Inventor · disambiguated record
Jingmei Liang
Also filed as: LIANG JINGMEI
38 granted patents·18 pending applications·1,872 citations·filing 2007–2025
97Inventor score
Top patents by PatentIndex Score
56 records- 0198US9412581B2Low-K dielectric gapfill by flowable depositionAPPLIED MATERIALS INC·Filed 2014·Granted Aug 9, 2016·396 cites·7 claims
- 0297US8741788B2Formation of silicon oxide using non-carbon flowable CVD processesLIANG JINGMEI·Filed 2010·Granted Jun 3, 2014·61 cites·17 claims
- 0397US8551891B2Remote plasma burn-inLIANG JINGMEI·Filed 2012·Granted Oct 8, 2013·167 cites·20 claims
- 0497US8449942B2Methods of curing non-carbon flowable CVD filmsLIANG JINGMEI·Filed 2010·Granted May 28, 2013·70 cites·18 claims
- 0597US8318584B2Oxide-rich liner layer for flowable CVD gapfillLI DONGQING·Filed 2011·Granted Nov 27, 2012·365 cites·15 claims
- 0697US7803722B2Methods for forming a dielectric layer within trenchesAPPLIED MATERIALS INC·Filed 2007·Granted Sep 28, 2010·573 cites·11 claims
- 0796US11170994B1CD dependent gap fill and conformal filmsAPPLIED MATERIALS INC·Filed 2021·Granted Nov 9, 2021·3 cites·20 claims
- 0896US8647992B2Flowable dielectric using oxide linerLIANG JINGMEI·Filed 2010·Granted Feb 11, 2014·41 cites·15 claims
- 0996US8563445B2Conformal layers by radical-component CVDLIANG JINGMEI·Filed 2011·Granted Oct 22, 2013·49 cites·22 claims
- 1096US8445078B2Low temperature silicon oxide conversionLIANG JINGMEI·Filed 2011·Granted May 21, 2013·19 cites·11 claims
- 1195US7935643B2Stress management for tensile filmsAPPLIED MATERIALS INC·Filed 2009·Granted May 3, 2011·48 cites·9 claims
- 1293US8466067B2Post-planarization densificationLIANG JINGMEI·Filed 2011·Granted Jun 18, 2013·19 cites·19 claims
- 1392US8329587B2Post-planarization densificationLIANG JINGMEI·Filed 2010·Granted Dec 11, 2012·15 cites·16 claims
- 1490US8629067B2Dielectric film growth with radicals produced using flexible nitrogen/hydrogen ratioLIANG JINGMEI·Filed 2010·Granted Jan 14, 2014·11 cites·19 claims
- 1588US8889566B2Low cost flowable dielectric filmsAPPLIED MATERIALS INC·Filed 2012·Granted Nov 18, 2014·9 cites·20 claims
- 1686US9570287B2Flowable film curing penetration depth improvement and stress tuningAPPLIED MATERIALS INC·Filed 2014·Granted Feb 14, 2017·7 cites·20 claims
- 1784US9018108B2Low shrinkage dielectric filmsAPPLIED MATERIALS INC·Filed 2013·Granted Apr 28, 2015·6 cites·20 claims
- 1881US11152248B2Cyclic flowable deposition and high-density plasma treatment processes for high quality gap fill solutionsAPPLIED MATERIALS INC·Filed 2020·Granted Oct 19, 2021·1 cites·20 claims
- 1981US8975152B2Methods of reducing substrate dislocation during gapfill processingAPPLIED MATERIALS INC·Filed 2012·Granted Mar 10, 2015·5 cites·16 claims
- 2078US9404178B2Surface treatment and deposition for reduced outgassingLIANG JINGMEI·Filed 2012·Granted Aug 2, 2016·4 cites·9 claims
- 2177US12046508B2Method of dielectric material fill and treatmentAPPLIED MATERIALS INC·Filed 2023·Granted Jul 23, 2024·0 cites·20 claims
- 2277US10041167B2Cyclic sequential processes for forming high quality thin filmsAPPLIED MATERIALS INC·Filed 2016·Granted Aug 7, 2018·1 cites·12 claims
- 2373US10707116B2Cyclic flowable deposition and high-density plasma treatment processes for high quality gap fill solutionsAPPLIED MATERIALS INC·Filed 2018·Granted Jul 7, 2020·1 cites·20 claims
- 2472US2024404823A1Plasma treatment process to densify oxide layersAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 2571US11804372B2CD dependent gap fill and conformal filmsAPPLIED MATERIALS INC·Filed 2021·Granted Oct 31, 2023·0 cites·11 claims
- 2671US11133177B2Oxidation reduction for SiOC filmAPPLIED MATERIALS INC·Filed 2019·Granted Sep 28, 2021·1 cites·17 claims
- 2767US11615984B2Method of dielectric material fill and treatmentAPPLIED MATERIALS INC·Filed 2020·Granted Mar 28, 2023·0 cites·20 claims
- 2861US12094709B2Plasma treatment process to densify oxide layersAPPLIED MATERIALS INC·Filed 2021·Granted Sep 17, 2024·0 cites·20 claims
- 2959US2025329530A1Dual plasma treatment processAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 3058US11469100B2Methods of post treating dielectric films with microwave radiationAPPLIED MATERIALS INC·Filed 2020·Granted Oct 11, 2022·0 cites·8 claims
- 3156US2024420953A1Systems and methods for improving mechanical strength of low dielectric constant materialsAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 3256US2025218763A1Treating silicon nitride based dielectric filmsAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 3356US2025364210A1Pecvd trench bottom profile control with pulsed dual rf plasmaAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 3455US11967524B23D NAND gate stack reinforcementAPPLIED MATERIALS INC·Filed 2020·Granted Apr 23, 2024·0 cites·19 claims
- 3555US11367614B2Surface roughness for flowable CVD filmAPPLIED MATERIALS INC·Filed 2020·Granted Jun 21, 2022·0 cites·15 claims
- 3655US10934620B2Integration of dual remote plasmas sources for flowable CVDAPPLIED MATERIALS INC·Filed 2017·Granted Mar 2, 2021·0 cites·15 claims
- 3755US2025313948A1High-density plasma (hdp) topography improvement with partial gapfill carbonAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 3855US2025112039A1Seam-free single operation amorphous silicon gap fillAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 3954US11170990B2Polysilicon linersAPPLIED MATERIALS INC·Filed 2020·Granted Nov 9, 2021·0 cites·11 claims
- 4054US11090683B2Cure method for cross-linking Si-hydroxyl bondsAPPLIED MATERIALS INC·Filed 2019·Granted Aug 17, 2021·0 cites·21 claims
- 4154US2024420950A1Densified seam-free silicon-containing material gap fill processesAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 4253US12334337B2Integrated flowable low-k gap-fill and plasma treatmentAPPLIED MATERIALS INC·Filed 2021·Granted Jun 17, 2025·0 cites·16 claims
- 4353US12230499B2Methods of post treating silicon nitride based dielectric films with high energy low dose plasmaAPPLIED MATERIALS INC·Filed 2020·Granted Feb 18, 2025·0 cites·19 claims
- 4452US12374584B2Multi color stack for self aligned dual pattern formation for multi purpose device structuresAPPLIED MATERIALS INC·Filed 2021·Granted Jul 29, 2025·0 cites·19 claims
- 4552US2014329027A1Low temperature flowable curing for stress accommodationAPPLIED MATERIALS INC·Filed 2013·Application pending·0 cites
- 4652US2024331975A1Densified seam-free silicon gap fill processesAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 4749US11107674B2Methods for depositing silicon nitrideAPPLIED MATERIALS INC·Filed 2019·Granted Aug 31, 2021·0 cites·20 claims
- 4849US2012177846A1Radical steam cvdLI DONGQING·Filed 2011·Application pending·0 cites
- 4948US2022375747A1Flowable CVD Film Defect ReductionAPPLIED MATERIALS INC·Filed 2021·Application pending·0 cites
- 5042US2021280451A1Low temperature steam free oxide gapfillAPPLIED MATERIALS INC·Filed 2020·Application pending·0 cites
Showing the top 50 of 56 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →