Inventor · disambiguated record
Jiun-Fang Wang
Also filed as: WANG JIUN-FANG
20 granted patents·5 pending applications·894 citations·filing 1993–2016
96Inventor score
Files withPROMOS TECHNOLOGIES INC10RODEL INC8ROHM & HAAS ELECT MATERIALS CMP HOLDINGS INC3ROHM & HAAS ELECT MAT1
Top patents by PatentIndex Score
25 records- 0197US5389352AOxide particles and method for producing themRODEL INC·Filed 1993·Granted Feb 14, 1995·117 cites·8 claims
- 0296US5693239APolishing slurries comprising two abrasive components and methods for their useRODEL INC·Filed 1995·Granted Dec 2, 1997·133 cites·20 claims
- 0394US6218305B1Composition and method for polishing a composite of silica and silicon nitrideRODEL INC·Filed 2000·Granted Apr 17, 2001·72 cites·8 claims
- 0492US5738800AComposition and method for polishing a composite of silica and silicon nitrideRODEL INC·Filed 1997·Granted Apr 14, 1998·117 cites·8 claims
- 0590US5769689ACompositions and methods for polishing silica, silicates, and silicon nitrideRODEL INC·Filed 1996·Granted Jun 23, 1998·97 cites·18 claims
- 0688US6632742B2Method for avoiding defects produced in the CMP processPROMOS TECHNOLOGIES INC·Filed 2001·Granted Oct 14, 2003·57 cites·6 claims
- 0787US6042741AComposition for polishing a composite of silica and silicon nitrideRODEL INC·Filed 1998·Granted Mar 28, 2000·74 cites·10 claims
- 0884US6432728B1Method for integration optimization by chemical mechanical planarization end-pointing techniquePROMOS TECHNOLOGIES INC·Filed 2000·Granted Aug 13, 2002·43 cites·11 claims
- 0978US6132637AComposition and method for polishing a composite of silica and silicon nitrideRODEL INC·Filed 1998·Granted Oct 17, 2000·44 cites·8 claims
- 1078US5756398AComposition and method for polishing a composite comprising titaniumRODEL INC·Filed 1997·Granted May 26, 1998·52 cites·17 claims
- 1176US6749484B2Chemical mechanical polishing (CMP) apparatus with temperature controlPROMOS TECHNOLOGIES INC·Filed 2002·Granted Jun 15, 2004·19 cites·6 claims
- 1269US9299585B2Method for chemical mechanical polishing substrates containing ruthenium and copperROHM & HAAS ELECT MAT·Filed 2014·Granted Mar 29, 2016·2 cites·10 claims
- 1368US6227949B1Two-slurry CMP polishing with different particle size abrasivesPROMOS TECHNOLOGIES INC·Filed 1999·Granted May 8, 2001·30 cites·5 claims
- 1455US6306022B1Chemical-mechanical polishing devicePROMOS TECHNOLOGIES INC·Filed 2000·Granted Oct 23, 2001·8 cites·9 claims
- 1555US6130163AStabilization of slurry used in chemical mechanical polishing of semiconductor wafers by adjustment of PH of deionized waterPROMOS TECHNOLOGIES INC·Filed 1999·Granted Oct 10, 2000·17 cites·3 claims
- 1652US6478659B2Chemical mechanical polishing method for slurry free fixed abrasive padsPROMOS TECHNOLOGIES INC·Filed 2000·Granted Nov 12, 2002·4 cites·7 claims
- 1738US11339308B2Chemical mechanical polishing methodROHM & HAAS ELECT MATERIALS CMP HOLDINGS INC·Filed 2016·Granted May 24, 2022·0 cites·10 claims
- 1838US10573524B2Method of chemical mechanical polishing a semiconductor substrateROHM & HAAS ELECT MATERIALS CMP HOLDINGS INC·Filed 2016·Granted Feb 25, 2020·0 cites·10 claims
- 1938US6053802AStabilization of slurry used in chemical mechanical polishing of semiconductor wafers by megasonic pulsePROMOS TECHNOLOGIES INC·Filed 1999·Granted Apr 25, 2000·8 cites·4 claims
- 2037US10557060B2Method of chemical mechanical polishing a substrateROHM & HAAS ELECT MATERIALS CMP HOLDINGS INC·Filed 2016·Granted Feb 11, 2020·0 cites·10 claims
- 2137US2003143849A1Method for avoiding defects produced in the CMP processPROMOS TECHNOLOGIES INC·Filed 2003·Application pending·0 cites
- 2234US2003190873A1Chemical-mechanical polishing platformFiled 2001·Application pending·0 cites
- 2333US2002182986A1Polishing pad with wear indicator for profile monitoring and controlling and method and apparatus for polishing using said padFiled 2001·Application pending·0 cites
- 2432US2003049935A1Method for removing residual particles from a polished surfacePROMOS TECHNOLOGIES INC·Filed 2002·Application pending·0 cites
- 2530US2002162572A1Method for removing residual particles from a polished surfaceFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →