Inventor · disambiguated record
Jhen-Cyuan Li
Also filed as: LI JHEN-CYUAN
15 granted patents·5 pending applications·46 citations·filing 2013–2017
89Inventor score
Top patents by PatentIndex Score
20 records- 0193US8980701B1Method of forming semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2013·Granted Mar 17, 2015·26 cites·20 claims
- 0291US9780218B1Bottom-up epitaxy growth on air-gap bufferUNITED MICROELECTRONICS CORP·Filed 2016·Granted Oct 3, 2017·8 cites·16 claims
- 0386US9899523B2Semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2015·Granted Feb 20, 2018·5 cites·19 claims
- 0477US10158022B2Bottom-up epitaxy growth on air-gap bufferUNITED MICROELECTRONICS CORP·Filed 2017·Granted Dec 18, 2018·2 cites·16 claims
- 0572US9502259B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2014·Granted Nov 22, 2016·2 cites·5 claims
- 0668US9627538B2Fin field effect transistor and method of manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2014·Granted Apr 18, 2017·2 cites·21 claims
- 0765US9373718B2Etching method for forming grooves in Si-substrate and fin field-effect transistorUNITED MICROELECTRONICS CORP·Filed 2014·Granted Jun 21, 2016·1 cites·13 claims
- 0857US9461147B2Semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2014·Granted Oct 4, 2016·0 cites·9 claims
- 0957US9419109B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2014·Granted Aug 16, 2016·0 cites·13 claims
- 1053US9761697B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2016·Granted Sep 12, 2017·0 cites·6 claims
- 1153US9685541B2Method for forming semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2016·Granted Jun 20, 2017·0 cites·11 claims
- 1251US10170624B2Non-planar transistorUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jan 1, 2019·0 cites·7 claims
- 1348US9627541B2Non-planar transistor and method of forming the sameUNITED MICROELECTRONICS CORP·Filed 2015·Granted Apr 18, 2017·0 cites·9 claims
- 1444US2016163829A1Method of forming recess structureUNITED MICROELECTRONICS CORP·Filed 2014·Application pending·0 cites
- 1542US9614034B1Semiconductor structure and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2015·Granted Apr 4, 2017·0 cites·20 claims
- 1638US9978854B2Fin field-effect transistorUNITED MICROELECTRONICS CORP·Filed 2016·Granted May 22, 2018·0 cites·9 claims
- 1735US2017243954A1Method of fabricating finfet deviceUNITED MICROELECTRONICS CORP·Filed 2016·Application pending·0 cites
- 1835US2017338327A1Semiconductor device and manufacturing method thereofUNITED SEMICONDUCTOR (XIAMEN) CO LTD·Filed 2016·Application pending·0 cites
- 1934US2017005015A1Monitor process for lithography and etching processesUNITED MICROELECTRONICS CORP·Filed 2015·Application pending·0 cites
- 2033US2016190011A1Epitaxial structure and process thereof for forming fin-shaped field effect transistorUNITED MICROELECTRONICS CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →