Inventor · disambiguated record
Jiun Yi Wu
Also filed as: WU JIUN YI
213 granted patents·90 pending applications·545 citations·filing 2006–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD271TAIWAN SEMICONDUCTOR MFG14YU CHEN-HUA5WU JIUN YI4WANG TSUNG-DING2
Top patents by PatentIndex Score
303 records- 0199US11784140B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 10, 2023·4 cites·20 claims
- 0298US9653442B2Integrated circuit package and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted May 16, 2017·40 cites·20 claims
- 0397US12057410B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 6, 2024·2 cites·20 claims
- 0497US12038599B2Photonic package and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 16, 2024·3 cites·20 claims
- 0597US11756945B2Semiconductor device package and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 12, 2023·3 cites·20 claims
- 0697US11664566B2Semiconductor device and method, where a dielectric material directly contacts a high-k dielectric material and first and second transmission linesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 30, 2023·2 cites·20 claims
- 0797US11605621B2Hybrid integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 14, 2023·3 cites·20 claims
- 0897US11101209B2Redistribution structures in semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 24, 2021·20 cites·19 claims
- 0997US10867982B1Hybrid integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·14 cites·20 claims
- 1097US9171790B2Package on package devices and methods of packaging semiconductor diesYU CHEN-HUA·Filed 2012·Granted Oct 27, 2015·40 cites·19 claims
- 1197US8642393B1Package on package devices and methods of forming sameYU CHEN-HUA·Filed 2012·Granted Feb 4, 2014·48 cites·19 claims
- 1296US11776886B2Symmetrical substrate for semiconductor packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 3, 2023·2 cites·20 claims
- 1396US9768090B2Substrate design for semiconductor packages and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Sep 19, 2017·24 cites·17 claims
- 1496US8698306B2Substrate contact openingYU CHEN-HUA·Filed 2010·Granted Apr 15, 2014·23 cites·20 claims
- 1595US12243843B2Integrated circuit package and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 4, 2025·2 cites·20 claims
- 1695US11398422B2Package structure and fabricating method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 26, 2022·3 cites·20 claims
- 1795US11258151B2Semiconductor device having a high-k dielectric material disposed beyween first and second transmission lines and a dielectric directly contacting the high-k dielectric materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 22, 2022·3 cites·20 claims
- 1895US10854552B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 1, 2020·9 cites·20 claims
- 1995US8823180B2Package on package devices and methods of packaging semiconductor diesWANG TSUNG-DING·Filed 2012·Granted Sep 2, 2014·30 cites·18 claims
- 2093US12451366B2Semiconductor package and method of forming thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 21, 2025·1 cites·20 claims
- 2193US12199080B2Electronics card including multi-chip moduleTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 14, 2025·1 cites·20 claims
- 2293US11855057B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·2 cites·20 claims
- 2393US11715686B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 1, 2023·2 cites·20 claims
- 2493US11658164B2Electronics card including multi-chip moduleTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 23, 2023·2 cites·20 claims
- 2593US11282779B2Package structure and fabricating method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 22, 2022·3 cites·20 claims
- 2693US10461022B2Semiconductor package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 29, 2019·8 cites·20 claims
- 2793US10319607B2Package-on-package structure with organic interposerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jun 11, 2019·16 cites·20 claims
- 2892US11705408B2Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 18, 2023·2 cites·20 claims
- 2992US10937736B2Hybrid integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 2, 2021·8 cites·20 claims
- 3092US9786976B2Transmission line design and method, where high-k dielectric surrounds the transmission line for increased isolationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 10, 2017·6 cites·20 claims
- 3192US9418928B2Protrusion bump pads for bond-on-trace processingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 16, 2016·9 cites·20 claims
- 3292US2025357231A1Warpage control of packages using embedded core frameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3391US11984374B2Warpage control of packages using embedded core frameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 14, 2024·1 cites·20 claims
- 3491US11894312B2Semiconductor packages and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 6, 2024·1 cites·20 claims
- 3591US11348874B2Semiconductor packages and forming methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 31, 2022·2 cites·20 claims
- 3691US11171090B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 9, 2021·6 cites·20 claims
- 3791US11088059B2Package structure, RDL structure comprising redistribution layer having ground plates and signal lines and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 10, 2021·5 cites·20 claims
- 3891US10555424B1Circuit board, semiconductor device including the same, and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 4, 2020·4 cites·10 claims
- 3991US9691636B2Interposer frame and method of manufacturing the sameWU JIUN YI·Filed 2012·Granted Jun 27, 2017·9 cites·20 claims
- 4091US9583474B2Package on packaging structure and methods of making sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 28, 2017·7 cites·20 claims
- 4190US12228776B2Package with integrated optical die and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 18, 2025·1 cites·20 claims
- 4290US12021053B2Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 25, 2024·1 cites·20 claims
- 4390US11705378B2Semiconductor packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 18, 2023·2 cites·20 claims
- 4490US11315862B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 26, 2022·2 cites·20 claims
- 4590US11069573B2Wafer level package structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 20, 2021·5 cites·20 claims
- 4690US10522495B2Protrusion bump pads for bond-on-trace processingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 31, 2019·4 cites·20 claims
- 4790US10163774B2Protrusion bump pads for bond-on-trace processingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 25, 2018·5 cites·20 claims
- 4890US9847320B2Semiconductor structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 19, 2017·7 cites·17 claims
- 4990US9337135B2Pop joint through interposerTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted May 10, 2016·10 cites·20 claims
- 5089US11482484B2Symmetrical substrate for semiconductor packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 25, 2022·2 cites·20 claims
Showing the top 50 of 303 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →