Inventor · disambiguated record
Jeng-Ho Wang
Also filed as: WANG JENG-HO
5 granted patents·2 pending applications·12 citations·filing 2004–2014
71Inventor score
Technology areasH10P
Top patents by PatentIndex Score
7 records- 0176US9107017B1Etching method for manufacturing MEMS deviceUNITED MICROELECTRONICS CORP·Filed 2014·Granted Aug 11, 2015·4 cites·12 claims
- 0273US7759244B2Method for fabricating an inductor structure or a dual damascene structureUNITED MICROELECTRONICS CORP·Filed 2007·Granted Jul 20, 2010·6 cites·14 claims
- 0361US9006105B2Method of patterning platinum layerUNITED MICROELECTRONICS CORP·Filed 2013·Granted Apr 14, 2015·1 cites·15 claims
- 0448US8222143B2Reworking method for integrated circuit devicesLIU YAN-HOME·Filed 2007·Granted Jul 17, 2012·1 cites·19 claims
- 0545US9580297B2Method of using aluminum layer as etching stop layer for patterning a platinum layerUNITED MICROELECTRONICS CORP·Filed 2014·Granted Feb 28, 2017·0 cites·10 claims
- 0642US2006246717A1Method for fabricating a dual damascene and polymer removalWANG JENG-HO·Filed 2006·Application pending·0 cites
- 0736US2006148243A1Method for fabricating a dual damascene and polymer removalWANG JENG-HO·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →