Inventor · disambiguated record
Jianmin Fang
Also filed as: FANG JIANMIN
108 granted patents·39 pending applications·1,244 citations·filing 2003–2025
99Inventor score
Top patents by PatentIndex Score
147 records- 0198US9679863B2Semiconductor device and method of forming interconnect substrate for FO-WLCSPLIN YAOJIAN·Filed 2011·Granted Jun 13, 2017·59 cites·5 claims
- 0298US8796846B2Semiconductor device with a vertical interconnect structure for 3-D FO-WLCSPLIN YAOJIAN·Filed 2009·Granted Aug 5, 2014·108 cites·32 claims
- 0398US8193604B2Semiconductor package with semiconductor core structure and method of forming the sameLIN YAOJIAN·Filed 2010·Granted Jun 5, 2012·152 cites·24 claims
- 0498US7858441B2Semiconductor package with semiconductor core structure and method of forming sameSTATS CHIPPAC LTD·Filed 2008·Granted Dec 28, 2010·75 cites·23 claims
- 0598US7642128B1Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSPSTATS CHIPPAC LTD·Filed 2008·Granted Jan 5, 2010·144 cites·20 claims
- 0697US9548240B2Semiconductor device and method of forming repassivation layer for robust low cost fan-out semiconductor packageSTATS CHIPPAC LTD·Filed 2015·Granted Jan 17, 2017·20 cites·25 claims
- 0797US8445323B2Semiconductor package with semiconductor core structure and method of forming sameLIN YAOJIAN·Filed 2012·Granted May 21, 2013·37 cites·28 claims
- 0897US7772081B2Semiconductor device and method of forming high-frequency circuit structure and method thereofSTATS CHIPPAC LTD·Filed 2008·Granted Aug 10, 2010·67 cites·18 claims
- 0997US7691747B2Semiconductor device and method for forming passive circuit elements with through silicon vias to backside interconnect structuresSTATS CHIPPAC LTD·Filed 2007·Granted Apr 6, 2010·62 cites·19 claims
- 1096US8343809B2Semiconductor device and method of forming repassivation layer with reduced opening to contact pad of semiconductor dieSTATS CHIPPAC LTD·Filed 2010·Granted Jan 1, 2013·23 cites·27 claims
- 1194US11895527B2Method, network device, and system for implementing data processing, and storage mediumZTE CORP·Filed 2021·Granted Feb 6, 2024·2 cites·16 claims
- 1294US8907476B2Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulationLIN YAOJIAN·Filed 2012·Granted Dec 9, 2014·12 cites·24 claims
- 1394US8786100B2Semiconductor device and method of forming repassivation layer with reduced opening to contact pad of semiconductor dieSTATS CHIPPAC LTD·Filed 2012·Granted Jul 22, 2014·14 cites·25 claims
- 1494US8456002B2Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress reliefLIN YAOJIAN·Filed 2011·Granted Jun 4, 2013·13 cites·25 claims
- 1594US8168470B2Semiconductor device and method of forming vertical interconnect structure in substrate for IPD and baseband circuit separated by high-resistivity molding compoundLIN YAOJIAN·Filed 2008·Granted May 1, 2012·28 cites·27 claims
- 1694US7790503B2Semiconductor device and method of forming integrated passive device moduleSTATS CHIPPAC LTD·Filed 2007·Granted Sep 7, 2010·32 cites·22 claims
- 1794US7498024B2Compositions and methods for enhanced expression of immunoglobulins from a single vector using a peptide cleavage siteCELL GENESYS INC·Filed 2004·Granted Mar 3, 2009·32 cites·28 claims
- 1893US12156064B2Reporting measurements for minimization of driving test in wireless communicationZTE CORP·Filed 2022·Granted Nov 26, 2024·2 cites·20 claims
- 1993US12137357B2Method of performance information reportingZTE CORP·Filed 2021·Granted Nov 5, 2024·2 cites·16 claims
- 2093US11255855B1COVID-19 spike-ACE2 binding assay for drug and antibody screeningRAYBIOTECH LIFE INC·Filed 2021·Granted Feb 22, 2022·3 cites·3 claims
- 2193US11249083B1Covid-19 spike-ACE2 binding assay for drug and antibody screeningRAYBIOTECH LIFE INC·Filed 2021·Granted Feb 15, 2022·7 cites·13 claims
- 2293US8445990B2Semiconductor device and method of forming an inductor within interconnect layer vertically separated from semiconductor dieLIN YAOJIAN·Filed 2010·Granted May 21, 2013·18 cites·24 claims
- 2393US8409926B2Semiconductor device and method of forming insulating layer around semiconductor dieLIN YAOJIAN·Filed 2010·Granted Apr 2, 2013·12 cites·24 claims
- 2492US9293401B2Semiconductor device and method for forming a low profile embedded wafer level ball grid array molded laser package (EWLP-MLP)STATS CHIPPAC LTD·Filed 2013·Granted Mar 22, 2016·11 cites·22 claims
- 2592US7750138B2Angiogenesis-inhibiting chimeric protein and the useCHENGDU KANGHONG BIOTECHNOLOGI·Filed 2005·Granted Jul 6, 2010·37 cites·6 claims
- 2692US7714119B2AAV vector compositions and methods for enhanced expression of immunoglobulins using the sameBIOSANTE PHARMACEUTICALS INC·Filed 2005·Granted May 11, 2010·15 cites·17 claims
- 2792US7485291B2Compositions and methods for generating multiple polypeptides from a single vector using a virus derived peptide cleavage site, and uses thereofCELL GENESYS INC·Filed 2003·Granted Feb 3, 2009·33 cites·20 claims
- 2891US7662623B2Compositions and methods for enhanced expression of recombinant polypeptides from a single vector using a peptide cleavage siteBIOSANTE PHARMACEUTICALS INC·Filed 2007·Granted Feb 16, 2010·14 cites·6 claims
- 2990US11105804B1COVID-19 spike-ACE2 binding assay for drug and antibody screeningRayBiotech Life·Filed 2021·Granted Aug 31, 2021·5 cites·3 claims
- 3089US10805849B2Handover method and apparatusZTE CORP·Filed 2019·Granted Oct 13, 2020·4 cites·20 claims
- 3189US7709224B2Compositions and methods for enhanced expression of recombinant polypeptides from a single vector using a peptide cleavage siteBIOSANTE PHARMACEUTICALS INC·Filed 2004·Granted May 4, 2010·19 cites·7 claims
- 3287US10979933B2Method, network device, and system for implementing data processing, and storage mediumZTE CORP·Filed 2019·Granted Apr 13, 2021·3 cites·6 claims
- 3386US8183087B2Semiconductor device and method of forming a fan-out structure with integrated passive device and discrete componentLIN YAOJIAN·Filed 2008·Granted May 22, 2012·12 cites·16 claims
- 3485US9401331B2Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSPSTATS CHIPPAC LTD·Filed 2014·Granted Jul 26, 2016·5 cites·23 claims
- 3585US8310058B2Semiconductor device and method for forming passive circuit elements with through silicon vias to backside interconnect structuresLIN YAOJIAN·Filed 2010·Granted Nov 13, 2012·6 cites·26 claims
- 3685US8193316B2TACI-Fc fusion proteins, methods of making and uses thereofFANG JIANMIN·Filed 2009·Granted Jun 5, 2012·9 cites·15 claims
- 3784US9273137B2FGFR-Fc fusion proteins and the use thereofYANTAI RC BIOTECHNOLOGIES·Filed 2013·Granted Mar 1, 2016·7 cites·6 claims
- 3884US8592311B2Semiconductor device and method for forming passive circuit elements with through silicon vias to backside interconnect structuresLIN YAOJIAN·Filed 2012·Granted Nov 26, 2013·5 cites·24 claims
- 3983US9484259B2Semiconductor device and method of forming protection and support structure for conductive interconnect structureLIN YAOJIAN·Filed 2011·Granted Nov 1, 2016·7 cites·7 claims
- 4083US8843172B2Method and base station for determining an initial transmission powerHE FENG·Filed 2010·Granted Sep 23, 2014·6 cites·15 claims
- 4183US8409970B2Semiconductor device and method of making integrated passive devicesLIN YAOJIAN·Filed 2007·Granted Apr 2, 2013·10 cites·32 claims
- 4283US8263437B2Semiconductor device and method of forming an IPD over a high-resistivity encapsulant separated from other IPDS and baseband circuitLIN YAOJIAN·Filed 2008·Granted Sep 11, 2012·7 cites·29 claims
- 4383US8183095B2Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulationLIN YAOJIAN·Filed 2011·Granted May 22, 2012·4 cites·20 claims
- 4483US8110477B2Semiconductor device and method of forming high-frequency circuit structure and method thereofLIN YAOJIAN·Filed 2010·Granted Feb 7, 2012·6 cites·25 claims
- 4583US7632509B2Methods to express recombinant proteins from lentiviral vectorsBIOSANTE PHARMACEUTICALS INC·Filed 2006·Granted Dec 15, 2009·7 cites·16 claims
- 4682US12375970B2Quality of service implementations for separating user planeZTE CORP·Filed 2023·Granted Jul 29, 2025·0 cites·9 claims
- 4782US9666500B2Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress reliefSTATS CHIPPAC LTD·Filed 2015·Granted May 30, 2017·2 cites·22 claims
- 4882US7935570B2Semiconductor device and method of embedding integrated passive devices into the package electrically interconnected using conductive pillarsSTATS CHIPPAC LTD·Filed 2008·Granted May 3, 2011·9 cites·21 claims
- 4981US9522949B2Fusion protein for antagonizing angiogenesis inducible factors and uses thereofYANTAI RC BIOTECHNOLOGIES·Filed 2013·Granted Dec 20, 2016·7 cites·18 claims
- 5080US11066476B2Asymmetric bispecific antibodyShanghai tongji hospital·Filed 2018·Granted Jul 20, 2021·3 cites·17 claims
Showing the top 50 of 147 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →