Inventor · disambiguated record
Jin-Feng Yang
Also filed as: YANG JIN-FENG
10 granted patents·51 citations·filing 2012–2020
85Inventor score
Technology areasH10W
Top patents by PatentIndex Score
10 records- 0189US10332862B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Jun 25, 2019·6 cites·30 claims
- 0289US8704341B2Semiconductor packages with thermal dissipation structures and EMI shieldingLIN I-CHIA·Filed 2012·Granted Apr 22, 2014·25 cites·19 claims
- 0387US9484313B2Semiconductor packages with thermal-enhanced conformal shielding and related methodsADVANCED SEMICONDUCTOR ENG·Filed 2013·Granted Nov 1, 2016·10 cites·14 claims
- 0485US10770369B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Sep 8, 2020·5 cites·16 claims
- 0585US9984983B2Semiconductor packages with thermal-enhanced conformal shielding and related methodsADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted May 29, 2018·5 cites·23 claims
- 0658US10840219B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Nov 17, 2020·0 cites·19 claims
- 0753US11482482B2Substrate structures, methods for forming the same and semiconductor device structures comprising the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Oct 25, 2022·0 cites·9 claims
- 0850US11024557B2Semiconductor package structure having vapor chamber thermally connected to a surface of the semiconductor dieADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Jun 1, 2021·0 cites·20 claims
- 0943US10410942B2Semiconductor device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Sep 10, 2019·0 cites·10 claims
- 1035US11075186B2Semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Jul 27, 2021·0 cites·23 claims
Join the waitlist — get patent alerts
Get an alert when Jin-Feng Yang files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →