Inventor · disambiguated record
Jiajie Cen
Also filed as: CEN JIAJIE
6 granted patents·18 pending applications·2 citations·filing 2020–2025
67Inventor score
Top patents by PatentIndex Score
24 records- 0187US11404313B2Selective tungsten deposition at low temperaturesAPPLIED MATERIALS INC·Filed 2020·Granted Aug 2, 2022·2 cites·18 claims
- 0272US11967525B2Selective tungsten deposition at low temperaturesAPPLIED MATERIALS INC·Filed 2022·Granted Apr 23, 2024·0 cites·15 claims
- 0362US12033846B2Co-deposition of cesium telluride photocathode and X-ray fluorescence controller co-deposition of cesium telluride photocathodeUS ENERGY·Filed 2020·Granted Jul 9, 2024·0 cites·8 claims
- 0459US2024404803A1Microwave preclean apparatus and processing method for impurity removalAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0559US2025157856A1Low-temperature molybdenum capping processesAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0658US12394619B2Metal oxide preclean for bottom-up gapfill in MEOL and BEOLAPPLIED MATERIALS INC·Filed 2023·Granted Aug 19, 2025·0 cites·13 claims
- 0757US12191200B2Methods for minimizing feature-to-feature gap fill height variationsAPPLIED MATERIALS INC·Filed 2021·Granted Jan 7, 2025·0 cites·20 claims
- 0857US2025062160A1Metal implantation to barrier or liner for interconnectAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0957US2025273454A1Microwave assisted passivation layer removalAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1057US2024258164A1Methods of forming interconnect structuresAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1157US2024332075A1Gradient metal liner for interconnect structuresAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1257US2025329538A1Selective plasma assisted deposition of a molybdenum silicideAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1356US11952655B2Electromagnet pulsing effect on PVD step coverageAPPLIED MATERIALS INC·Filed 2022·Granted Apr 9, 2024·0 cites·5 claims
- 1456US2025336715A1Bias modulation for molybdenum oxide reduction in beolAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1556US2024258103A1Plasma treatment of barrier and liner layersAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1655US2024420996A1Selective self-assembled monolayer (sam) removalAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1754US2024194605A1Post-treatment for removing residues from dielectric surfaceAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1854US2024420997A1Selective liner deposition for via resistance reductionAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1953US2025382708A1Methods for using non-plasma microwave in hydrogen ambient to mitigate mo nitridationAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 2053US2024290655A1Selective via-fill with conformal sidewall coverageAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2152US2024006235A1Composite barrier layersAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2251US2024153816A1Methods to form metal liners for interconnectsAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 2351US2024038541A1Methods for removing molybdenum oxides from substratesAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 2449US2025266296A1Integrated methods of manufacturing logic devices and memory devicesAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →