Inventor · disambiguated record
Jia Yunn Ting
Also filed as: TING JIA YUNN
1 granted patent·2 pending applications·4 citations·filing 2017–2023
24Inventor score
Top patents by PatentIndex Score
3 records- 0178US10366943B2Packaged electronic device having stepped conductive structure and related methodsAMKOR TECHNOLOGY INC·Filed 2017·Granted Jul 30, 2019·4 cites·20 claims
- 0248US2024038637A1Clip structure for a packaged semiconductor deviceNexperia BV·Filed 2023·Application pending·0 cites
- 0345US2023411175A1Method for manufacturing a semiconductor package assembly as well as such semiconductor package assemblyNexperia BV·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →