US2015102488A1PendingUtilityA1
Printed circuit board using solder coating ball
Est. expiryAug 6, 2032(~6.1 yrs left)· nominal 20-yr term from priority
H10W 90/724H10W 72/07254H10W 72/07236H10W 72/252H10W 72/242H10W 72/241H10W 72/222H10W 72/072H10W 70/69H10W 90/701H10W 20/0698H01L 2224/16113H01L 24/16H01L 2224/16227H10W 72/20
50
PatentIndex Score
0
Cited by
0
References
0
Claims
Abstract
Disclosed herein a printed circuit board comprising: a plurality of pads formed on a substrate; a solder resist (SR) pattern enclosing a region of the pad and burying another circuit pattern; and a solder pattern including a metal pattern therein using a solder and formed on an upper surface of each of the pads.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A printed circuit board comprising:
a plurality of pads formed on a substrate; a solder resist (SR) pattern enclosing a region of the pad and burying another circuit pattern; and a solder pattern including a metal pattern therein using a solder and formed on an upper surface of each of the pads.
2 . The printed circuit board as set forth in claim 1 , wherein the solder pattern includes a metal pattern made of a conductive metal material in the solder.
3 . The package as set forth in claim 1 , wherein a chip is formed at the same height from an upper surface of the substrate.
4 . The package as set forth in claim 1 , further comprising a post bump between a chip and the solder pattern.
5 . The printed circuit board as set forth in claim 1 , wherein the solder pattern is formed to have a flat upper surface.
6 . The printed circuit board as set forth in claim 1 , wherein the respective cross sections of upper and lower surfaces of the solder pattern are substantially same.Cited by (0)
No later patents cite this yet.
References (0)
No backward citations on record.