Inventor · disambiguated record
Xuesong Xu
Also filed as: XU XUESONG
15 granted patents·8 pending applications·42 citations·filing 2008–2025
89Inventor score
Files withYAO JINZHONG4FREESCALE SEMICONDUCTOR INC3UNIV ZHEJIANG TECHNOLOGY3HUAWEI TECH CO LTD2NXP USA INC2
Top patents by PatentIndex Score
23 records- 0187US10515880B2Lead frame with bendable leadsNXP USA INC·Filed 2019·Granted Dec 24, 2019·5 cites·20 claims
- 0285US8525311B2Lead frame for semiconductor deviceBAI ZHIGANG·Filed 2011·Granted Sep 3, 2013·8 cites·18 claims
- 0384US8466539B2MRAM device and method of assembling sameLI JUN·Filed 2011·Granted Jun 18, 2013·8 cites·20 claims
- 0477US8716846B2Pressure sensor and method of packaging sameYAO JINZHONG·Filed 2011·Granted May 6, 2014·4 cites·7 claims
- 0574US9391311B2Battery and mobile terminal for detecting battery cell deformationHUAWEI DEVICE CO LTD·Filed 2013·Granted Jul 12, 2016·1 cites·20 claims
- 0671US8692387B2Stacked die semiconductor packageQIU SHUNAN·Filed 2012·Granted Apr 8, 2014·5 cites·10 claims
- 0771US7727817B2Semiconductor integrated circuit package and method of packaging semiconductor integrated circuitFREESCALE SEMICONDUCTOR INC·Filed 2009·Granted Jun 1, 2010·5 cites·6 claims
- 0869US8802474B1Pressure sensor and method of packaging sameYAO JINZHONG·Filed 2014·Granted Aug 12, 2014·2 cites·10 claims
- 0968US8709875B2Power device and method of packaging sameYAO JINZHONG·Filed 2012·Granted Apr 29, 2014·2 cites·13 claims
- 1064US2024328636A1Electric boiler device based on utilization of residual energy of elevator, and control methodUNIV ZHEJIANG TECHNOLOGY·Filed 2023·Application pending·0 cites
- 1162US2025356260A1Federated object detection learning method based on representation enhancement and weighted aggregation under cloud-edge-terminal environmentUNIV ZHEJIANG TECHNOLOGY·Filed 2025·Application pending·0 cites
- 1260US8050048B2Lead frame with solder flow controlFREESCALE SEMICONDUCTOR INC·Filed 2008·Granted Nov 1, 2011·2 cites·12 claims
- 1359US2024403599A1Health state assessment method for equipment based on knowledge graph attention networkUNIV ZHEJIANG TECHNOLOGY·Filed 2023·Application pending·0 cites
- 1454US2024322705A1High-power four-quadrant converter systemHEFEI INST PHYSICAL SCI CAS·Filed 2024·Application pending·0 cites
- 1551US11784112B2Integrated circuit package and method to manufacture the integrated circuit package to reduce bond wire defects in the integrated circuit packageNXP USA INC·Filed 2021·Granted Oct 10, 2023·0 cites·18 claims
- 1650US2014191383A1Power device and method of packaging sameYAO JINZHONG·Filed 2014·Application pending·0 cites
- 1749US9416002B2Packaged semiconductor sensor device with lidXU NAN·Filed 2014·Granted Aug 16, 2016·0 cites·8 claims
- 1849US9285945B2Method and apparatus for displaying multi-task interfaceHUAWEI TECH CO LTD·Filed 2013·Granted Mar 15, 2016·0 cites·8 claims
- 1939US8643153B2Semiconductor device with staggered leadsQIU SHUNAN·Filed 2012·Granted Feb 4, 2014·0 cites·10 claims
- 2039US2012193737A1Mram device and method of assembling samePANG XINGSHOU·Filed 2011·Application pending·0 cites
- 2138US9071790B2Remote control method, remote controller, remote control response method and set-top boxHUAWEI TECH CO LTD·Filed 2012·Granted Jun 30, 2015·0 cites·19 claims
- 2235US2013264714A1Semiconductor device and method of assembling sameGONG GUO LIANG·Filed 2012·Application pending·0 cites
- 2335US2013037966A1Semiconductor device die bondingFREESCALE SEMICONDUCTOR INC·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →