Inventor · disambiguated record
Jin Won Choi
Also filed as: CHOI JIN WON
28 granted patents·25 pending applications·186 citations·filing 1999–2016
96Inventor score
Top patents by PatentIndex Score
53 records- 0193US8740040B2Solder injection headSAMSUNG ELECTRO MECH·Filed 2012·Granted Jun 3, 2014·22 cites·12 claims
- 0293US7875340B2Heat radiation substrate having metal core and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2007·Granted Jan 25, 2011·25 cites·5 claims
- 0392US7595292B2Conjugated biological molecules and their preparationPOLYTHERICS LTD·Filed 2004·Granted Sep 29, 2009·53 cites·8 claims
- 0490US9159693B2Hybrid substrate with high density and low density substrate areas, and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Oct 13, 2015·11 cites·3 claims
- 0581US9292199B2Function execution method and apparatus thereofCHOI JIN-WON·Filed 2009·Granted Mar 22, 2016·12 cites·12 claims
- 0680US8336201B2Method of manufacturing printed circuit board having flow preventing damCHOI JIN WON·Filed 2011·Granted Dec 25, 2012·5 cites·10 claims
- 0780US7893355B2Lead pin for package boardsSAMSUNG ELECTRO MECH·Filed 2008·Granted Feb 22, 2011·10 cites·5 claims
- 0877US8142240B2Lead pin for package substrateOH HEUNG JAE·Filed 2010·Granted Mar 27, 2012·6 cites·2 claims
- 0975US8039761B2Printed circuit board with solder bump on solder pad and flow preventing damSAMSUNG ELECTRO MECH·Filed 2009·Granted Oct 18, 2011·5 cites·7 claims
- 1074US8061025B2Method of manufacturing heat radiation substrate having metal coreCHO SEUNG HYUN·Filed 2010·Granted Nov 22, 2011·2 cites·5 claims
- 1173US8952531B2Packaging method using solder coating ball and package having solder pattern including metal patternSAMSUNG ELECTRO MECH·Filed 2013·Granted Feb 10, 2015·3 cites·4 claims
- 1272US9720070B2Communication device and method for controlling the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Aug 1, 2017·2 cites·19 claims
- 1366US8822841B2Package substrate and fabricating method thereofLEE DONG GYU·Filed 2012·Granted Sep 2, 2014·2 cites·12 claims
- 1466US8159064B2Lead pin for package substrate, and method for manufacturing package substrate with the sameOH HEUNG JAE·Filed 2010·Granted Apr 17, 2012·2 cites·16 claims
- 1565US8708215B2Solder ball supplying apparatusSAMSUNG ELECTRO MECH·Filed 2013·Granted Apr 29, 2014·1 cites·5 claims
- 1663US7952826B2Method operating hard disk drive on the basis of predicted defect using hierarchical clustering and curve fitSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted May 31, 2011·4 cites·19 claims
- 1761US8671564B2Substrate for flip chip bonding and method of fabricating the sameOH HUENG JAE·Filed 2009·Granted Mar 18, 2014·3 cites·8 claims
- 1861US8456003B2Package substrate capable of controlling the degree of warpageLEE DONG GYU·Filed 2010·Granted Jun 4, 2013·1 cites·6 claims
- 1961US2011123612A1Pharmaceutical preparation containing non-dihydropyridine calcium channel blocker and angiotensin-2 receptor blockerKIM SUNG WUK·Filed 2009·Application pending·0 cites
- 2060US8486760B2Method of manufacturing substrate for flip chip and substrate for flip chip manufactured using the sameCHUNG TAE JOON·Filed 2010·Granted Jul 16, 2013·2 cites·11 claims
- 2154US2009184420A1Post bump and method of forming the sameSAMSUNG ELECTROMECHANICS CO LT·Filed 2008·Application pending·0 cites
- 2252US9142499B2Lead pin for package substrateSAMSUNG ELECTRO MECH·Filed 2014·Granted Sep 22, 2015·0 cites·17 claims
- 2352US8835302B2Method of fabricating a package substrateSAMSUNG ELECTRO MECH·Filed 2013·Granted Sep 16, 2014·0 cites·8 claims
- 2452US6258186B1Method for manufacturing hot rolled galvanized steel sheet at high speed, with pickling skippedPO HANG IRON & STEEL·Filed 1999·Granted Jul 10, 2001·15 cites·8 claims
- 2552US2011012261A1Post bump and method of forming the sameSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 2651US8651356B2Solder bump forming apparatus and soldering facility including the sameSAMSUNG ELECTRO MECH·Filed 2012·Granted Feb 18, 2014·0 cites·15 claims
- 2750US2015102488A1Printed circuit board using solder coating ballSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2849US2014138821A1Substrate for flip chip bonding and method of fabricating the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2947US2009025581A1Mask for screen printing and screen printing method using the sameSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 3046US7736952B2Wafer packaging methodSAMSUNG ELECTRO MECH·Filed 2008·Granted Jun 15, 2010·0 cites·8 claims
- 3146US7663826B2Method and apparatus for copying data from one disc drive to another disc driveSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Feb 16, 2010·0 cites·21 claims
- 3246US2010271792A1Electronic component package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 3346US2010270067A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 3445US2011264417A1Spactial modelling system employing bimCHOI JIN WON·Filed 2009·Application pending·0 cites
- 3545US2012100391A1Hot-dip galvanized steel sheet having excellent plating qualities, plating adhesion and spot weldability and manufacturing method thereofLEE JUNG-WOO·Filed 2010·Application pending·0 cites
- 3645US2010044084A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 3745US2010132998A1Substrate having metal post and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 3844US2014076611A1Printed circuit board and method of manufacturing the sameC O SAMSUNG ELECTRO MECHANICS CO LTD·Filed 2013·Application pending·0 cites
- 3944US2013134207A1Solder bump forming apparatus and soldering facility including the sameSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 4043US2015205369A1Rotary-Type Keyboard for Inputting Multiple LanguagesCHOI JIN WON·Filed 2012·Application pending·0 cites
- 4143US2009205854A1Printed circuit board for a package and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 4242US2005182897A1Method for partitioning hard disc drive and hard disc drive adapted theretoSAMSUNG ELECTRONICS CO LTD·Filed 2005·Application pending·0 cites
- 4342US2015042569A1Keyboard for Inputting Multiple Languages Using Detachable KeypadCHOI JIN WON·Filed 2012·Application pending·0 cites
- 4441US2011185122A1Storage system and method of processing data using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2011·Application pending·0 cites
- 4541US2013168144A1Printed circuit board and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 4639US2014103098A1Mask for bumping solder balls on circuit board and solder ball bumping method using the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 4738US8766450B2Lead pin for package substrateLEE KI TAEK·Filed 2010·Granted Jul 1, 2014·0 cites·13 claims
- 4838US2012118621A1Printed circuit board and method for manufacturing the sameCHOI JIN WON·Filed 2011·Application pending·0 cites
- 4937US8785789B2Printed circuit board and method for manufacturing the sameOH HUENG JAE·Filed 2012·Granted Jul 22, 2014·0 cites·10 claims
- 5037US2011133332A1Package substrate and method of fabricating the sameSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
Showing the top 50 of 53 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →