Inventor · disambiguated record
Jingwen Lu
Also filed as: LU JINGWEN
45 granted patents·17 pending applications·13 citations·filing 2003–2023
95Inventor score
Files withCHANGXIN MEMORY TECH INC45NEC CORP12SONY CORP2ANHEART THERAPEUTICS HANGZHOU CO LTD1GUREVICH OLGA IOSIFOVNA1
Top patents by PatentIndex Score
62 records- 0190US12114484B2Buried bit line structure, manufacturing method thereof, and semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2022·Granted Oct 8, 2024·2 cites·20 claims
- 0285US12165874B2Semiconductor structure and forming method thereofCHANGXIN MEMORY TECH INC·Filed 2022·Granted Dec 10, 2024·1 cites·16 claims
- 0379US2024055091A1Method for calculating a degree of fatigueNEC CORP·Filed 2023·Application pending·0 cites
- 0479US2024339188A1Method for calculating a degree of fatigueNEC CORP·Filed 2023·Application pending·0 cites
- 0579US2024013877A1Method for calculating a degree of fatigueNEC CORP·Filed 2023·Application pending·0 cites
- 0669US11856754B2Method of manufacturing semiconductor structure, semiconductor structure, and memoryCHANGXIN MEMORY TECH INC·Filed 2023·Granted Dec 26, 2023·0 cites·15 claims
- 0767US2023386630A1Information processing device, control method, and storage mediumNEC CORP·Filed 2020·Application pending·0 cites
- 0866US12426252B2Semiconductor structure comprising buried gate structure and isolation structure with air gap and method for manufacturing semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2022·Granted Sep 23, 2025·0 cites·10 claims
- 0966US12356609B2Buried bit line structure, method for fabricating buried bit line structure, and memoryCHANGXIN MEMORY TECH INC·Filed 2022·Granted Jul 8, 2025·0 cites·10 claims
- 1065US12356608B2Semiconductor structure and manufacturing method thereofCHANGXIN MEMORY TECH INC·Filed 2022·Granted Jul 8, 2025·0 cites·15 claims
- 1164US12513894B2Semiconductor structure, method for manufacturing semiconductor structure, and memoryCHANGXIN MEMORY TECH INC·Filed 2022·Granted Dec 30, 2025·0 cites·18 claims
- 1262US12225714B2Semiconductor structure and manufacturing method thereofCHANGXIN MEMORY TECH INC·Filed 2022·Granted Feb 11, 2025·0 cites·20 claims
- 1362US12004342B2Method for manufacturing semiconductor structure and semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2021·Granted Jun 4, 2024·0 cites·19 claims
- 1461US12408329B2Method for manufacturing semiconductor structure, semiconductor structure, and semiconductor memoryCHANGXIN MEMORY TECH INC·Filed 2023·Granted Sep 2, 2025·0 cites·15 claims
- 1561US12082392B2Semiconductor structure and method for preparing seminconductor structureCHANGXIN MEMORY TECH INC·Filed 2021·Granted Sep 3, 2024·0 cites·20 claims
- 1661US11856755B2Method for manufacturing memory and memoryCHANGXIN MEMORY TECH INC·Filed 2021·Granted Dec 26, 2023·0 cites·10 claims
- 1760US12513968B2Semiconductor structure and method for manufacturing sameCHANGXIN MEMORY TECH INC·Filed 2023·Granted Dec 30, 2025·0 cites·18 claims
- 1860US12114481B2Method for manufacturing semiconductor structure having conductive block connected to transistor on the substrateCHANGXIN MEMORY TECH INC·Filed 2021·Granted Oct 8, 2024·0 cites·14 claims
- 1960US2023389301A1Method of manufacturing semiconductor structure and semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2023·Application pending·0 cites
- 2059US12089399B2Method for manufacturing memory and memoryCHANGXIN MEMORY TECH INC·Filed 2021·Granted Sep 10, 2024·0 cites·13 claims
- 2159US11955371B2Semiconductor device and method for preparing semiconductor deviceCHANGXIN MEMORY TECH INC·Filed 2021·Granted Apr 9, 2024·0 cites·19 claims
- 2258US12342525B2Method for manufacturing semiconductor structure and semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2022·Granted Jun 24, 2025·0 cites·17 claims
- 2358US2024021518A1Method for fabricating semiconductor structure, and semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2023·Application pending·0 cites
- 2457US12513883B2Dram structure and method for forming sameCHANGXIN MEMORY TECH INC·Filed 2022·Granted Dec 30, 2025·0 cites·17 claims
- 2557US12284799B2Memory, semiconductor structure and method for forming sameCHANGXIN MEMORY TECH INC·Filed 2022·Granted Apr 22, 2025·0 cites·13 claims
- 2657US12150295B2Method for manufacturing a memory using a plurality of sacrificial pillarsCHANGXIN MEMORY TECH INC·Filed 2022·Granted Nov 19, 2024·0 cites·17 claims
- 2757US12089401B2Semiconductor structure and preparation method thereofCHANGXIN MEMORY TECH INC·Filed 2022·Granted Sep 10, 2024·0 cites·9 claims
- 2857US12040227B2Semiconductor structure and method for manufacturing sameCHANGXIN MEMORY TECH INC·Filed 2021·Granted Jul 16, 2024·0 cites·10 claims
- 2957US11990331B2Method for forming silicon dioxide film and method for forming metal gateCHANGXIN MEMORY TECH INC·Filed 2021·Granted May 21, 2024·0 cites·18 claims
- 3057US11825646B2Method for manufacturing semiconductor structure and semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2021·Granted Nov 21, 2023·0 cites·15 claims
- 3156US12224205B2Semiconductor memory device and manufacturing method thereofCHANGXIN MEMORY TECH INC·Filed 2022·Granted Feb 11, 2025·0 cites·18 claims
- 3256US7353174B2System and method for effectively implementing a Mandarin Chinese speech recognition dictionarySONY CORP·Filed 2003·Granted Apr 1, 2008·5 cites·41 claims
- 3355US12219754B2Manufacturing method of semiconductor structure and structure thereofCHANGXIN MEMORY TECH INC·Filed 2022·Granted Feb 4, 2025·0 cites·14 claims
- 3455US11417533B1Manufacturing method of semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2022·Granted Aug 16, 2022·0 cites·15 claims
- 3555US2023072310A1Method for forming semiconductor structure and semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2022·Application pending·0 cites
- 3654US12225708B2Semiconductor device, method of manufacturing semiconductor device and electronic deviceCHANGXIN MEMORY TECH INC·Filed 2022·Granted Feb 11, 2025·0 cites·14 claims
- 3754US12183622B2Semiconductor structure comprising an air chamber and method of manufacturing the sameCHANGXIN MEMORY TECH INC·Filed 2022·Granted Dec 31, 2024·0 cites·10 claims
- 3854US12096618B2Method of manufacturing semiconductor structure and semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2022·Granted Sep 17, 2024·0 cites·13 claims
- 3954US11800700B2Memory and its manufacturing methodCHANGXIN MEMORY TECH INC·Filed 2021·Granted Oct 24, 2023·0 cites·14 claims
- 4054US7353173B2System and method for Mandarin Chinese speech recognition using an optimized phone setSONY CORP·Filed 2003·Granted Apr 1, 2008·4 cites·41 claims
- 4153US12108590B2Semiconductor storage device and forming method thereofCHANGXIN MEMORY TECH INC·Filed 2022·Granted Oct 1, 2024·0 cites·15 claims
- 4253US12002707B2Semiconductor structure and manufacturing method thereofCHANGXIN MEMORY TECH INC·Filed 2021·Granted Jun 4, 2024·0 cites·12 claims
- 4353US11895821B2Semiconductor structure and manufacturing method thereofCHANGXIN MEMORY TECH INC·Filed 2021·Granted Feb 6, 2024·0 cites·20 claims
- 4453US11856757B2Method for manufacturing semiconductor structure with capacitor wiresCHANGXIN MEMORY TECH INC·Filed 2021·Granted Dec 26, 2023·0 cites·10 claims
- 4553US11800699B2Semiconductor structure with chamfered capacitor connection line adjacent bit line and method for manufacturing semiconductor structure thereofCHANGXIN MEMORY TECH INC·Filed 2021·Granted Oct 24, 2023·0 cites·16 claims
- 4652US12193213B2Semiconductor structure and method of manufacturing sameCHANGXIN MEMORY TECH INC·Filed 2021·Granted Jan 7, 2025·0 cites·6 claims
- 4751US12381115B2Method for fabricating semiconductor structure, and semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2021·Granted Aug 5, 2025·0 cites·15 claims
- 4850US12120867B2Manufacturing method of semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2021·Granted Oct 15, 2024·0 cites·11 claims
- 4949US12108594B2Semiconductor device manufacturing method comprising first conductive layer with increased roughness in array regionCHANGXIN MEMORY TECH INC·Filed 2021·Granted Oct 1, 2024·0 cites·8 claims
- 5049US11929282B2Method for preparing semiconductor structure and semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2021·Granted Mar 12, 2024·0 cites·15 claims
Showing the top 50 of 62 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Jingwen Lu files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →