Inventor · disambiguated record
Ji Cui
Also filed as: CUI JI · CUI JI JAMES
38 granted patents·21 pending applications·132 citations·filing 2002–2025
96Inventor score
Top patents by PatentIndex Score
59 records- 0190US6867318B1Composition for coating of aluminumNALCO CO·Filed 2004·Granted Mar 15, 2005·31 cites·9 claims
- 0289US9188284B2Natural gas adsorption devicesLUO NIE·Filed 2012·Granted Nov 17, 2015·18 cites·16 claims
- 0389US8372999B2Organically modified silica and use thereofNALCO CO·Filed 2012·Granted Feb 12, 2013·7 cites·21 claims
- 0488US8106229B2Organically modifid silica and use thereofHOLLAND BRIAN T·Filed 2006·Granted Jan 31, 2012·5 cites·13 claims
- 0587US10920107B2Self-stopping polishing composition and method for bulk oxide planarizationCABOT MICROELECTRONICS CORP·Filed 2020·Granted Feb 16, 2021·2 cites·14 claims
- 0687US10619076B2Self-stopping polishing composition and method for bulk oxide planarizationCABOT MICROELECTRONICS CORP·Filed 2019·Granted Apr 14, 2020·2 cites·8 claims
- 0786US11772228B2Chemical mechanical polishing apparatus including a multi-zone platenTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 3, 2023·2 cites·20 claims
- 0886US11679469B2Chemical mechanical planarization toolTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 20, 2023·2 cites·18 claims
- 0985US8282834B2Di- and mono-alkoxysilane functionalized polymers and their application in the Bayer processCUI JI·Filed 2009·Granted Oct 9, 2012·7 cites·8 claims
- 1083US12172263B2Chemical mechanical planarization toolTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 24, 2024·0 cites·20 claims
- 1183US7911029B2Multilayer electronic devices for imbedded capacitorCUI JI·Filed 2009·Granted Mar 22, 2011·12 cites·20 claims
- 1282US7862862B2Water dispersible silanes as corrosion-protection coatings and paint primers for metal pretreatmentNALCO CO·Filed 2006·Granted Jan 4, 2011·3 cites·28 claims
- 1381US10619075B2Self-stopping polishing composition and method for bulk oxide planarizationCABOT MICROELECTRONICS CORP·Filed 2018·Granted Apr 14, 2020·1 cites·10 claims
- 1481US6939625B2Organic light-emitting diodes and methods for assembly and enhanced charge injectionUNIV NORTHWESTERN·Filed 2002·Granted Sep 6, 2005·26 cites·20 claims
- 1580US8455673B2Water dispersible silanesCUI JI·Filed 2010·Granted Jun 4, 2013·2 cites·8 claims
- 1677US2025313723A1Composition and method for polishing and integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1776US12002684B2Methods for chemical mechanical polishing and forming interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 4, 2024·0 cites·20 claims
- 1876US8545776B2Reducing aluminosilicate scale in the Bayer processLA TIMOTHY·Filed 2009·Granted Oct 1, 2013·3 cites·10 claims
- 1976US2024290629A1Methods for chemical mechanical polishing and forming interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2075US2024363361A1Semiconductor processing tool and methods of operationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2174US2024363404A1Ion implant process for defect elimination in metal layer planarizationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2273US8057918B2Organic light-emitting diodes and methods for assembly and enhanced charge injectionMARKS TOBIN J·Filed 2008·Granted Nov 15, 2011·3 cites·20 claims
- 2373US8029752B2Approach in controlling DSP scale in bayer processNALCO CO·Filed 2009·Granted Oct 4, 2011·2 cites·21 claims
- 2473US2024379421A1Slurry composition, semiconductor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2570US12068169B2Semiconductor processing tool and methods of operationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 20, 2024·0 cites·20 claims
- 2669US8623766B2Composition and method for polishing aluminum semiconductor substratesCUI JI·Filed 2011·Granted Jan 7, 2014·2 cites·16 claims
- 2769US2023364733A1Chemical Mechanical Polishing Apparatus Including a Multi-Zone PlatenTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2868US11043151B2Surface treated abrasive particles for tungsten buff applicationsCABOT MICROELECTRONICS CORP·Filed 2017·Granted Jun 22, 2021·1 cites·19 claims
- 2967US11508585B2Methods for chemical mechanical polishing and forming interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 22, 2022·0 cites·20 claims
- 3066US12359090B2Composition and method for polishing and integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 15, 2025·0 cites·20 claims
- 3166US12131944B2Slurry composition, semiconductor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 29, 2024·0 cites·20 claims
- 3266US10639766B2Methods and compositions for processing dielectric substrateCABOT MICROELECTRONICS CORP·Filed 2018·Granted May 5, 2020·0 cites·12 claims
- 3366US2022359277A1Ion implant process for defect elimination in metal layer planarizationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 3465US8889096B2Reducing aluminosilicate scale in the bayer processLA TIMOTHY·Filed 2011·Granted Nov 18, 2014·1 cites·10 claims
- 3561US2025357250A1Method for forming thermal conductor material film and stacking structure formd therewithTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3660US11517995B2Wet chemical heating system and a method of chemical mechanical polishingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 6, 2022·0 cites·20 claims
- 3760US8501010B2Di- and mono-alkoxysilane functionalized polymers and their application in the Bayer processNALCO CO·Filed 2012·Granted Aug 6, 2013·0 cites·18 claims
- 3860US2025234593A1Semiconductor structure with bonding structure and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3959US2025246507A1Semiconductor device, semiconductor package and manufacturing method of semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4058US11718812B2Post-CMP cleaning composition for germanium-containing substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 8, 2023·0 cites·20 claims
- 4158US10029345B2Methods and compositions for processing dielectric substrateCABOT MICROELECTRONICS CORP·Filed 2016·Granted Jul 24, 2018·0 cites·5 claims
- 4258US8053094B2Organic light-emitting diodes and methods for assembly and enhanced charge injectionUNIV NORTHWESTERN·Filed 2009·Granted Nov 8, 2011·0 cites·20 claims
- 4357US11658065B2Chemical mechanical polishing slurry composition, method for chemical mechanical polishing and method for forming connecting structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 23, 2023·0 cites·20 claims
- 4457US2013343970A1Reducing aluminosilicate scale in the bayer processNALCO CO·Filed 2013·Application pending·0 cites
- 4556US12297375B2Slurry composition and method for polishing and integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 13, 2025·0 cites·20 claims
- 4656US2025038073A1Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4755US11450565B2Ion implant process for defect elimination in metal layer planarizationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 20, 2022·0 cites·20 claims
- 4854US2008305244A1Monitoring a coating applied to a metal surfaceCUI JI·Filed 2007·Application pending·0 cites
- 4952US11597854B2Method to increase barrier film removal rate in bulk tungsten slurryCABOT MICROELECTRONICS CORP·Filed 2019·Granted Mar 7, 2023·0 cites·28 claims
- 5051US2014103250A1Composition and method for polishing aluminum semiconductor substratesCABOT MICROELECTRONICS CORP·Filed 2013·Application pending·0 cites
Showing the top 50 of 59 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →