Inventor · disambiguated record
Ji Hwan Hwang
Also filed as: HWANG JI-HWAN
22 granted patents·8 pending applications·132 citations·filing 2007–2024
94Inventor score
Top patents by PatentIndex Score
30 records- 0197US11145626B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Oct 12, 2021·19 cites·6 claims
- 0296US11894346B2Semiconductor package having a high reliabilitySAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Feb 6, 2024·2 cites·20 claims
- 0396US11056432B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jul 6, 2021·14 cites·20 claims
- 0496US10886255B2Die stack structure, semiconductor package having the same and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jan 5, 2021·17 cites·20 claims
- 0595US11018115B2Semiconductor package having a high reliabilitySAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 25, 2021·3 cites·19 claims
- 0695US10153255B2Semiconductor package having a high reliabilitySAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Dec 11, 2018·12 cites·19 claims
- 0794US8791562B2Stack package and semiconductor package including the sameLEE CHUNG-SUN·Filed 2011·Granted Jul 29, 2014·34 cites·17 claims
- 0893US10930613B2Semiconductor package having recessed adhesive layer between stacked chipsSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 23, 2021·9 cites·17 claims
- 0991US9893121B2Magnetic memory and method of manufacturing magnetic memoryTOSHIBA MEMORY CORP·Filed 2016·Granted Feb 13, 2018·8 cites·18 claims
- 1090US10622335B2Semiconductor package having a high reliabilitySAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Apr 14, 2020·4 cites·20 claims
- 1186US12183718B2Semiconductor package having a high reliabilitySAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Dec 31, 2024·0 cites·20 claims
- 1286US11664352B2Semiconductor package having a high reliabilitySAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 30, 2023·1 cites·20 claims
- 1385US11581257B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 14, 2023·1 cites·20 claims
- 1484US11545458B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 3, 2023·1 cites·20 claims
- 1578US10971470B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Apr 6, 2021·2 cites·20 claims
- 1675US8742577B2Semiconductor package having an anti-contact layerJEE YOUNG-KUN·Filed 2012·Granted Jun 3, 2014·4 cites·19 claims
- 1772US11088038B2Semiconductor package including test padSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 10, 2021·1 cites·11 claims
- 1863US11887900B2Semiconductor package including test padSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 30, 2024·0 cites·18 claims
- 1963US11887968B2Method of manufacturing a semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 30, 2024·0 cites·12 claims
- 2062US2025022799A1Semiconductor package and fabricating method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2146US2008119061A1Semiconductor chip having bumps of different heights and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 2245US10957833B2Light emitting diode display deviceSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 23, 2021·0 cites·20 claims
- 2345US10483150B2Apparatus for stacking semiconductor chips in a semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Nov 19, 2019·0 cites·19 claims
- 2443US2020135684A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
- 2542US8339561B2Wiring substrate, tape package having the same, and display device having the sameHWANG JI-HWAN·Filed 2009·Granted Dec 25, 2012·0 cites·18 claims
- 2642US2021177026A1Enzyme composition for sugar metabolic regulationHWANG JI HWAN·Filed 2018·Application pending·0 cites
- 2739US2014117536A1Wiring substrate, tape package having the same, and display device having the sameHWANG JI-HWAN·Filed 2012·Application pending·0 cites
- 2838US2012223433A1Semiconductor package including connecting member having controlled content ratio of goldJEE YOUNG-KUN·Filed 2012·Application pending·0 cites
- 2935US2017069835A1Method of manufacturing magnetoresistive memory deviceTOSHIBA KK·Filed 2016·Application pending·0 cites
- 3024US2016087004A1Magnetic memory and method of manufacturing the sameSONODA YASUYUKI·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →