Inventor · disambiguated record
Jinbang Tang
Also filed as: TANG JINBANG
40 granted patents·7 pending applications·366 citations·filing 2005–2024
97Inventor score
Top patents by PatentIndex Score
47 records- 0197US7651889B2Electromagnetic shield formation for integrated circuit die packageFREESCALE SEMICONDUCTOR INC·Filed 2007·Granted Jan 26, 2010·100 cites·20 claims
- 0297US7648858B2Methods and apparatus for EMI shielding in multi-chip modulesFREESCALE SEMICONDUCTOR INC·Filed 2007·Granted Jan 19, 2010·59 cites·12 claims
- 0395US8407890B2Method of manufacting an electronic device module with integrated antenna structureTANG JINBANG·Filed 2010·Granted Apr 2, 2013·19 cites·17 claims
- 0495US7763976B2Integrated circuit module with integrated passive deviceFREESCALE SEMICONDUCTOR INC·Filed 2008·Granted Jul 27, 2010·38 cites·19 claims
- 0595US7145084B1Radiation shielded module and method of shielding microelectronic deviceFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Dec 5, 2006·45 cites·10 claims
- 0691US8283764B2Microelectronic assembly with an embedded waveguide adapter and method for forming the sameTANG JINBANG·Filed 2012·Granted Oct 9, 2012·12 cites·20 claims
- 0788US7981730B2Integrated conformal shielding method and process using redistributed chip packagingFREESCALE SEMICONDUCTOR INC·Filed 2008·Granted Jul 19, 2011·17 cites·17 claims
- 0887US7842546B2Integrated circuit module and method of packaging sameFREESCALE SEMICONDUCTOR INC·Filed 2010·Granted Nov 30, 2010·8 cites·20 claims
- 0985US7838420B2Method for forming a packaged semiconductor deviceFREESCALE SEMICONDUCTOR INC·Filed 2007·Granted Nov 23, 2010·10 cites·13 claims
- 1084US8293588B2Method of providing an electronic device including dies, a dielectric layer, and an encapsulating layerTANG JINBANG·Filed 2011·Granted Oct 23, 2012·6 cites·20 claims
- 1183US8097494B2Method of making an integrated circuit package with shielding via ring structureTANG JINBANG·Filed 2010·Granted Jan 17, 2012·6 cites·16 claims
- 1279US8093700B2Packaging millimeter wave modulesTANG JINBANG·Filed 2008·Granted Jan 10, 2012·8 cites·14 claims
- 1377US9666930B2Interface between a semiconductor die and a waveguide, where the interface is covered by a molding compoundFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted May 30, 2017·4 cites·19 claims
- 1477US8168464B2Microelectronic assembly with an embedded waveguide adapter and method for forming the sameTANG JINBANG·Filed 2010·Granted May 1, 2012·4 cites·20 claims
- 1577US2025096165A1Waveguide launcher in package based on high dielectric constant carrierNXP USA INC·Filed 2024·Application pending·0 cites
- 1676US9172143B2Electronic device module with integrated antenna structure, and related manufacturing methodTANG JINBANG·Filed 2013·Granted Oct 27, 2015·3 cites·20 claims
- 1774US9029202B2Method of forming a high thermal conducting semiconductor device packageFREESCALE SEMICONDUCTOR INC·Filed 2013·Granted May 12, 2015·3 cites·20 claims
- 1873US7812448B2Electronic device including a conductive stud over a bonding pad regionFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Oct 12, 2010·5 cites·20 claims
- 1972US10822224B2Packaged pressure sensor deviceNXP USA INC·Filed 2017·Granted Nov 3, 2020·1 cites·12 claims
- 2072US7772694B2Integrated circuit module and method of packaging sameFREESCALE SEMICONDUCTOR INC·Filed 2008·Granted Aug 10, 2010·4 cites·20 claims
- 2171US12027485B2Semiconductor device assembly and method thereforNXP USA INC·Filed 2022·Granted Jul 2, 2024·0 cites·20 claims
- 2268US8330239B2Shielding for a micro electro-mechanical device and method thereforTANG JINBANG·Filed 2009·Granted Dec 11, 2012·3 cites·13 claims
- 2368US8004068B2Shielded multi-layer package structuresFREESCALE SEMICONDUCTOR INC·Filed 2009·Granted Aug 23, 2011·3 cites·20 claims
- 2468US7977785B2Electronic device including dies, a dielectric layer, and a encapsulating layerFREESCALE SEMICONDUCTOR INC·Filed 2009·Granted Jul 12, 2011·3 cites·20 claims
- 2567US8461657B2Methods for forming a micro electro-mechanical deviceTANG JINBANG·Filed 2012·Granted Jun 11, 2013·1 cites·17 claims
- 2665US12176307B2Waveguide launcher in package based on high dielectric constant carrierNXP USA INC·Filed 2021·Granted Dec 24, 2024·0 cites·11 claims
- 2765US11502054B2Semiconductor device assembly and method thereforNXP USA INC·Filed 2020·Granted Nov 15, 2022·0 cites·11 claims
- 2864US11427464B2Packaged pressure sensor deviceNXP USA INC·Filed 2020·Granted Aug 30, 2022·0 cites·10 claims
- 2963US8290736B2Calibration standards and methods of their fabrication and useTANG JINBANG·Filed 2010·Granted Oct 16, 2012·1 cites·25 claims
- 3061US7869225B2Shielding structures for signal paths in electronic devicesFREESCALE SEMICONDUCTOR INC·Filed 2007·Granted Jan 11, 2011·1 cites·9 claims
- 3161US2025218976A1Electromagnetic shileding for leadless semiconductor packageNXP USA INC·Filed 2023·Application pending·0 cites
- 3261US2025218974A1Electromagnetic shileding for leadless semiconductor packageNXP USA INC·Filed 2023·Application pending·0 cites
- 3360US11557565B2Semiconductor device assembly and method thereforNXP USA INC·Filed 2020·Granted Jan 17, 2023·0 cites·20 claims
- 3458US12327959B2Compact connectors with integrated wireless communication elementsNXP USA INC·Filed 2023·Granted Jun 10, 2025·0 cites·22 claims
- 3556US7969164B2Method and apparatus for mini module EMI shielding evaluationFREESCALE SEMICONDUCTOR INC·Filed 2008·Granted Jun 28, 2011·2 cites·20 claims
- 3653US11862584B2High dielectric constant carrier based packaging with enhanced WG matching for 5G and 6G applicationsNXP USA INC·Filed 2021·Granted Jan 2, 2024·0 cites·20 claims
- 3753US8385084B2Shielding structures for signal paths in electronic devicesTANG JINBANG·Filed 2010·Granted Feb 26, 2013·0 cites·15 claims
- 3852US11101542B2Integrated radio package having a built-in multi directional antenna arrayNXP USA INC·Filed 2019·Granted Aug 24, 2021·0 cites·17 claims
- 3947US11121467B2Semiconductor package with compact antenna formed using three-dimensional additive manufacturing processNXP USA INC·Filed 2019·Granted Sep 14, 2021·0 cites·16 claims
- 4044US8530346B2Process of forming an electronic device including a conductive stud over a bonding pad regionRAMANATHAN LAKSHMI N·Filed 2010·Granted Sep 10, 2013·0 cites·20 claims
- 4144US2015187675A1Methods and apparatus for dissipating heat from a die assemblyTANG JINBANG·Filed 2013·Application pending·0 cites
- 4244US2008315376A1Conformal EMI shielding with enhanced reliabilityTANG JINBANG·Filed 2007·Application pending·0 cites
- 4344US2009072357A1Integrated shielding process for precision high density module packagingTANG JINBANG·Filed 2007·Application pending·0 cites
- 4442US9714879B2Electrically conductive barriers for integrated circuitsFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Jul 25, 2017·0 cites·21 claims
- 4539US2013330846A1Test vehicles for encapsulated semiconductor device packagesTANG JINBANG·Filed 2012·Application pending·0 cites
- 4638US10319689B2Antenna assembly for wafer level packagingFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Jun 11, 2019·0 cites·22 claims
- 4737US10134660B2Semiconductor device having corrugated leads and method for formingNXP USA INC·Filed 2017·Granted Nov 20, 2018·0 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →