Power device and method of packaging same

Abstract

A method of packaging a power semiconductor die includes providing a first lead frame of a dual gauge lead frame. The first lead frame includes a thick die pad. A tape is attached to a first side of the thick die pad and the power die is attached to a second side of the thick die pad. A second lead frame of the dual gauge lead frame is provided. The second lead frame has thin lead fingers. One end of the lead fingers is attached to an active surface of the power die such that the lead fingers are electrically connected to bonding pads of the power die. A molding compound is then dispensed onto a top surface of the dual gauge lead frame such that the molding compound covers the power die and the lead fingers.

1 - 13 . (canceled) 
     
     
         14 . A packaged power device, comprising:
 a power frame with a thick die pad;   a power semiconductor die attached to the thick die pad;   a lead frame having thin lead fingers, wherein a thickness of the lead frame is less than a thickness of the power frame, and wherein one end of each of the thin lead fingers is attached to a bonding pad on an active surface of the power semiconductor die with a conductive adhesive; and   a molding compound that covers the power frame, the lead frame, and the power semiconductor die.   
     
     
         15 . The packaged power device of  claim 14 , wherein the thickness of the power frame is about 30 mils and the thickness of the lead frame is about 10 mils. 
     
     
         16 . The packaged power device of  claim 14 , wherein the lead fingers are bent to form a Z-shape. 
     
     
         17 . The packaged power device of  claim 14 , further comprising a second die attached to a die pad of the lead frame and located adjacent to the power semiconductor die and power frame, wherein die bonding pads of the second die are electrically connected to small lead fingers of the lead frame and die bonding pads of the power semiconductor die with wires.