Inventor · disambiguated record
Jian-Shin Tsai
Also filed as: TSAI JIAN-SHIN
20 granted patents·5 pending applications·46 citations·filing 2004–2025
92Inventor score
Top patents by PatentIndex Score
25 records- 0194US10134790B1Image sensor and fabrication method thereforTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 20, 2018·12 cites·20 claims
- 0286US8518818B2Reverse damascene processCHOU YOU-HUA·Filed 2011·Granted Aug 27, 2013·8 cites·11 claims
- 0382US9536834B2Reverse damascene processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jan 3, 2017·5 cites·20 claims
- 0478US10497729B2Image sensor having conductive layer and protective layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 3, 2019·2 cites·20 claims
- 0577US9224773B2Metal shielding layer in backside illumination image sensor chips and methods for forming the sameCHANG SHIH-CHIEH·Filed 2012·Granted Dec 29, 2015·1 cites·20 claims
- 0675US9607946B2Reverse damascene processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Mar 28, 2017·3 cites·20 claims
- 0772US11018176B2Metal shielding layer in backside illumination image sensor chips and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 25, 2021·0 cites·20 claims
- 0872US10062656B2Composite bond structure in stacked semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 28, 2018·2 cites·20 claims
- 0971US2025323144A1Conductive structures and methods of fabrication thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1070US9620555B2Metal shielding layer in backside illumination image sensor chips and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 11, 2017·1 cites·20 claims
- 1166US11189654B2Manufacturing methods of semiconductor image sensor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 30, 2021·0 cites·20 claims
- 1264US12362273B2Conductive structures and methods of fabrication thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 15, 2025·0 cites·20 claims
- 1362US10050102B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 14, 2018·1 cites·20 claims
- 1462US10038000B2Memory cell and fabricating method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jul 31, 2018·1 cites·20 claims
- 1560US7067409B2Plasma treatment at film layer to reduce sheet resistance and to improve via contact resistanceTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Jun 27, 2006·10 cites·25 claims
- 1659US8759928B2Image sensor cross-talk reduction system and methodCHANG SHIH-CHIEH·Filed 2012·Granted Jun 24, 2014·0 cites·20 claims
- 1757US10276621B2Metal shielding layer in backside illumination image sensor chips and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·0 cites·20 claims
- 1856US2024392463A1Semiconductor electrochemical plating apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1955US2024355870A1Capacitor structure including a buffer layer and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2053US2024387379A1Method and apparatus for copper plating in semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2147US2017250211A1Semiconductor image sensor device and manufacturing method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Application pending·0 cites
- 2244US10186454B2Semiconductor structure having etch stop layer and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 22, 2019·0 cites·19 claims
- 2344US7378744B2Plasma treatment at film layer to reduce sheet resistance and to improve via contact resistanceTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted May 27, 2008·0 cites·20 claims
- 2444US7358612B2Plasma treatment at film layer to reduce sheet resistance and to improve via contact resistanceTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Apr 15, 2008·0 cites·20 claims
- 2543US9847296B2Barrier layer and structure methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Dec 19, 2017·0 cites·19 claims
Join the waitlist — get patent alerts
Get an alert when Jian-Shin Tsai files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →