Inventor · disambiguated record
Jinru Bian
Also filed as: BIAN JINRU
12 granted patents·15 pending applications·182 citations·filing 2001–2013
91Inventor score
Files withBIAN JINRU8ROHM & HAAS ELECT MAT8RODEL INC2HOMAX PRODUCTS INC1ROHN AND HAAS ELECTRONIC MATER1
Top patents by PatentIndex Score
27 records- 0192US6679928B2Polishing composition having a surfactantRODEL INC·Filed 2002·Granted Jan 20, 2004·64 cites·16 claims
- 0286US9435120B2Acoustic ceiling popcorn texture materials, systems, and methodsHOMAX PRODUCTS INC·Filed 2013·Granted Sep 6, 2016·13 cites·14 claims
- 0385US6605537B2Polishing of metal substratesRODEL INC·Filed 2001·Granted Aug 12, 2003·35 cites·1 claims
- 0481US7056829B2Polishing composition for semiconductor wafersROHM & HAAS ELECT MAT·Filed 2005·Granted Jun 6, 2006·4 cites·10 claims
- 0578US7491252B2Tantalum barrier removal solutionROHM & HAAS ELECT MAT·Filed 2003·Granted Feb 17, 2009·17 cites·9 claims
- 0675US7842192B2Multi-component barrier polishing solutionROHM & HAAS ELECT MAT·Filed 2006·Granted Nov 30, 2010·5 cites·11 claims
- 0767US7767581B2Barrier polishing fluidROHM & HAAS ELECT MAT·Filed 2006·Granted Aug 3, 2010·2 cites·10 claims
- 0867US7300480B2High-rate barrier polishing compositionROHM & HAAS ELECT MAT·Filed 2003·Granted Nov 27, 2007·13 cites·5 claims
- 0967US7241725B2Barrier polishing fluidROHM & HAAS ELECT MAT·Filed 2003·Granted Jul 10, 2007·10 cites·6 claims
- 1066US6936541B2Method for planarizing metal interconnectsROHN AND HAAS ELECTRONIC MATER·Filed 2003·Granted Aug 30, 2005·13 cites·10 claims
- 1156US2009280724A1Method for Polishing Semiconductor LayersBIAN JINRU·Filed 2009·Application pending·0 cites
- 1253US7790618B2Selective slurry for chemical mechanical polishingROHM & HAAS ELECT MAT·Filed 2004·Granted Sep 7, 2010·4 cites·6 claims
- 1352US2007163998A1Composition for polishing semiconductor layersBIAN JINRU·Filed 2007·Application pending·0 cites
- 1449US2007131899A1Composition for polishing semiconductor layersBIAN JINRU·Filed 2005·Application pending·0 cites
- 1548US7988878B2Selective barrier slurry for chemical mechanical polishingROHM & HAAS ELECT MAT·Filed 2004·Granted Aug 2, 2011·2 cites·9 claims
- 1648US2005056810A1Polishing composition for semiconductor wafersFiled 2003·Application pending·0 cites
- 1746US2010159807A1Polymeric barrier removal polishing slurryBIAN JINRU·Filed 2008·Application pending·0 cites
- 1842US2009031636A1Polymeric barrier removal polishing slurryYE QIANQIU·Filed 2007·Application pending·0 cites
- 1942US2009032765A1Selective barrier polishing slurryBIAN JINRU·Filed 2007·Application pending·0 cites
- 2041US2007298611A1Selective barrier slurry for chemical mechanical polishingBIAN JINRU·Filed 2006·Application pending·0 cites
- 2141US2002042199A1Polishing by CMP for optimized planarizationFiled 2001·Application pending·0 cites
- 2239US2002062600A1Polishing compositionFiled 2001·Application pending·0 cites
- 2337US2005090106A1Method of second step polishing in copper CMP with a polishing fluid containing no oxidizing agentFiled 2003·Application pending·0 cites
- 2437US2005097825A1Compositions and methods for a barrier removalFiled 2003·Application pending·0 cites
- 2535US2011318928A1Polymeric Barrier Removal Polishing SlurryBIAN JINRU·Filed 2010·Application pending·0 cites
- 2635US2003037697A1Second step polishing by CMPFiled 2001·Application pending·0 cites
- 2734US2006135045A1Polishing compositions for reducing erosion in semiconductor wafersBIAN JINRU·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →