Inventor · disambiguated record
Jian Li
Also filed as: LI JIAN · LI JIAN-FENG
132 granted patents·29 pending applications·1,411 citations·filing 1998–2025
99Inventor score
Top patents by PatentIndex Score
161 records- 0198US10978427B2Stacked semiconductor die assemblies with partitioned logic and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2019·Granted Apr 13, 2021·39 cites·20 claims
- 0298US6897936B1Electro-optical glazing structures having scattering and transparent modes of operationINVENTQJAYA SDN BHD·Filed 2000·Granted May 24, 2005·247 cites·5 claims
- 0398US6671008B1Electro-optical glazing structures having scattering and transparent modes of operation and methods and apparatus for making the sameREVEO INC·Filed 2000·Granted Dec 30, 2003·128 cites·11 claims
- 0496US9780079B2Semiconductor die assembly and methods of forming thermal pathsMICRON TECHNOLOGY INC·Filed 2015·Granted Oct 3, 2017·19 cites·24 claims
- 0596US6710823B2Electro-optical glazing structures having reflection and transparent modes of operationREVEO INC·Filed 2001·Granted Mar 23, 2004·76 cites·13 claims
- 0695US9287240B2Stacked semiconductor die assemblies with thermal spacers and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2013·Granted Mar 15, 2016·21 cites·21 claims
- 0795US9058811B2Speech synthesis with fuzzy heteronym prediction using decision treesWANG XI·Filed 2012·Granted Jun 16, 2015·243 cites·10 claims
- 0894US9899293B2Semiconductor device packages with improved thermal management and related methodsMICRON TECHNOLOGY INC·Filed 2017·Granted Feb 20, 2018·9 cites·20 claims
- 0994US9543274B2Semiconductor device packages with improved thermal management and related methodsMICRON TECHNOLOGY INC·Filed 2015·Granted Jan 10, 2017·9 cites·14 claims
- 1093US8735216B2Memory cell constructions, and methods for fabricating memory cell constructionsMICRON TECHNOLOGY INC·Filed 2013·Granted May 27, 2014·14 cites·18 claims
- 1192US11563022B2Memory arrays and methods used in forming a memory array comprising strings of memory cellsMICRON TECHNOLOGY INC·Filed 2019·Granted Jan 24, 2023·6 cites·17 claims
- 1292US9691746B2Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal pathsMICRON TECHNOLOGY INC·Filed 2014·Granted Jun 27, 2017·9 cites·16 claims
- 1392US9153520B2Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methodsGROOTHUIS STEVEN K·Filed 2012·Granted Oct 6, 2015·17 cites·21 claims
- 1492US8431961B2Memory devices with a connecting region having a band gap lower than a band gap of a body regionLIU HAITAO·Filed 2011·Granted Apr 30, 2013·14 cites·27 claims
- 1591US9515002B2Bonding pads with thermal pathwaysMICRON TECHNOLOGY INC·Filed 2015·Granted Dec 6, 2016·6 cites·20 claims
- 1690US11537260B1Graphical indications and selectors for whether object being selected via AR device is real or virtualLENOVO SINGAPORE PTE LTD·Filed 2021·Granted Dec 27, 2022·2 cites·20 claims
- 1790US7009665B2Electro-optical glazing structures having scattering and transparent modes of operation and methods and apparatus for making the sameLI LE·Filed 2003·Granted Mar 7, 2006·46 cites·6 claims
- 1890US6911891B2Bistable actuation techniques, mechanisms, and applicationsMASSACHUSETTS INST TECHNOLOGY·Filed 2002·Granted Jun 28, 2005·90 cites·28 claims
- 1989US11094627B2Methods used in forming a memory array comprising strings of memory cellsMICRON TECHNOLOGY INC·Filed 2019·Granted Aug 17, 2021·4 cites·20 claims
- 2089US10372234B2Calculating a social zone distanceLENOVO SINGAPORE PTE LTD·Filed 2017·Granted Aug 6, 2019·5 cites·19 claims
- 2189US9953710B2Memory devices with a connecting region having a band gap lower than a band gap of a body regionMICRON TECHNOLOGY INC·Filed 2017·Granted Apr 24, 2018·4 cites·17 claims
- 2289US9269646B2Semiconductor die assemblies with enhanced thermal management and semiconductor devices including sameLUO SHIJIAN·Filed 2012·Granted Feb 23, 2016·12 cites·28 claims
- 2389US8972966B2Updating firmware in a hybrid computing environmentKELSO SCOTT E·Filed 2012·Granted Mar 3, 2015·22 cites·20 claims
- 2489US8295557B2Face image processing methodWANG JIN·Filed 2009·Granted Oct 23, 2012·34 cites·4 claims
- 2589US6965420B2Spectrum-controllable reflective polarizers having electrically-switchable modes of operationREVEO INC·Filed 2003·Granted Nov 15, 2005·35 cites·18 claims
- 2688US12287819B2Machine learned models for search and recommendationsMAPLEBEAR INC·Filed 2024·Granted Apr 29, 2025·1 cites·20 claims
- 2787US8766320B2Memory devices with a connecting region having a band gap lower than a band gap of a body regionMICRON TECHNOLOGY INC·Filed 2013·Granted Jul 1, 2014·7 cites·17 claims
- 2886US10163830B2Bonding pads with thermal pathwaysMICRON TECHNOLOGY INC·Filed 2016·Granted Dec 25, 2018·3 cites·20 claims
- 2986US10134655B2Semiconductor device packages with direct electrical connections and related methodsMICRON TECHNOLOGY INC·Filed 2018·Granted Nov 20, 2018·3 cites·20 claims
- 3086US7570037B2Hybrid control methods for digital pulse width modulator (DPWM)VIRGINIA TECH INTELL PROP·Filed 2006·Granted Aug 4, 2009·27 cites·21 claims
- 3185US10551129B2Semiconductor device assembly with vapor chamberMICRON TECHNOLOGY INC·Filed 2019·Granted Feb 4, 2020·3 cites·20 claims
- 3285US9323739B2Identifying words for a contextLENOVO SINGAPORE PTE LTD·Filed 2013·Granted Apr 26, 2016·8 cites·11 claims
- 3384US12027602B2Semiconductor device and method for forming the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Jul 2, 2024·1 cites·12 claims
- 3484US6559903B2Non-absorptive electro-optical glazing structure employing composite infrared reflective polarizing filterREVEO INC·Filed 1998·Granted May 6, 2003·64 cites·12 claims
- 3584US2025338499A1Microelectronic devices with vertically recessed channel structures and discrete, spaced inter-slit structures, and related methodsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 3683US12453149B2Fabricating method of semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2024·Granted Oct 21, 2025·0 cites·6 claims
- 3783US10170389B2Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2015·Granted Jan 1, 2019·3 cites·16 claims
- 3883US8421772B2Resistive touch control device and driving method and driving controller thereofLI JIAN-FENG·Filed 2010·Granted Apr 16, 2013·9 cites·14 claims
- 3982US9197760B2Hand activated mode settingLENOVO SINGAPORE PTE LTD·Filed 2013·Granted Nov 24, 2015·7 cites·19 claims
- 4081US10215500B2Semiconductor device assembly with vapor chamberMICRON TECHNOLOGY INC·Filed 2015·Granted Feb 26, 2019·3 cites·31 claims
- 4181US9520957B2Group recognition and profilingRAMIREZ FLORES AXEL·Filed 2011·Granted Dec 13, 2016·7 cites·20 claims
- 4281US7705577B2Digital power supply controlVIRGINIA TECH INTELL PROP·Filed 2007·Granted Apr 27, 2010·17 cites·19 claims
- 4381US2023395463A1Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal pathsMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 4480US12490447B2Semiconductor device and method for forming the sameUNITED MICROELECTRONICS CORP·Filed 2024·Granted Dec 2, 2025·0 cites·16 claims
- 4580US12213317B2Memory arrays and methods used in forming a memory array comprising strings of memory cellsMICRON TECHNOLOGY INC·Filed 2023·Granted Jan 28, 2025·0 cites·16 claims
- 4678US11239181B2Integrated assembliesMICRON TECHNOLOGY INC·Filed 2019·Granted Feb 1, 2022·2 cites·42 claims
- 4778US2024321727A1Memory arrays comprising operative channel-material strings and dummy pillarsLODESTAR LICENSING GROUP LLC·Filed 2024·Application pending·0 cites
- 4877US11864387B2Memory arrays and methods used in forming a memory array comprising strings of memory cellsMICRON TECHNOLOGY INC·Filed 2022·Granted Jan 2, 2024·0 cites·20 claims
- 4977US11177271B2Device, a method used in forming a circuit structure, a method used in forming an array of elevationally-extending transistors and a circuit structure adjacent theretoMICRON TECHNOLOGY INC·Filed 2017·Granted Nov 16, 2021·2 cites·8 claims
- 5077US10580746B2Bonding pads with thermal pathwaysMICRON TECHNOLOGY INC·Filed 2018·Granted Mar 3, 2020·1 cites·19 claims
Showing the top 50 of 161 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →