTD·Filed 2008·Granted Sep 21, 2010·27 cites·11 claims
- 0988US10483264B2FinFET CMOS device including single diffusion break in each of NMOS and PMOS regionsUNITED MICROELECTRONICS CORP·Filed 2017·Granted Nov 19, 2019·4 cites·6 claims
- 1087US12178052B2MRAM circuit structure and layout structureUNITED MICROELECTRONICS CORP·Filed 2021·Granted Dec 24, 2024·1 cites·9 claims
- 1184US12341081B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jun 24, 2025·0 cites·20 claims
- 1284US9508799B2Substrate of semiconductor device including epitaxial layer and silicon layer having same crystalline orientationUNITED MICROELECTRONICS CORP·Filed 2014·Granted Nov 29, 2016·6 cites·6 claims
- 1380US11901263B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 13, 2024·0 cites·20 claims
- 1477US2024249999A1Packaged Semiconductor Device Including Liquid-Cooled Lid and Methods of Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1576US11631629B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 18, 2023·0 cites·20 claims
- 1676US2025072007A1Mram circuit structure and layout structureUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1775US11699705B2Semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2022·Granted Jul 11, 2023·0 cites·6 claims
- 1875US10651235B12-transistor 2-magnetic tunnel junction (2T2MTJ) MRAM structureUNITED MICROELECTRONICS CORP·Filed 2019·Granted May 12, 2020·4 cites·13 claims
- 1973US11637103B2Semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2021·Granted Apr 25, 2023·0 cites·6 claims
- 2072US11569147B2Method of forming semiconductor package with composite thermal interface material structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 31, 2023·0 cites·20 claims
- 2170US11903325B2Magnetic memory device having shared source line and bit lineUNITED MICROELECTRONICS CORP·Filed 2022·Granted Feb 13, 2024·0 cites·11 claims
- 2264US11171137B2Method of making FinFET CMOS device including single diffusion break in each of NMOS and PMOS regionsUNITED MICROELECTRONICS CORP·Filed 2019·Granted Nov 9, 2021·0 cites·9 claims
- 2361US11955405B2Semiconductor package including thermal interface structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 9, 2024·0 cites·20 claims
- 2460US11355695B2Magnetic memory device having shared source line and bit lineUNITED MICROELECTRONICS CORP·Filed 2020·Granted Jun 7, 2022·0 cites·10 claims
- 2558US11107747B2Semiconductor package with composite thermal interface material structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 31, 2021·0 cites·20 claims
- 2656US2025038073A1Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2753US9312600B2Stylus and antenna thereofWANG JEN-YU·Filed 2013·Granted Apr 12, 2016·1 cites·14 claims
- 2853US2023420337A1Cooling Cover and Packaged Semiconductor Device Including the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2952US11942130B2Bottom-pinned spin-orbit torque magnetic random access memory and method of manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2022·Granted Mar 26, 2024·0 cites·18 claims
- 3050US9793296B2Method for fabricating substrate of semiconductor device including epitaxial layer and silicon layer having same crystalline orientationUNITED MICROELECTRONICS CORP·Filed 2016·Granted Oct 17, 2017·0 cites·9 claims
- 3149US11955154B2Sense amplifier circuit with temperature compensationUNITED MICROELECTRONICS CORP·Filed 2022·Granted Apr 9, 2024·0 cites·10 claims
- 3248US11018185B1Layout pattern for magnetoresistive random access memoryUNITED MICROELECTRONICS CORP·Filed 2020·Granted May 25, 2021·0 cites·8 claims
- 3347US10978122B1Memory including non-volatile cells and current driving circuitUNITED MICROELECTRONICS CORP·Filed 2020·Granted Apr 13, 2021·0 cites·19 claims
- 3447US2021122015A1Ratchet wrench and method for assembling the sameWANG JEN YU·Filed 2019·Application pending·0 cites
- 3544US2007147018A1Folio shielding mechanismCOOLER MASTER CO LTD·Filed 2006·Application pending·0 cites
- 3643US9299839B2PFET and CMOS containing sameUNITED MICROELECTRONICS CORP·Filed 2014·Granted Mar 29, 2016·0 cites·3 claims
- 3743US2016003888A1Method of characterizing a deviceUNITED MICROELECTRONICS CORP·Filed 2014·Application pending·0 cites
- 3842US2021268629A1Ratchet wrenchWANG JEN YU·Filed 2020·Application pending·0 cites
- 3941USD540791SComputer casingCOOLER MASTER CO LTD·Filed 2005·Granted Apr 17, 2007·4 cites·1 claims
- 4040US2008084146A1Media-storing fixed frame, computer casing, and computer hostWANG JEN-YU·Filed 2007·Application pending·0 cites
- 4139US2008001509A1Panel structureWANG JEN-YU·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →