Inventor · disambiguated record
Jim Shih-Chun Liang
Also filed as: LIANG JIM S · LIANG JIM SHIH-CHUN
19 granted patents·4 pending applications·30 citations·filing 2014–2023
90Inventor score
Top patents by PatentIndex Score
23 records- 0192US11257750B2E-fuse co-processed with MIM capacitorIBM·Filed 2020·Granted Feb 22, 2022·3 cites·20 claims
- 0291US9589911B1Integrated circuit structure with metal crack stop and methods of forming sameGLOBALFOUNDRIES INC·Filed 2015·Granted Mar 7, 2017·8 cites·12 claims
- 0389US10998263B2Back end of line (BEOL) time dependent dielectric breakdown (TDDB) mitigation within a vertical interconnect access (VIA) level of an integrated circuit (IC) deviceIBM·Filed 2019·Granted May 4, 2021·6 cites·12 claims
- 0488US9589912B1Integrated circuit structure with crack stop and method of forming sameGLOBALFOUNDRIES INC·Filed 2015·Granted Mar 7, 2017·5 cites·11 claims
- 0587US11244850B2On integrated circuit (IC) device simultaneously formed capacitor and resistorIBM·Filed 2019·Granted Feb 8, 2022·4 cites·6 claims
- 0680US10354918B2Contact element structure of a semiconductor deviceGLOBALFOUNDRIES INC·Filed 2019·Granted Jul 16, 2019·2 cites·20 claims
- 0768US10347529B2Interconnect structuresGLOBALFOUNDRIES INC·Filed 2017·Granted Jul 9, 2019·1 cites·20 claims
- 0866US9633946B1Seamless metallization contactsGLOBALFOUNDRIES INC·Filed 2016·Granted Apr 25, 2017·1 cites·20 claims
- 0960US2025192028A1Back end of line interconnect structureIBM·Filed 2023·Application pending·0 cites
- 1057US2025194101A1Stacked mram with super via structuresIBM·Filed 2023·Application pending·0 cites
- 1153US11688680B2MIM capacitor structuresIBM·Filed 2020·Granted Jun 27, 2023·0 cites·17 claims
- 1253US11145591B2Integrated circuit (IC) device integral capacitor and anti-fuseIBM·Filed 2019·Granted Oct 12, 2021·0 cites·12 claims
- 1353US11101213B2EFuse structure with multiple linksIBM·Filed 2020·Granted Aug 24, 2021·0 cites·20 claims
- 1452US10490501B2Method to form interconnect structure with tungsten fillGLOBALFOUNDRIES INC·Filed 2018·Granted Nov 26, 2019·0 cites·11 claims
- 1552US10249534B2Method of forming a contact element of a semiconductor device and contact element structureGLOBALFOUNDRIES INC·Filed 2017·Granted Apr 2, 2019·0 cites·19 claims
- 1651US11437312B2High performance metal insulator metal capacitorIBM·Filed 2020·Granted Sep 6, 2022·0 cites·17 claims
- 1748US10403574B2Method to reduce resistance for a copper (Cu) interconnect landing on multilayered metal contacts, and semiconductor structures formed therefromGLOBALFOUNDRIES INC·Filed 2017·Granted Sep 3, 2019·0 cites·2 claims
- 1848US2018138123A1Interconnect structure and method of forming the sameGLOBALFOUNDRIES INC·Filed 2016·Application pending·0 cites
- 1947US9293365B2Hardmask removal for copper interconnects with tungsten contacts by chemical mechanical polishingIBM·Filed 2014·Granted Mar 22, 2016·0 cites·20 claims
- 2046US2021287984A1On integrated circuit (ic) device capacitor between metal linesIBM·Filed 2020·Application pending·0 cites
- 2144US9991202B2Method to reduce resistance for a copper (CU) interconnect landing on multilayered metal contacts, and semiconductor structures formed therefromIBM·Filed 2015·Granted Jun 5, 2018·0 cites·18 claims
- 2239US10741497B2Contact and interconnect structuresGLOBALFOUNDRIES INC·Filed 2018·Granted Aug 11, 2020·0 cites·9 claims
- 2336US9793216B2Fabrication of IC structure with metal plugGLOBALFOUNDRIES INC·Filed 2016·Granted Oct 17, 2017·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →