Inventor · disambiguated record
Ji-Han Ko
Also filed as: KO JI-HAN
9 granted patents·3 pending applications·29 citations·filing 2009–2024
82Inventor score
Top patents by PatentIndex Score
12 records- 0188US9177886B2Semiconductor package including chip support and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2012·Granted Nov 3, 2015·11 cites·15 claims
- 0283US8698300B2Chip-stacked semiconductor packageKO JI-HAN·Filed 2012·Granted Apr 15, 2014·10 cites·19 claims
- 0378US9171819B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Oct 27, 2015·5 cites·14 claims
- 0474US10847473B2Printed circuit boards with anti-warping molding portions and related semiconductor packages and methods of fabricatingSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Nov 24, 2020·2 cites·10 claims
- 0559US11205637B2Semiconductor packages having improved thermal discharge and electromagnetic shielding characteristicsSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Dec 21, 2021·0 cites·20 claims
- 0659US2025210560A1Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0755US8508044B2Semiconductor package, semiconductor device, and semiconductor moduleKO JI-HAN·Filed 2011·Granted Aug 13, 2013·1 cites·19 claims
- 0853US10797021B2Semiconductor packages having improved thermal discharge and electromagnetic shielding characteristicsSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Oct 6, 2020·0 cites·20 claims
- 0952US12469822B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 11, 2025·0 cites·14 claims
- 1049US11211273B2Carrier substrate and packaging method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Dec 28, 2021·0 cites·11 claims
- 1147US2010155919A1High-density multifunctional PoP-type multi-chip package structureSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 1241US2014103517A1Package substrate structure and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →