Inventor · disambiguated record
Jinghe Wei
Also filed as: WEI JINGHE
2 granted patents·5 pending applications·22 citations·filing 2019–2021
52Inventor score
Top patents by PatentIndex Score
7 records- 0186US10742226B1Multi-channel high-precision ADC circuit with self-calibration of mismatch errorCHEN ZHENHAI·Filed 2019·Granted Aug 11, 2020·22 cites·10 claims
- 0243US11971446B2Interface system for interconnected die and MPU and communication method thereof58TH RESEARCH INSTITUTE OF CHINA ELECTRONICS TECH GROUP CORPORATION·Filed 2021·Granted Apr 30, 2024·0 cites·8 claims
- 0330US2022276671A1The Clock Domain System of Interconnected Dies and Its Management Methods58TH RESEARCH INSTITUTE OF CHINA ELECTRONICS TECH GROUP CORPORATION·Filed 2021·Application pending·0 cites
- 0430US2022276973A1Data transmission event used for interconnected dies58TH RESEARCH INSTITUTE OF CHINA ELECTRONICS TECH GROUP CORPORATION·Filed 2021·Application pending·0 cites
- 0527US2022276306A1Communication method and its system between interconnected die and dsp/fpga58TH RESEARCH INSTITUTE OF CHINA ELECTRONICS TECH GROUP CORPORATION·Filed 2021·Application pending·0 cites
- 0627US2022276982A1Interconnected Dies, Interconnected Microcomponents, Interconnected Microsystems and Their Communication Methods58TH RESEARCH INSTITUTE OF CHINA ELECTRONICS TECH GROUP CORPORATION·Filed 2021·Application pending·0 cites
- 0726US2022276677A1An Inter-Die High-Speed Expansion System And An Expansion Method Thereof58TH RESEARCH INSTITUTE OF CHINA ELECTRONICS TECH GROUP CORPORATION·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →