Inventor · disambiguated record
Jiantao Zheng
Also filed as: ZHENG JIANTAO
13 granted patents·4 pending applications·167 citations·filing 2007–2023
92Inventor score
Top patents by PatentIndex Score
17 records- 0197US8299608B2Enhanced thermal management of 3-D stacked die packagingBARTLEY GERALD K·Filed 2010·Granted Oct 30, 2012·60 cites·23 claims
- 0293US9366591B2Determining magnitude of compressive loadingIBM·Filed 2014·Granted Jun 14, 2016·10 cites·12 claims
- 0391US7834442B2Electronic package method and structure with cure-melt hierarchyIBM·Filed 2007·Granted Nov 16, 2010·24 cites·20 claims
- 0490US7812438B2Via offsetting to reduce stress under the first level interconnect (FLI) in microelectronics packagingIBM·Filed 2008·Granted Oct 12, 2010·21 cites·11 claims
- 0589US9536805B2Power management integrated circuit (PMIC) integration into a processor packageQUALCOMM INC·Filed 2014·Granted Jan 3, 2017·12 cites·25 claims
- 0681US8794079B2Determining magnitude of compressive loadingBODENWEBER PAUL F·Filed 2011·Granted Aug 5, 2014·3 cites·9 claims
- 0781US7875972B2Semiconductor device assembly having a stress-relieving buffer layerIBM·Filed 2009·Granted Jan 25, 2011·10 cites·17 claims
- 0880US7733655B2Lid edge capping loadIBM·Filed 2008·Granted Jun 8, 2010·11 cites·16 claims
- 0979US9048245B2Method for shaping a laminate substrateBLACKSHEAR EDMUND·Filed 2012·Granted Jun 2, 2015·5 cites·20 claims
- 1072US8232636B2Reliability enhancement of metal thermal interfaceHUMENIK JAMES N·Filed 2010·Granted Jul 31, 2012·5 cites·24 claims
- 1170US9059240B2Fixture for shaping a laminate substrateBLACKSHEAR EDMUND D·Filed 2012·Granted Jun 16, 2015·3 cites·25 claims
- 1268US8717043B2Determining thermal interface material (TIM) thickness changeBODENWEBER PAUL F·Filed 2011·Granted May 6, 2014·2 cites·19 claims
- 1364US9543253B2Method for shaping a laminate substrateGLOBALFOUNDRIES INC·Filed 2015·Granted Jan 10, 2017·1 cites·20 claims
- 1454US2024167453A1Modeling method and device of floating wind turbineUNIV NORTH CHINA ELECTRIC POWER·Filed 2023·Application pending·0 cites
- 1546US2023037617A1Packaging structure, electronic device, and chip packaging methodHUAWEI TECH CO LTD·Filed 2022·Application pending·0 cites
- 1644US2016095225A1Inductor system for multi-phase power management integrated circuitsQUALCOMM INC·Filed 2014·Application pending·0 cites
- 1736US2016006149A1Looped socket pinQUALCOMM INC·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →