Inventor · disambiguated record
Josef Boeck
Also filed as: BOECK JOSEF
20 granted patents·3 pending applications·211 citations·filing 2000–2021
94Inventor score
Top patents by PatentIndex Score
23 records- 0197US9583811B2Transition between a plastic waveguide and a semiconductor chip, where the semiconductor chip is embedded and encapsulated within a mold compoundINFINEON TECHNOLOGIES AG·Filed 2014·Granted Feb 28, 2017·41 cites·22 claims
- 0296US8451618B2Integrated antennas in wafer level packageBOECK JOSEF·Filed 2010·Granted May 28, 2013·43 cites·12 claims
- 0389US6770953B2Bipolar transistorINFINEON TECHNOLOGIES AG·Filed 2001·Granted Aug 3, 2004·65 cites·15 claims
- 0488US9910145B2Wireless communication system, a radar system and a method for determining a position information of an objectINFINEON TECHNOLOGIES AG·Filed 2013·Granted Mar 6, 2018·7 cites·19 claims
- 0588US8125072B2Device including a ring-shaped metal structure and methodLACHNER RUDOLF·Filed 2009·Granted Feb 28, 2012·13 cites·18 claims
- 0688US8067290B2Bipolar transistor with base-collector-isolation without dielectricBOECK JOSEF·Filed 2009·Granted Nov 29, 2011·19 cites·12 claims
- 0783US9064787B2Integrated antennas in wafer level packageINFINEON TECHNOLOGIES AG·Filed 2013·Granted Jun 23, 2015·5 cites·18 claims
- 0876US8115274B2Fuse structure and method for manufacturing sameBOECK JOSEF·Filed 2007·Granted Feb 14, 2012·8 cites·20 claims
- 0969US11879966B2Transmission of wireless signal having information on a local oscillator signalINFINEON TECHNOLOGIES AG·Filed 2021·Granted Jan 23, 2024·0 cites·25 claims
- 1066US9337159B2Semiconductor package with integrated microwave componentINFINEON TECHNOLOGIES AG·Filed 2013·Granted May 10, 2016·1 cites·12 claims
- 1163US9761701B2Bipolar transistorINFINEON TECHNOLOGIES AG·Filed 2014·Granted Sep 12, 2017·1 cites·15 claims
- 1261US7989919B2Capacitor arrangement and method for making sameINFINEON TECHNOLOGIES AG·Filed 2009·Granted Aug 2, 2011·2 cites·13 claims
- 1356US9922946B2Method of manufacturing a semiconductor package having a semiconductor chip and a microwave componentINFINEON TECHNOLOGIES AG·Filed 2017·Granted Mar 20, 2018·0 cites·20 claims
- 1455US7005337B2Method for a parallel production of an MOS transistor and a bipolar transistorINFINEON TECHNOLOGIES AG·Filed 2004·Granted Feb 28, 2006·6 cites·20 claims
- 1554US9653426B2Method of manufacturing a semiconductor package having an integrated microwave componentINFINEON TECHNOLOGIES AG·Filed 2016·Granted May 16, 2017·0 cites·7 claims
- 1653US9871125B2Bipolar transistorINFINEON TECHNOLOGIES AG·Filed 2017·Granted Jan 16, 2018·0 cites·17 claims
- 1753US2018180730A1Transmission of wireless signal having information on a local oscillator signalINFINEON TECHNOLOGIES AG·Filed 2018·Application pending·0 cites
- 1852US8329532B2Process for the simultaneous deposition of crystalline and amorphous layers with dopingSCHAEFER HERBERT·Filed 2011·Granted Dec 11, 2012·0 cites·20 claims
- 1948US9263362B2Method of forming a ring-shaped metal structureLACHNER RUDOLF·Filed 2012·Granted Feb 16, 2016·0 cites·9 claims
- 2047US8878335B2Method and system for providing fusing after packaging of semiconductor devicesMEYER THORSTEN·Filed 2010·Granted Nov 4, 2014·0 cites·5 claims
- 2141US2007222032A1Bipolar transistor and method for producing a bipolar transistorINFINEON TECHNOLOGIES AG·Filed 2007·Application pending·0 cites
- 2238US2020043562A1Method for programming a one-time programmable structure, semiconductor component and radio frequency componentINFINEON TECHNOLOGIES AG·Filed 2019·Application pending·0 cites
- 2335US6642606B1Method for producing siliconized polysilicon contacts in integrated semiconductor structuresINFINEON TECHNOLOGIES AG·Filed 2000·Granted Nov 4, 2003·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →