Inventor · disambiguated record
Jieh-Hwa Shyu
Also filed as: SHYU JIEH H · SHYU JIEH-HWA
26 granted patents·4 pending applications·599 citations·filing 1986–2013
97Inventor score
Top patents by PatentIndex Score
30 records- 0197US7740024B2System and method for flow monitoring and controlENTEGRIS INC·Filed 2005·Granted Jun 22, 2010·70 cites·13 claims
- 0295US6596148B1Regeneration of plating baths and system thereforeMYKROLIS CORP·Filed 2000·Granted Jul 22, 2003·66 cites·32 claims
- 0395US6383352B1Spiral anode for metal plating bathsMYKROLIS CORP·Filed 2000·Granted May 7, 2002·49 cites·12 claims
- 0491US6942779B2Method and system for regenerating of plating bathsMYKROLIS CORP·Filed 2002·Granted Sep 13, 2005·36 cites·31 claims
- 0590US7610117B2System and method for flow monitoring and controlENTEGRIS INC·Filed 2005·Granted Oct 27, 2009·20 cites·20 claims
- 0690US6973375B2System and method for flow monitoring and controlMYKROLIS CORP·Filed 2004·Granted Dec 6, 2005·39 cites·55 claims
- 0790US6391209B1Regeneration of plating bathsMYKROLIS CORP·Filed 2000·Granted May 21, 2002·104 cites·34 claims
- 0887US8015995B2System and method for flow monitoring and controlENTEGRIS INC·Filed 2010·Granted Sep 13, 2011·7 cites·20 claims
- 0985US7249628B2Apparatus for conditioning the temperature of a fluidENTEGRIS INC·Filed 2002·Granted Jul 31, 2007·58 cites·19 claims
- 1082US8155896B2Fluid flow measuring and proportional fluid flow control deviceWARGO CHRISTOPHER·Filed 2011·Granted Apr 10, 2012·8 cites·20 claims
- 1181US4964959AProcess for preparing a nonconductive substrate for electroplatingOLIN HUNT SPECIALTY PROD·Filed 1990·Granted Oct 23, 1990·32 cites·28 claims
- 1275US6617079B1Process and system for determining acceptibility of a fluid dispenseMYKROLIS CORP·Filed 2000·Granted Sep 9, 2003·23 cites·24 claims
- 1375US5106537ALiquid dispersion for enhancing the electroplating of a non-conductive surfaceOLIN HUNT SUB III CORP·Filed 1990·Granted Apr 21, 1992·25 cites·12 claims
- 1473US7447600B2Fluid flow measuring and proportional fluid flow control deviceENTEGRIS INC·Filed 2007·Granted Nov 4, 2008·6 cites·12 claims
- 1571US7963401B2Atmospheric pressure microwave plasma treated porous membranesENTEGRIS INC·Filed 2007·Granted Jun 21, 2011·4 cites·9 claims
- 1671US7292945B2Fluid flow measuring and proportional fluid flow control deviceENTEGRIS INC·Filed 2003·Granted Nov 6, 2007·12 cites·16 claims
- 1766US7387661B2Pleated construction for effecting gas transfer membraneENTEGRIS INC·Filed 2004·Granted Jun 17, 2008·10 cites·16 claims
- 1864US2008067074A1Device and method for increasing mass transport at liquid-solid diffusion boundary layerWU QUNWEI·Filed 2007·Application pending·0 cites
- 1960US8668093B2Atmospheric pressure microwave plasma treated porous membranesGE JIJUN·Filed 2011·Granted Mar 11, 2014·1 cites·18 claims
- 2059US7316728B2Method and apparatus for treating fluidsENTEGRIS INC·Filed 2003·Granted Jan 8, 2008·8 cites·10 claims
- 2158US7885773B2Fluid flow measuring and proportional fluid flow control deviceENTEGRIS INC·Filed 2008·Granted Feb 8, 2011·2 cites·15 claims
- 2257US8789708B2Atmospheric pressure microwave plasma treated porous membranesENTEGRIS INC·Filed 2013·Granted Jul 29, 2014·0 cites·4 claims
- 2353US2007289732A1Apparatus for conditioning the temperature of a fluidPILLION JOHN E·Filed 2007·Application pending·0 cites
- 2451US7311808B2Device and method for increasing mass transport at liquid-solid diffusion boundary layerENTEGRIS INC·Filed 2003·Granted Dec 25, 2007·0 cites·27 claims
- 2544US4687554AElectrolytic apparatus and processOMI INT CORP·Filed 1986·Granted Aug 18, 1987·5 cites·4 claims
- 2641US4773983AElectrolytic apparatus and processOMI INT CORP·Filed 1987·Granted Sep 27, 1988·8 cites·15 claims
- 2740US4962004AMethod of inhibiting electrochemical reduction of polyimide during electroplating and articles formed therebyDIGITAL EQUIPMENT CORP·Filed 1989·Granted Oct 9, 1990·3 cites·14 claims
- 2836US5077136ADiffusion barrier for solvents and inorganic cations on polyimide surfaces by ammonia treatmentDIGITAL EQUIPMENT CORP·Filed 1989·Granted Dec 31, 1991·3 cites·12 claims
- 2936US2004224511A1Metal polishingFiled 2002·Application pending·0 cites
- 3036US2004197541A1Selective electroless deposition and interconnects made therefromFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →