Inventor · disambiguated record
Jin Young Ock
Also filed as: OCK JIN YOUNG
1 granted patent·1 pending application·3 citations·filing 2013–2016
21Inventor score
Files withHANA MICRON INC2
Top patents by PatentIndex Score
2 records- 0175US10679930B2Metal core solder ball interconnector fan-out wafer level packageHANA MICRON INC·Filed 2016·Granted Jun 9, 2020·3 cites·6 claims
- 0226US2015359098A1Circuit Board Having Interposer Embedded Therein, Electronic Module Using Same, and Method for Manufacturing SameHANA MICRON INC·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →