Inventor · disambiguated record
Jiewei Chen
Also filed as: CHEN JIEWEI
16 granted patents·17 pending applications·4 citations·filing 2016–2025
85Inventor score
Top patents by PatentIndex Score
33 records- 0184US11049768B2Methods of forming microelectronic devices, and related microelectronic devices, and electronic systemsMICRON TECHNOLOGY INC·Filed 2019·Granted Jun 29, 2021·4 cites·19 claims
- 0281US2025384929A1Microelectronic devices and related memory devicesMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 0379US2025098126A1Device temperature adjustmentMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 0477US12250812B2Integrated assemblies and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2023·Granted Mar 11, 2025·0 cites·20 claims
- 0577US2025279142A1Memory Arrays Comprising Strings of Memory Cells and Methods Used in Forming a Memory Array Comprising Strings of Memory CellsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 0677US2025261367A1Memory Arrays Comprising Strings Of Memory Cells And Methods Used In Forming A Memory Array Comprising Strings Of Memory CellsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 0773US2025194088A1Integrated Assemblies and Methods of Forming Integrated AssembliesMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 0870US12471281B2Methods used in forming memory arrays having strings of memory cellsMICRON TECHNOLOGY INC·Filed 2022·Granted Nov 11, 2025·0 cites·30 claims
- 0970US12322443B2Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cellsMICRON TECHNOLOGY INC·Filed 2022·Granted Jun 3, 2025·0 cites·41 claims
- 1069US2025201283A1Creating dynamic latches above a three-dimensional non-volatile memory arrayMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 1168US12167579B2Device temperature adjustmentMICRON TECHNOLOGY INC·Filed 2021·Granted Dec 10, 2024·0 cites·15 claims
- 1267US12295140B2Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cellsMICRON TECHNOLOGY INC·Filed 2021·Granted May 6, 2025·0 cites·14 claims
- 1367US11600630B2Integrated assemblies and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2020·Granted Mar 7, 2023·0 cites·19 claims
- 1466US12494251B2Memory circuitry and method used in forming memory circuitryMICRON TECHNOLOGY INC·Filed 2022·Granted Dec 9, 2025·0 cites·19 claims
- 1566US2025356922A1Dynamic latches above a three-dimensional non-volatile memory arrayMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 1665US12406728B2Methods of forming microelectronic devices, and related microelectronic devices, memory devices, and electronic systemsMICRON TECHNOLOGY INC·Filed 2022·Granted Sep 2, 2025·0 cites·28 claims
- 1764US12469778B2Methods used in forming a memory array comprising strings of memory cells and memory arrays comprising strings of memory cellsMICRON TECHNOLOGY INC·Filed 2022·Granted Nov 11, 2025·0 cites·22 claims
- 1864US2025378857A1Memory device including conductive contacts and support structuresMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 1961US12272421B2Creating dynamic latches above a three-dimensional non-volatile memory arrayMICRON TECHNOLOGY INC·Filed 2022·Granted Apr 8, 2025·0 cites·17 claims
- 2061US2025311219A1Methods of forming microelectronic devices including block and sub-block structures, and related electronic devicesMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 2161US2025311218A1Methods of forming microelectronic devices including air gap, and related electronic devices and systemsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 2259US12406731B2Dynamic latches above a three-dimensional non-volatile memory arrayMICRON TECHNOLOGY INC·Filed 2023·Granted Sep 2, 2025·0 cites·20 claims
- 2358US11895834B2Methods used in forming a memory array comprising strings of memory cellsMICRON TECHNOLOGY INC·Filed 2022·Granted Feb 6, 2024·0 cites·25 claims
- 2457US12406932B2Memory circuitry and method used in forming memory circuitryMICRON TECHNOLOGY INC·Filed 2022·Granted Sep 2, 2025·0 cites·34 claims
- 2556US2023397424A1Microelectronic devices comprising a boron-containing material, and related electronic systems and methodsMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 2653US11688689B2Electronic devices including stair step structures, and related memory devices, systems, and methodsMICRON TECHNOLOGY INC·Filed 2021·Granted Jun 27, 2023·0 cites·24 claims
- 2753US2024081076A1Electronic devices including isolation structures exhibiting a weave pattern, and related memory devices, systems, and methodsMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 2851US2023395510A1Microelectronic devices with contacts extending through metal oxide regions of step treads, and related systems and methodsMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 2949US2023051942A1Starch film-forming compositions and methods of their use for preparing capsule shellsSIRIO PHARMA CO LTD·Filed 2021·Application pending·0 cites
- 3047US2024173263A1Soft capsule shells and soft capsulesSIRIO PHARMA CO LTD·Filed 2021·Application pending·0 cites
- 3147US2024293330A1Soft capsule shells and soft capsulesSIRIO PHARMA CO LTD·Filed 2021·Application pending·0 cites
- 3244US2024046989A1Memory Circuitry And Method Used In Forming Memory CircuitryMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 3332US9868114B2Preparation method of fluorine-doped lamellar black titanium dioxide nano materialUNIV NORTH CHINA ELECTRIC POWER·Filed 2016·Granted Jan 16, 2018·0 cites·3 claims
Join the waitlist — get patent alerts
Get an alert when Jiewei Chen files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →