Inventor · disambiguated record
Jia-Jia Chen
Also filed as: Chen jia-jia
3 granted patents·1 pending application·11 citations·filing 2012–2015
58Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0185US9012324B2Through silicon via processChen jia-jia·Filed 2012·Granted Apr 21, 2015·11 cites·15 claims
- 0249US9412653B2Through silicon via (TSV) processUNITED MICROELECTRONICS CORP·Filed 2015·Granted Aug 9, 2016·0 cites·11 claims
- 0347US9136170B2Through silicon via (TSV) structure and process thereofChen jia-jia·Filed 2012·Granted Sep 15, 2015·0 cites·8 claims
- 0432US2013178063A1Method of manufacturing semiconductor device having silicon through viaLIN CHUN-LING·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →