Inventor · disambiguated record
Jinzhong Yao
Also filed as: YAO JINZHONG
31 granted patents·9 pending applications·103 citations·filing 2007–2021
96Inventor score
Top patents by PatentIndex Score
40 records- 0192US9324637B1Quad flat non-leaded semiconductor package with wettable flankFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Apr 26, 2016·11 cites·14 claims
- 0288US8901721B1Lead frame based semiconductor die packageBAI ZHIGANG·Filed 2013·Granted Dec 2, 2014·12 cites·20 claims
- 0387US10515880B2Lead frame with bendable leadsNXP USA INC·Filed 2019·Granted Dec 24, 2019·5 cites·20 claims
- 0486US10037935B1Lead frame with dummy leads for burr mitigation during encapsulationNXP USA INC·Filed 2017·Granted Jul 31, 2018·6 cites·20 claims
- 0586US9362211B1Exposed pad integrated circuit package with mold lockFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Jun 7, 2016·7 cites·19 claims
- 0685US8859339B2Mold chaseBAI ZHIGANG·Filed 2013·Granted Oct 14, 2014·7 cites·18 claims
- 0785US8525311B2Lead frame for semiconductor deviceBAI ZHIGANG·Filed 2011·Granted Sep 3, 2013·8 cites·18 claims
- 0884US8466539B2MRAM device and method of assembling sameLI JUN·Filed 2011·Granted Jun 18, 2013·8 cites·20 claims
- 0983US9190351B2Semiconductor device with webbing between leadsFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Nov 17, 2015·6 cites·18 claims
- 1077US10446476B2Packaged integrated circuit having stacked die and method for thereforNXP USA INC·Filed 2018·Granted Oct 15, 2019·3 cites·17 claims
- 1177US9589928B2Combined QFN and QFP semiconductor packageBAI ZHIGANG·Filed 2014·Granted Mar 7, 2017·4 cites·19 claims
- 1277US8716846B2Pressure sensor and method of packaging sameYAO JINZHONG·Filed 2011·Granted May 6, 2014·4 cites·7 claims
- 1375US9890034B2Cavity type pressure sensor deviceNXP USA INC·Filed 2016·Granted Feb 13, 2018·2 cites·6 claims
- 1472US8115288B2Lead frame for semiconductor deviceLU YONGSHENG·Filed 2011·Granted Feb 14, 2012·4 cites·8 claims
- 1571US7727817B2Semiconductor integrated circuit package and method of packaging semiconductor integrated circuitFREESCALE SEMICONDUCTOR INC·Filed 2009·Granted Jun 1, 2010·5 cites·6 claims
- 1670US10181434B1Lead frame for integrated circuit device having J-leads and gull wing leadsNXP USA INC·Filed 2018·Granted Jan 15, 2019·1 cites·16 claims
- 1769US9214447B2Non-leaded type semiconductor package and method of assembling sameBAI ZHIGANG·Filed 2014·Granted Dec 15, 2015·2 cites·12 claims
- 1869US8802474B1Pressure sensor and method of packaging sameYAO JINZHONG·Filed 2014·Granted Aug 12, 2014·2 cites·10 claims
- 1968US8709875B2Power device and method of packaging sameYAO JINZHONG·Filed 2012·Granted Apr 29, 2014·2 cites·13 claims
- 2062US9443746B2Floating mold tool for semicondcutor packagingBAI ZHIGANG·Filed 2014·Granted Sep 13, 2016·1 cites·5 claims
- 2160US8050048B2Lead frame with solder flow controlFREESCALE SEMICONDUCTOR INC·Filed 2008·Granted Nov 1, 2011·2 cites·12 claims
- 2251US11784112B2Integrated circuit package and method to manufacture the integrated circuit package to reduce bond wire defects in the integrated circuit packageNXP USA INC·Filed 2021·Granted Oct 10, 2023·0 cites·18 claims
- 2350US11417541B2Protection from metal migration on IC packagesNXP USA INC·Filed 2019·Granted Aug 16, 2022·0 cites·17 claims
- 2450US8202222B2Equal phase two-dimensional array probeYAO JINZHONG·Filed 2007·Granted Jun 19, 2012·1 cites·16 claims
- 2550US2014191383A1Power device and method of packaging sameYAO JINZHONG·Filed 2014·Application pending·0 cites
- 2646US8722465B1Method of assembling semiconductor device including insulating substrate and heat sinkLUO JUNHUA·Filed 2014·Granted May 13, 2014·0 cites·10 claims
- 2746US2015294929A1Semiconductor die package and method of assembling sameBAI ZHIGANG·Filed 2014·Application pending·0 cites
- 2845US2016056097A1Semiconductor device with inspectable solder jointsBAI ZHIGANG·Filed 2014·Application pending·0 cites
- 2944US10290593B2Method of assembling QFP type semiconductor deviceNXP USA INC·Filed 2017·Granted May 14, 2019·0 cites·8 claims
- 3044US8643170B2Method of assembling semiconductor device including insulating substrate and heat sinkLUO JUNHUA·Filed 2012·Granted Feb 4, 2014·0 cites·6 claims
- 3143US10217700B1Lead frame for integrated circuit device having J-leads and Gull Wing leadsNXP USA INC·Filed 2018·Granted Feb 26, 2019·0 cites·13 claims
- 3243US2015097278A1Surface mount semiconductor device with additional bottom face contactsBAI ZHIGANG·Filed 2014·Application pending·0 cites
- 3340US8216886B2Method for making semiconductor packageTIAN BIN·Filed 2011·Granted Jul 10, 2012·0 cites·15 claims
- 3439US8859336B2Method of packaging semiconductor die with cap elementLUO JUNHUA·Filed 2012·Granted Oct 14, 2014·0 cites·16 claims
- 3539US2014284806A1Semiconductor device die attachmentLUO JUNHUA·Filed 2014·Application pending·0 cites
- 3639US2011263077A1Method of assembling semiconductor devices including saw singulationFREESCALE SEMICONDUCTOR INC·Filed 2011·Application pending·0 cites
- 3739US2012139067A1Pressure sensor and method of packaging sameLO WAI YEW·Filed 2011·Application pending·0 cites
- 3839US2013249071A1Semiconductor device and method of assembling sameYAO JINZHONG·Filed 2013·Application pending·0 cites
- 3937US8481369B2Method of making semiconductor package with improved standoffLUO JUNHUA·Filed 2011·Granted Jul 9, 2013·0 cites·10 claims
- 4034US2010283135A1Lead frame for semiconductor deviceFREESCALE SEMICONDUCTOR INC·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →