Inventor · disambiguated record
Jingbao Liu
Also filed as: LIU JINGBAO
16 granted patents·6 pending applications·795 citations·filing 2000–2013
94Inventor score
Files withAPPLIED MATERIALS INC14PALAGASHVILI DAVID2BELOSTOTSKIY SERGEY G1BELOSTOTSKIY SERGY G1KIM JONG MUN1
Top patents by PatentIndex Score
22 records- 0197US7316761B2Apparatus for uniformly etching a dielectric layerAPPLIED MATERIALS INC·Filed 2003·Granted Jan 8, 2008·178 cites·20 claims
- 0297US6403491B1Etch method using a dielectric etch chamber with expanded process windowAPPLIED MATERIALS INC·Filed 2000·Granted Jun 11, 2002·396 cites·24 claims
- 0393US6451703B1Magnetically enhanced plasma etch process using a heavy fluorocarbon etching gasAPPLIED MATERIALS INC·Filed 2000·Granted Sep 17, 2002·96 cites·47 claims
- 0491US8187415B2Plasma etch reactor with distribution of etch gases across a wafer surface and a polymer oxidizing gas in an independently fed center gas zoneKIM JONG MUN·Filed 2006·Granted May 29, 2012·20 cites·9 claims
- 0587US7879186B2Method and apparatus for shaping a magnetic field in a magnetic field-enhanced plasma reactorAPPLIED MATERIALS INC·Filed 2008·Granted Feb 1, 2011·7 cites·8 claims
- 0684US6613689B2Magnetically enhanced plasma oxide etch using hexafluorobutadieneAPPLIED MATERIALS INC·Filed 2002·Granted Sep 2, 2003·38 cites·52 claims
- 0782US7807064B2Halogen-free amorphous carbon mask etch having high selectivity to photoresistAPPLIED MATERIALS INC·Filed 2007·Granted Oct 5, 2010·8 cites·17 claims
- 0881US8840725B2Chamber with uniform flow and plasma distributionPALAGASHVILI DAVID·Filed 2010·Granted Sep 23, 2014·8 cites·17 claims
- 0979US7422654B2Method and apparatus for shaping a magnetic field in a magnetic field-enhanced plasma reactorAPPLIED MATERIALS INC·Filed 2004·Granted Sep 9, 2008·11 cites·35 claims
- 1070US7736914B2Plasma control using dual cathode frequency mixing and controlling the level of polymer formationAPPLIED MATERIALS INC·Filed 2007·Granted Jun 15, 2010·3 cites·20 claims
- 1166US7838430B2Plasma control using dual cathode frequency mixingAPPLIED MATERIALS INC·Filed 2004·Granted Nov 23, 2010·8 cites·27 claims
- 1264US6787475B2Flash step preparatory to dielectric etchFiled 2002·Granted Sep 7, 2004·12 cites·34 claims
- 1362US7105442B2Ashable layers for reducing critical dimensions of integrated circuit featuresAPPLIED MATERIALS INC·Filed 2002·Granted Sep 12, 2006·9 cites·8 claims
- 1459US9443753B2Apparatus for controlling the flow of a gas in a process chamberPALAGASHVILI DAVID·Filed 2011·Granted Sep 13, 2016·1 cites·15 claims
- 1553US2008286979A1Method of controlling sidewall profile by using intermittent, periodic introduction of cleaning species into the main plasma etching speciesAPPLIED MATERIALS INC·Filed 2008·Application pending·0 cites
- 1651US2014034241A1Temperature enhanced electrostatic chucking in plasma processing apparatusBELOSTOTSKIY SERGY G·Filed 2013·Application pending·0 cites
- 1750US2007000611A1Plasma control using dual cathode frequency mixingAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 1849US2007243714A1Method of controlling silicon-containing polymer build up during etching by using a periodic cleaning stepAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 1948US8936696B2Method and apparatus for shaping a magnetic field in a magnetic field-enhanced plasma reactorLINDLEY ROGER ALAN·Filed 2011·Granted Jan 20, 2015·0 cites·20 claims
- 2044US8580693B2Temperature enhanced electrostatic chucking in plasma processing apparatusBELOSTOTSKIY SERGEY G·Filed 2011·Granted Nov 12, 2013·0 cites·19 claims
- 2142US2007249173A1Plasma etch process using etch uniformity control by using compositionally independent gas feedAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 2240US2008203056A1Methods for etching high aspect ratio featuresWANG JUDY·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →