Inventor · disambiguated record
Jiro Kajiwara
Also filed as: KAJIWARA JIRO
20 granted patents·2 pending applications·879 citations·filing 1993–2019
96Inventor score
Files withMULTI PLANAR TECHNOLOGIES INC8MITSUBISHI MATERIALS CORP4CYBEQ SYST INC2EBARA CORP2HORIOKA YUKICHI1
Top patents by PatentIndex Score
22 records- 0196US6558232B1System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal controlMULTI PLANAR TECHNOLOGIES INC·Filed 2000·Granted May 6, 2003·92 cites·27 claims
- 0296US6506105B1System and method for pneumatic diaphragm CMP head having separate retaining ring and multi-region wafer pressure controlMULTI PLANAR TECHNOLOGIES INC·Filed 2000·Granted Jan 14, 2003·105 cites·70 claims
- 0395US6398906B1Wafer transfer apparatus and wafer polishing apparatus, and method for manufacturing waferMITSUBISHI MATERIALS CORP·Filed 2000·Granted Jun 4, 2002·63 cites·14 claims
- 0493US5443416ARotary union for coupling fluids in a wafer polishing apparatusCYBEQ SYST INC·Filed 1993·Granted Aug 22, 1995·148 cites·15 claims
- 0592US6623343B2System and method for CMP head having multi-pressure annular zone subcarrier material removal controlMULTI PLANAR TECHNOLOGIES INC·Filed 2001·Granted Sep 23, 2003·51 cites·38 claims
- 0690US6893327B2Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surfaceMULTI PLANAR TECHNOLOGIES INC·Filed 2001·Granted May 17, 2005·42 cites·43 claims
- 0790US6887132B2Slurry distributor for chemical mechanical polishing apparatus and method of using the sameMULTI PLANAR TECHNOLOGIES INC·Filed 2002·Granted May 3, 2005·44 cites·44 claims
- 0889US5527209AWafer polisher head adapted for easy removal of wafersCYBEQ SYST INC·Filed 1995·Granted Jun 18, 1996·109 cites·26 claims
- 0987US6368189B1Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressureMITSUBISHI MATERIALS CORP·Filed 1999·Granted Apr 9, 2002·75 cites·68 claims
- 1086US7311586B2Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressureEBARA CORP·Filed 2006·Granted Dec 25, 2007·13 cites·9 claims
- 1184US6540590B1Chemical mechanical polishing apparatus and method having a rotating retaining ringMULTI PLANAR TECHNOLOGIES INC·Filed 2000·Granted Apr 1, 2003·26 cites·22 claims
- 1282US6966822B2System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal controlMULTI PLANAR TECHNOLOGIES INC·Filed 2003·Granted Nov 22, 2005·18 cites·13 claims
- 1379US6527625B1Chemical mechanical polishing apparatus and method having a soft backed polishing headMULTI PLANAR TECHNOLOGIES INC·Filed 2000·Granted Mar 4, 2003·21 cites·34 claims
- 1477US7029382B2Apparatus for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressureEBARA CORP·Filed 2001·Granted Apr 18, 2006·17 cites·12 claims
- 1573US6508696B1Wafer-polishing head and polishing apparatus having the sameMITSUBISHI MATERIALS CORP·Filed 2000·Granted Jan 21, 2003·15 cites·8 claims
- 1666US7118456B2Polishing head, retaining ring for use therewith and method fo polishing a substrateMULTIPLANAR TECHNOLOGIES INC·Filed 2003·Granted Oct 10, 2006·13 cites·14 claims
- 1754US6346038B1Wafer loading/unloading device and method for producing wafersMITSUBISHI MATERIALS CORP·Filed 1999·Granted Feb 12, 2002·23 cites·18 claims
- 1853US11554458B2Polishing head, wafer polishing apparatus using the same, and wafer polishing method using the sameSUMCO CORP·Filed 2019·Granted Jan 17, 2023·0 cites·16 claims
- 1947US2006105685A1System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal controlKAJIWARA JIRO·Filed 2005·Application pending·0 cites
- 2044US6641461B2Chemical mechanical polishing apparatus having edge, center and annular zone control of material removalMULTI PLANAR TECHNOLOGYIES INC·Filed 2001·Granted Nov 4, 2003·4 cites·27 claims
- 2142US2005130566A1Slurry distributor for chemical mechanical polishing apparatus and method of using the sameFiled 2005·Application pending·0 cites
- 2234US9250014B2Vacuum storage method and device for crystalline materialHORIOKA YUKICHI·Filed 2011·Granted Feb 2, 2016·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →