Inventor · disambiguated record
Jin Ho An
Also filed as: AN JIN HO
39 granted patents·11 pending applications·131 citations·filing 2013–2025
97Inventor score
Top patents by PatentIndex Score
50 records- 0196US9865581B2Method of fabricating multi-substrate semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jan 9, 2018·25 cites·20 claims
- 0294US9859191B2Semiconductor device including conductive via with buffer layer at tapered portion of conductive viaLEE HO-JIN·Filed 2016·Granted Jan 2, 2018·12 cites·11 claims
- 0393US11996358B2Semiconductor packages having first and second redistribution patternsSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 28, 2024·2 cites·18 claims
- 0493US11742271B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 29, 2023·4 cites·20 claims
- 0591US8963336B2Semiconductor packages, methods of manufacturing the same, and semiconductor package structures including the sameJUNG DEOK-YOUNG·Filed 2014·Granted Feb 24, 2015·12 cites·20 claims
- 0690US9824973B2Integrated circuit devices having through-silicon via structures and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Nov 21, 2017·7 cites·25 claims
- 0789US9653430B2Semiconductor devices having stacked structures and methods for fabricating the sameKIM TAEYEONG·Filed 2015·Granted May 16, 2017·14 cites·20 claims
- 0888US9852965B2Semiconductor devices with through electrodes and methods of fabricating the sameLEE HO-JIN·Filed 2016·Granted Dec 26, 2017·6 cites·20 claims
- 0986US9691685B2Semiconductor devices and methods of manufacturing the same, and semiconductor packages including the semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jun 27, 2017·4 cites·20 claims
- 1086US9064941B2Semiconductor packages, methods of manufacturing the same, and semiconductor package structures including the sameJUNG DEOK-YOUNG·Filed 2015·Granted Jun 23, 2015·5 cites·11 claims
- 1185US10103098B2Semiconductor devices including a through via structure and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Oct 16, 2018·5 cites·19 claims
- 1285US9076849B2Semiconductor devices and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jul 7, 2015·6 cites·12 claims
- 1383US10833032B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Nov 10, 2020·3 cites·20 claims
- 1483US2025336798A1Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1582US11469202B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 11, 2022·1 cites·20 claims
- 1682US10580726B2Semiconductor devices and semiconductor packages including the same, and methods of manufacturing the semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Mar 3, 2020·3 cites·20 claims
- 1781US12368093B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Jul 22, 2025·0 cites·20 claims
- 1881US11798872B2Interconnection structure and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 24, 2023·1 cites·20 claims
- 1981US11302660B2Semiconductor devices and semiconductor packages including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 12, 2022·1 cites·19 claims
- 2080US11004814B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted May 11, 2021·2 cites·20 claims
- 2180US9543250B2Semiconductor devices including through-silicon viaSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jan 10, 2017·3 cites·5 claims
- 2278US12040294B2Semiconductor devices and semiconductor packages including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jul 16, 2024·0 cites·20 claims
- 2378US9847276B2Semiconductor devices having through-electrodes and methods for fabricating the sameKANG PIL-KYU·Filed 2014·Granted Dec 19, 2017·5 cites·14 claims
- 2477US12424572B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Sep 23, 2025·0 cites·20 claims
- 2577US9287251B2Method of manufacturing a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Mar 15, 2016·3 cites·20 claims
- 2675US2025105116A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2774US11694978B2Semiconductor devices and semiconductor packages including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 4, 2023·0 cites·20 claims
- 2873US9006902B2Semiconductor devices having through silicon vias and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Apr 14, 2015·3 cites·18 claims
- 2973US2024429189A1Semiconductor package deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3071US12476180B2Interconnection structure and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Nov 18, 2025·0 cites·20 claims
- 3171US12014972B2Semiconductor devices including through-silicon-vias and methods of manufacturing the same and semiconductor packages including the semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 18, 2024·0 cites·13 claims
- 3271US8872351B2Semiconductor devices having through electrodesSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Oct 28, 2014·3 cites·6 claims
- 3371US2024290702A1Interconnection structure and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3470US12347760B2Interconnection structure and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jul 1, 2025·0 cites·19 claims
- 3569US11581279B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 14, 2023·0 cites·20 claims
- 3667US10109665B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Oct 23, 2018·1 cites·15 claims
- 3765US12183664B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 31, 2024·0 cites·17 claims
- 3864US11637058B2Interconnection structure and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 25, 2023·0 cites·19 claims
- 3963US11923309B2Semiconductor package including fine redistribution patternsSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 5, 2024·0 cites·20 claims
- 4062US12009288B2Interconnection structure and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 11, 2024·0 cites·19 claims
- 4160US12107063B2Semiconductor package deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 1, 2024·0 cites·13 claims
- 4257US11094612B2Semiconductor devices including through-silicon-vias and methods of manufacturing the same and semiconductor packages including the semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Aug 17, 2021·0 cites·15 claims
- 4353US2022370537A1Pharmaceutical composition and functional health food for treating benign prostatic hyperplasia including laurus nobilis as active ingredient, and method of treating benign prostatic hyperplasia using the sameKOSABIO INC·Filed 2022·Application pending·0 cites
- 4448US11444014B2Semiconductor packages including an insulating layer including a recessed surface and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Sep 13, 2022·0 cites·18 claims
- 4548US2016086874A1Semiconductor devices including through-silicon-vias and methods of manufacturing the same and semiconductor packages including the semiconductor devicesCHOI JU-IL·Filed 2015·Application pending·0 cites
- 4644US2014357077A1Methods for fabricating semiconductor devices having through electrodesSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 4743US2014138819A1Semiconductor device including tsv and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 4839US2018122721A1Plug structure of a semiconductor chip and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Application pending·0 cites
- 4937US2018108540A1Method of forming an interposer and a method of manufacturing a semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Application pending·0 cites
- 5035US2016163590A1Methods of manufacturing semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →