Inventor · disambiguated record
John J. Beatty
Also filed as: BEATTY JOHN · BEATTY JOHN J
14 granted patents·4 pending applications·45 citations·filing 2004–2023
88Inventor score
Top patents by PatentIndex Score
18 records- 0190US11328978B2Package with a highly conductive layer deposited on die using throughput additive deposition prior to TIM1 dispenseINTEL CORP·Filed 2017·Granted May 10, 2022·6 cites·25 claims
- 0285US9806002B2Multi-reference integrated heat spreader (IHS) solutionINTEL CORP·Filed 2015·Granted Oct 31, 2017·7 cites·23 claims
- 0378US7183493B2Electronic assembly having multi-material interconnectsINTEL CORP·Filed 2004·Granted Feb 27, 2007·24 cites·30 claims
- 0475US7179093B2Retractable ledge socketINTEL CORP·Filed 2005·Granted Feb 20, 2007·6 cites·11 claims
- 0570US11776869B2Package with a highly conductive layer deposited on die using throughput additive deposition prior to TIM1 dispenseINTEL CORP·Filed 2022·Granted Oct 3, 2023·0 cites·20 claims
- 0665US11328979B2Substrate integrated posts and heat spreader customization for enhanced package thermomechanicsINTEL CORP·Filed 2017·Granted May 10, 2022·1 cites·25 claims
- 0761US10643938B2Standoff spacers for managing bondline thickness in microelectronic packagesINTEL CORP·Filed 2017·Granted May 5, 2020·1 cites·22 claims
- 0859US11652018B2Heat spreader edge standoffs for managing bondline thickness in microelectronic packagesINTEL CORP·Filed 2021·Granted May 16, 2023·0 cites·20 claims
- 0953US2023395460A1Backside integrated torsion loading mechanismINTEL CORP·Filed 2023·Application pending·0 cites
- 1049US11652061B2Package-level backside metallization (BSM)INTEL CORP·Filed 2019·Granted May 16, 2023·0 cites·20 claims
- 1148US10290592B2Semiconductor package, and a method for forming a semiconductor packageINTEL CORP·Filed 2017·Granted May 14, 2019·0 cites·24 claims
- 1247US11062970B2Heat spreader edge standoffs for managing bondline thickness in microelectronic packagesINTEL CORP·Filed 2017·Granted Jul 13, 2021·0 cites·10 claims
- 1347US7421778B2Method of making an electronic assemblyINTEL CORP·Filed 2006·Granted Sep 9, 2008·0 cites·5 claims
- 1443US8709869B2Method of manufacturing a plurality of electronic assembliesBEATTY JOHN J·Filed 2012·Granted Apr 29, 2014·0 cites·10 claims
- 1537US11676873B2Semiconductor package having sealant bridgeINTEL CORP·Filed 2017·Granted Jun 13, 2023·0 cites·17 claims
- 1637US2017287664A1Thermally activated switchINTEL CORP·Filed 2016·Application pending·0 cites
- 1733US2006019468A1Method of manufacturing a plurality of electronic assembliesBEATTY JOHN J·Filed 2004·Application pending·0 cites
- 1831US2019043778A1Swaging process for complex integrated heat spreadersINTEL CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →