Inventor · disambiguated record
Jichul Kim
Also filed as: KIM JICHUL
24 granted patents·4 pending applications·130 citations·filing 2011–2024
95Inventor score
Top patents by PatentIndex Score
28 records- 0194US11675392B2Electronic device including rollable displaySAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 13, 2023·5 cites·23 claims
- 0294US10198049B2Surface temperature management method of mobile device and memory thermal management method of multichip packageSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Feb 5, 2019·9 cites·18 claims
- 0393US9671141B2Thermoelectric cooling packages and thermal management methods thereofSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jun 6, 2017·9 cites·20 claims
- 0493US9228763B2Thermoelectric cooling packages and thermal management methods thereofKIM JAE CHOON·Filed 2012·Granted Jan 5, 2016·18 cites·13 claims
- 0591US9978661B2Packaged semiconductor chips having heat dissipation layers and ground contacts thereinIM YUNHYEOK·Filed 2016·Granted May 22, 2018·12 cites·6 claims
- 0690US9606591B2Surface temperature management method of mobile device and memory thermal management method of multichip packageKWON HEUNGKYU·Filed 2012·Granted Mar 28, 2017·16 cites·7 claims
- 0789US10658266B2Thermoelectric cooling packages and thermal management methods thereofSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted May 19, 2020·3 cites·15 claims
- 0888US9583430B2Package-on-package devicePARK KYOL·Filed 2014·Granted Feb 28, 2017·16 cites·16 claims
- 0983US9391009B2Semiconductor packages including heat exhaust partJANG EON SOO·Filed 2014·Granted Jul 12, 2016·10 cites·19 claims
- 1082US10937771B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 2, 2021·3 cites·17 claims
- 1181US10347611B2Semiconductor packages having redistribution substrateSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jul 9, 2019·4 cites·19 claims
- 1280US9013031B2Semiconductor packages including heat diffusion vias and interconnection viasIM YUNHYEOK·Filed 2014·Granted Apr 21, 2015·6 cites·20 claims
- 1379US9030826B2Chip-on-film packages and device assemblies including the sameKIM JICHUL·Filed 2012·Granted May 12, 2015·6 cites·17 claims
- 1478US11832389B2Printed circuit module and electronic device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 28, 2023·1 cites·19 claims
- 1577US10510737B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Dec 17, 2019·2 cites·12 claims
- 1675US9903764B2Integrated circuit for estimating power of at least one node using temperature and a system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Feb 27, 2018·3 cites·21 claims
- 1772US10985152B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Apr 20, 2021·1 cites·20 claims
- 1872US8988645B2Display devicesKIM JICHUL·Filed 2012·Granted Mar 24, 2015·2 cites·18 claims
- 1968US11600608B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 7, 2023·0 cites·20 claims
- 2062US9651431B2Semiconductor package and method of estimating surface temperature of semiconductor device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted May 16, 2017·2 cites·14 claims
- 2159US2025241866A1Structural design of flexible disks to modulate mechanotransduction mediated by integrin receptorsKIM JICHUL·Filed 2022·Application pending·0 cites
- 2258US8733796B2Robot cleanerLEE JEIHUN·Filed 2011·Granted May 27, 2014·2 cites·11 claims
- 2357US2024334588A1Electronic device comprising plurality of printed circuit boardsSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2454US12302495B2Interposer structure and an electronic device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 13, 2025·0 cites·20 claims
- 2549US12279371B2Printed circuit board assembly and electronic device comprising sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Apr 15, 2025·0 cites·7 claims
- 2648US2018269126A1Semiconductor packages and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Application pending·0 cites
- 2743US9679874B2Semiconductor package and semiconductor device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jun 13, 2017·0 cites·12 claims
- 2839US2013166093A1Electronic device and temperature control method thereofKIM JAE CHOON·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →